Server chassis with a liquid cooling enablement module in an input/output module bay

Patent metadata

Field	Value
Publication number	US-10201115-B2
Application number	US-201715470316-A
Country	US
Kind code	B2
Filing date	Mar 27, 2017
Priority date	Mar 27, 2017
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

A chassis includes a compute device and a liquid cooling enablement module. The compute device includes a processor, a cold plate, and first cold and hot liquid lines. The first cold liquid line directs cool liquid from a first cold liquid interconnect of the compute device to the cold plate. The first hot liquid line directs heated liquid from the cold plate to a first hot liquid interconnect of the compute device. The liquid cooling enablement module is a modular self-contained component, and includes a second cold liquid interconnect, and a second hot liquid interconnect. The second cold liquid interconnect directs the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect. The second hot liquid interconnect directs the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.

First claim

What is claimed is:

1. A chassis comprising:
a compute device located within a front portion of the chassis, the compute device including:
a processor;
a cold plate in physical communication with the processor;
a cold liquid interconnect coupled to a cold liquid interconnect of a liquid cooling enablement module located in an input/output module bay in a rear portion of the chassis, the cold liquid interconnect to direct liquid into the compute device, wherein the liquid cooling enablement module is a modular self-contained liquid cooling system;
a cold liquid line coupled to the cold plate and to the cold liquid interconnect, the cold liquid line to direct cool liquid from the cold liquid interconnect to the cold plate, wherein the cold plate utilizes the liquid to remove heat from the processor;
a hot liquid interconnect coupled to a hot liquid interconnect of the liquid cooling enablement module, the hot liquid interconnect to direct heated liquid from the compute device; and
a hot liquid line coupled to the cold plate and to the hot liquid interconnect, the hot liquid line to direct the heated liquid from the cold plate to the hot liquid interconnect.

2. The chassis of claim 1 wherein the compute device further comprises:
a plurality of peripheral component interconnect express devices in communication with the processor, the peripheral component interconnect express devices to be cooled via air pulled from a front panel of the chassis across the peripheral component interconnect express devices.

3. The chassis of claim 1 wherein the compute device further comprises:
a communication fabric in communication with the processor, the communication fabric to connect with an input/output module in the rear portion of the chassis.

4. The chassis of claim 1 wherein the compute device further comprises:
a back panel; and
a plurality of opening in the back panel, the openings to enable connections between components of the compute device and input/output modules in the rear portion of the chassis.

5. The chassis of claim 4 wherein the cold liquid interconnect is coupled to the cold liquid interconnect of the liquid cooling enablement module via a first opening of the openings.

6. The chassis of claim 5 wherein the hot liquid interconnect is coupled to the hot liquid interconnect of the liquid cooling enablement module via a second opening of the openings.

7. A chassis comprising:
a liquid cooling enablement module located within an input/output module bay of a back portion of the chassis, the liquid cooling enablement module being a modular self-contained component, the liquid cooling enablement module including:
a first cold liquid interconnect coupled to a second cold liquid interconnect of a first compute device, the first cold liquid interconnect to direct liquid from the liquid cooling enablement module to the second cold liquid interconnect of the first compute device; and
a first hot liquid interconnect coupled to a second hot liquid interconnect of the first compute device, the first hot liquid interconnect to direct the liquid from the second hot liquid interconnect of the first compute device into the liquid cooling enablement module.

8. The chassis of claim 7 wherein the liquid cooling enablement module further comprises:
a third cold liquid interconnect coupled to a fourth cold liquid interconnect of a second compute device, the third cold liquid interconnect to direct the liquid to the second compute device via the fourth cold liquid interconnect; and
a cold liquid manifold coupled to the second and third cold liquid interconnects and to a cold liquid line of the liquid cooling enablement module, the cold liquid manifold to direct the liquid from the cold liquid line to both the second and third cold liquid interconnects.

9. The chassis of claim 7 wherein the liquid cooling enablement module further comprises:
a third hot liquid interconnect coupled to a fourth hot liquid interconnect of a second compute device, the third hot liquid interconnect to direct the heated liquid from the second compute device via the fourth cold liquid interconnect; and
a hot liquid manifold coupled to the second and third hot liquid interconnects and to a hot liquid line of the liquid cooling enablement module, the hot liquid manifold to direct the liquid from both of the second and third hot liquid interconnects to the hot liquid line.

10. The chassis of claim 7 further comprising:
a fan in the back portion, the fan to pull air across components of the first compute device to provide air cooling of the components.

11. The chassis of claim 10 further comprising:
a bulkhead in physical communication with both the front and back portions, the bulkhead to direct flow from the first compute device to the fan.

12. The chassis of claim 11 wherein the bulkhead further comprises:
a plurality of openings, the openings to enable connections between components of the first compute device and first and second input/output modules in the back portion of the chassis, wherein the first cold liquid interconnect is coupled to the second cold liquid interconnect of the first compute device through a first opening of the openings.

13. The chassis of claim 12 wherein the first hot liquid interconnect is coupled to the second hot liquid interconnect of the first compute device through a second opening of the openings.

14. A chassis comprising:
a compute device located within a front portion of the chassis, the compute device includes:
a processor;
a cold plate in physical communication with the processor;
a first cold liquid line coupled to the cold plate, the first cold liquid line to direct cool liquid from a first cold liquid interconnect of the compute device to the cold plate, wherein the cold plate utilizes the liquid to remove heat from the processor; and
a first hot liquid line coupled to the cold plate, the first hot liquid line to direct heated liquid from the cold plate to a first hot liquid interconnect of the compute device; and

a liquid cooling enablement module located within an input/output device bay a back portion of the chassis, wherein the liquid cooling enablement module is a modular self-contained component, the liquid cooling enablement module includes:
a second cold liquid interconnect coupled to the first cold liquid interconnect, the second cold liquid interconnect to direct the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect; and
a second hot liquid interconnect coupled to the first hot liquid interconnect, the second hot liquid interconnect to direct the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.

15. The chassis of claim 14 wherein the liquid cooling enablement module further comprises:
a third cold liquid interconnect coupled to a fourth cold liquid interconnect of a second compute device, the third cold liquid interconnect to direct the liquid to the second compute device via the fourth cold liquid interconnect; and
a cold liquid manifold coupled to the second and third cold liquid interconnects and to a second cold liquid line of the liquid cooling enablement module, the cold liquid manifold to direct the liquid from the second cold liquid line to both the second and third cold liquid interconnects.

16. The chassis of claim 14 wherein the liquid cooling enablement module further comprises:
a third hot liquid interconnect coupled to a fourth hot liquid interconnect of a second compute device, the third

Assignees

• Dell Products Lp

Inventors

• Johnson Robert W
• Curtis Robert Boyd

Classifications

• H05K7/20572

  within cabinets for removing heat from sub-racks, e.g. plenum · CPC title

• H05K7/20636

  within sub-racks for removing heat from electronic boards · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20645

  within cabinets for removing heat from sub-racks · CPC title

• H05K7/20781 Primary

  within cabinets for removing heat from server blades · CPC title