Process of applying a conductive composite, transfer assembly having a conductive composite, and a garment with a conductive composite

US10201194B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10201194-B2
Application numberUS-201514709169-A
CountryUS
Kind codeB2
Filing dateMay 11, 2015
Priority dateMay 11, 2015
Publication dateFeb 12, 2019
Grant dateFeb 12, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate. The transfer substrate is capable of permitting heating of the conductive composite through the transfer substrate, the heating being at a temperature that permits applying the conductive composite to the flexible material.

First claim

Opening claim text (preview).

What is claimed is: 1. A process of applying a conductive composite on a flexible material of a garment, comprising: positioning the conductive composite relative to the flexible material, the conductive composite having (a) a resin matrix and conductive filler, said conductive filler being conductive particles having a morphology that is dendrites, and (b) a resistivity of less than 0.05 ohm-cm; and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material, further comprising positioning the conductive composite in contact with a contact terminal and making an electrical connection between the conductive composite and the contact terminal during the heating of the conductive composite; wherein the conductive composite includes ethylene-vinyl acetate (EVA), acrylic, polyvinyl acetate, ethylene acrylate copolymer, polyamide, polyethylene, polypropylene, polyester, polyurethane, styrene block copolymer, polycarbonate, fluorinated ethylene propylene (FEP), tetrafluoroethylene/hexafluoro-propylene/vinylidene fluoride terpolymer (THY), or silicone. 2. The process of claim 1 , wherein the heating by the iron is within a temperature range of between 180° C. and 220° C. 3. The process of claim 1 , wherein the heating by the iron is within a temperature range between 220° C. and 360° C. 4. The process of claim 1 , wherein the applying of the conductive composite forms at least a portion of a circuit. 5. The process of claim 1 , wherein the applying of the conductive composite forms at least a portion of a sensor. 6. The process of claim 1 , wherein the conductive filler includes a binary combination of copper and tin. 7. The process of claim 1 , wherein the conductive composite has at least 1% of the conductivity of the international annealed copper standard. 8. The process of claim 1 , wherein the conductive composite has at least 10% of the conductivity of the international annealed copper standard. 9. The process of claim 1 , wherein the conductive composite is polyvinyl-acetate-based. 10. The process of claim 1 , wherein the conductive composite is polyethylene-vinyl-acetate-based. 11. The process of claim 1 , wherein the flexible material comprises cotton. 12. The process of claim 1 , wherein the flexible material comprises paper. 13. The process of claim 1 , wherein the flexible material is a shirt. 14. A process of applying a conductive composite to clothing, comprising: positioning the conductive composite relative to the clothing, said conductive composite having (a) a resin matrix and conductive filler, said conductive filler being conductive particles having a morphology that is dendrites, and (b) a resistivity of less than 0.05 ohm-cm; and heating the conductive composite thereby applying the conductive composite on the clothing, further comprising positioning the conductive composite in contact with a contact terminal and making an electrical connection between the conductive composite and the contact terminal during the heating of the conductive composite; wherein the conductive composite includes ethylene-vinyl acetate (EVA), acrylic, polyvinyl acetate, ethylene acrylate copolymer, polyamide, polyethylene, polypropylene, polyester, polyurethane, styrene block copolymer, polycarbonate, fluorinated ethylene propylene (FEP), tetrafluoroethylene/hexafluoro-propylene/vinylidene fluoride terpolymer (THY), or silicone. 15. A garment, comprising: a flexible material; and a conductive composite positioned directly on the flexible material, the conductive composite having (a) a resin matrix and conductive filler, said conductive filler being conductive particles having a morphology that is dendrites, and (b) a resistivity of less than 0.05 ohm-cm; attaching said conductive composite on the flexible material by heating process, further comprising positioning the conductive composite in contact with a contact terminal and making an electrical connection between the conductive composite and the contact terminal during the heating of the conductive composite; wherein the conductive composite includes ethylene-vinyl acetate (EVA), acrylic, polyvinyl acetate, ethylene acrylate copolymer, polyamide, polyethylene, polypropylene, polyester, polyurethane, styrene block copolymer, polycarbonate, fluorinated ethylene propylene (FEP), tetrafluoroethylene/hexafluoro-propylene/vinylidene fluoride terpolymer (THY), or silicone.

Assignees

Inventors

Classifications

  • the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

  • with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles · CPC title

  • the conductive material comprising metals or alloys · CPC title

  • A41D1/002Primary

    adapted to accommodate electronic equipment (patients' garments for medical monitoring A41D13/1281; luminous ornaments A41D27/085) · CPC title

  • Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process · CPC title

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Frequently asked questions

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What does patent US10201194B2 cover?
Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive com…
Who is the assignee on this patent?
Tyco Electronics Corp, Te Connectivity Corp
What technology area does this patent fall under?
Primary CPC classification A41D1/002. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Feb 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).