High-speed connector inserts and cables

US10199778B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10199778-B2
Application numberUS-201615201580-A
CountryUS
Kind codeB2
Filing dateJul 4, 2016
Priority dateJun 30, 2010
Publication dateFeb 5, 2019
Grant dateFeb 5, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a connector insert comprising: receiving a printed circuit board comprising a plurality of traces and a solder area on a first side; attaching an integrated circuit to the printed circuit board, the integrated circuit electrically connected to a trace on the printed circuit board; receiving a cable comprising a plurality of wires and a shield layer, and coupling at least one of the wires of the cable to the printed circuit board; providing a plurality of contacts, wherein a contact in the plurality of contacts is electrically connected to the trace on the printed circuit board; and providing an insert shield around the printed circuit board and the integrated circuit and electrically connecting the insert shield to the shield layer of the cable, the solder area on the printed circuit board, and thermally coupling the insert shield to the integrated circuit. 2. The method of claim 1 wherein the printed circuit board further comprises a second solder area on a second side, the second solder area attached to the insert shield. 3. The method of claim 1 wherein the plurality of contacts are attached to the printed circuit board. 4. The method of claim 1 further comprising crimping a cap over a connection between the shield layer and the insert shield wherein the cap is crimped over the connection between the shield layer and the insert shield. 5. The method of claim 1 wherein the cable shield layer comprises a plurality of fibers. 6. The method of claim 5 wherein the plurality of fibers comprises aramid fibers. 7. A connector insert and cable apparatus comprising: an insert shield; a cable comprising a plurality of wires and a shield layer, the shield layer electrically connected to the insert shield; a printed circuit board coupled to at least one of the wires, the printed circuit board having a solder area on a first side, the solder area electrically connected to the insert shield; a plurality of contacts, wherein a contact in the plurality of contacts is electrically connected to a trace on the printed circuit board; and an integrated circuit attached to the printed circuit board and electrically connected to the trace on the printed circuit board and thermally coupled to the insert shield, the insert shield around the printed circuit board and the integrated circuit. 8. The connector insert and cable apparatus of claim 7 wherein the cable shield layer is soldered to the insert shield. 9. The connector insert and cable apparatus of claim 7 wherein the printed circuit board further comprises a second solder area on a second side, the second solder area attached to the insert shield. 10. The connector insert and cable apparatus of claim 7 wherein the plurality of contacts are attached to the printed circuit board. 11. The connector insert and cable apparatus of claim 7 further comprising a cap over a connection between the shield layer and the insert shield wherein the cap is crimped over the connection between the shield layer and the insert shield. 12. The connector insert and cable apparatus of claim 11 wherein the cap is soldered to the connector insert. 13. The connector insert and cable apparatus of claim 7 further comprising: a plastic housing covering a portion of the insert shield. 14. The connector insert and cable apparatus of claim 7 wherein the cable shield layer comprises a plurality of fibers. 15. The connector insert and cable apparatus of claim 14 wherein the plurality of fibers comprises aramid fibers. 16. The connector insert and cable apparatus of claim 7 wherein the integrated circuit is thermally coupled to the insert shield using a thermally conductive material. 17. A connector insert and cable apparatus comprising: a cable comprising a plurality of wires and a shield layer; and a connector insert coupled to the cable and comprising: an insert shield electrically connected to the shield layer of the cable; a board coupled to at least one of the wires, the board having a solder area on a first edge, the solder area connected to the insert shield; a plurality of contacts attached to the board, wherein a contact in the plurality of contacts is electrically connected to a trace on the board; and an integrated circuit fixed to the board and electrically connected to the trace on the board and thermally coupled to the insert shield, the insert shield around the board and the integrated circuit. 18. The connector insert and cable apparatus of claim 17 wherein the board further comprises a second solder area on a second edge opposite the first edge, the second solder area attached to the insert shield. 19. The connector insert and cable apparatus of claim 18 further comprising a cap over a connection between the shield layer and the insert shield wherein the cap is crimped over the connection between the shield layer and the insert shield. 20. The connector insert and cable apparatus of claim 19 wherein the cap is soldered to the connector insert.

Assignees

Inventors

Classifications

  • Four or more poles · CPC title

  • Soldered or welded connections {(H01R4/625, H01R4/723, H01R12/59 take precedence)} · CPC title

  • for simultaneous welding or soldering of a plurality of wires to contact elements · CPC title

  • using twisted pairs of wires · CPC title

  • by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal] · CPC title

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Frequently asked questions

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What does patent US10199778B2 cover?
High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connecto…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification H01R13/6592. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).