Polishing pad having grooves on bottom surface of top layer

Patent metadata

Field	Value
Publication number	US-10201887-B2
Application number	US-201715473967-A
Country	US
Kind code	B2
Filing date	Mar 30, 2017
Priority date	Mar 30, 2017
Publication date	Feb 12, 2019
Grant date	Feb 12, 2019

Abstract

A polishing pad is provided. The polishing pad includes a base layer, a top layer, and multiple grooves. The top layer is located over the base layer and has a polishing surface and a bottom surface opposite to each other. The bottom surface is connected to the base layer. The grooves are formed on the bottom surface of the top layer.

First claim

What is claimed is:

1. A polishing pad, comprising:
a base layer;
a top layer over the base layer, wherein the top layer has a polishing surface and a bottom surface opposite to each other, and the bottom surface is connected to the base layer; and
a plurality of grooves formed on the bottom surface of the top layer, wherein ends of the grooves are separated from a periphery of the bottom surface by a distance.

2. The polishing pad as claimed in claim 1 , wherein the bottom surface of the top layer is separated into a plurality of portions by the grooves.

3. The polishing pad as claimed in claim 2 , wherein the bottom surface of the top layer includes a plurality of enclosing portions formed by the grooves, and dimensions of the enclosing portions are substantially the same.

4. The polishing pad as claimed in claim 1 , wherein the bottom surface of the top layer includes a central region and an edge region surrounding the central region, and the grooves are evenly distributed in the central region.

5. The polishing pad as claimed in claim 1 , wherein the grooves are evenly distributed in an annular region in the bottom surface of the top layer.

6. The polishing pad as claimed in claim 1 , wherein the depth of the grooves is about one half of the thickness of the top layer.

7. The polishing pad as claimed in claim 1 , wherein the material of the top layer is harder than that of the base layer.

8. The polishing pad as claimed in claim 7 , wherein the top layer comprises a wear-resistant material and the base layer comprises a felt material or a high porosity polymer foam.

9. The polishing pad as claimed in claim 1 , further comprising a plurality of surface grooves formed on the polishing surface of the top layer.

10. A polishing pad, comprising:
a base layer;
a top layer over the base layer, wherein the top layer has a polishing surface and a bottom surface opposite to each other, and wherein the bottom surface is connected to the base layer and includes a central region and an edge region surrounding the central region; and
a plurality of grooves evenly distributed in the central region, so that the bottom surface of the top layer is separated into a plurality of portions, wherein ends of the grooves are separated from a periphery of the bottom surface by a distance.

11. The polishing pad as claimed in claim 10 , wherein the bottom surface of the top layer includes a plurality of enclosing portions formed by the grooves, and dimensions of the enclosing portions are substantially the same.

12. The polishing pad as claimed in claim 10 , wherein the top layer is circular, and the length of the grooves is less than the diameter of the top layer.

13. The polishing pad as claimed in claim 10 , wherein the grooves comprise a plurality of first grooves extending in a first direction and a plurality of second grooves extending in a second direction that is different from the first direction.

14. The polishing pad as claimed in claim 13 , wherein the first grooves and the second grooves cross over each other.

15. A polishing pad, comprising:
a base layer;
a top layer over the base layer, wherein the top layer has a polishing surface and a bottom surface opposite to each other, and the bottom surface is connected to the base layer; and
a plurality of grooves formed on the bottom surface of the top layer, wherein the grooves comprise a plurality of first grooves extending in a first direction and a plurality of second grooves extending in a second direction that is different from the first direction, wherein the first grooves and the second grooves intersect, but do not cross over each other.

16. The polishing pad as claimed in claim 10 , wherein the grooves comprise a plurality of first grooves arranged in concentric circles, a plurality of second grooves arranged radially and passing through the center of the concentric circles, and a plurality of third grooves arranged radially, between the second grooves, and extending from the inner first grooves to the outer first grooves.

17. The polishing pad as claimed in claim 16 , wherein the distribution density of the third grooves located on the outer side of the central region is higher than the distribution density of the third grooves located on the inner side of the central region.

18. The polishing pad as claimed in claim 16 , wherein the portions formed by the grooves have a sector or fan shape and dimensions of the portions are substantially the same.

19. The polishing pad as claimed in claim 15 , wherein ends of the first grooves and ends of the second grooves are separated from a periphery of the bottom surface by a distance.

20. The polishing pad as claimed in claim 15 , wherein the bottom surface of the top layer includes a central region and an edge region surrounding the central region, and the first grooves and the second grooves are evenly distributed in the central region.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Chih-Hung
• Chen Kei-Wei

Classifications

• H10P72/0418

  for etching · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B37/22

  characterised by a multi-layered structure · CPC title

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title