Integrated system of an electronic module and conductive fabric and method of making the same

Patent metadata

Field	Value
Publication number	US-10201080-B2
Application number	US-201414574944-A
Country	US
Kind code	B2
Filing date	Dec 18, 2014
Priority date	Dec 18, 2014
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.

First claim

What is claimed is:

1. An electronic module assembly comprising:
a non-conductive fabric;
a conductive fabric covering part of a first side of the non-conductive fabric forming covered portions of the non-conductive fabric;
an electronics module including walls defining a plurality of through holes, wherein the electronics module is disposed on the conductive fabric; and
a plurality of fasteners, each passing through a through hole of the plurality of through holes and the conductive fabric, wherein
the plurality of fasteners is configured to electronically couple the electronics module to the conductive fabric, and
the electronics module extends over an uncovered portion of the non-conductive fabric forming a space between a bottom surface of the electronics module and the uncovered portion of the non-conductive fabric upon coupling, wherein the uncovered portion is a portion of the non-conductive fabric that is not covered by the conductive fabric.

2. The module of claim 1 , wherein the walls are plated with a conductive material.

3. The module of claim 1 , wherein the electronics module further comprises a top surface, wherein
a portion of the top surface and a portion of the bottom surface are plated with a conductive material at least at positions surrounding the plurality of through holes.

4. The module of claim 3 , the fastener comprises a head and a second end, and the head is configured to contact the portion of the top surface surrounding the plurality of through holes that are plated with a conductive material.

5. The module of claim 4 , wherein the second end of the fastener is configured to accept a mating element to facilitate clamping.

6. The module of claim 1 , wherein the conductive fabric is attached to the non-conductive fabric using one or more of stitching or gluing.

7. The module of claim 1 , wherein the fastener is a metal fastener.

8. The module of claim 1 , wherein the fastener includes a metal coating.

9. The module of claim 1 , wherein the conductive fabric is formed from a metal plated yarn.

10. The module of claim 1 , wherein the each fastener of the plurality of fasteners passes through the non-conductive fabric.

11. The module of claim 1 , wherein the plurality of through holes in the electronics module is preformed prior to coupling.

12. The module of claim 1 , wherein the non-conductive fabric is flexible.

13. The module of claim 12 , wherein the conductive fabric is flexible.

14. The module of claim 1 , wherein the conductive fabric is composed of a plurality of conductive woven fibers.

Assignees

• Flextronics Ap Llc

Inventors

• Liu Weifeng
• Mohammed Anwar
• Kurwa Murad

Classifications

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H05K3/42

  Plated through-holes {or plated via connections} · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title