Optoelectronic modules including an image sensor having regions optically separated from one another

Patent metadata

Field	Value
Publication number	US-10199412-B2
Application number	US-201515329112-A
Country	US
Kind code	B2
Filing date	Jul 22, 2015
Priority date	Jul 25, 2014
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

First claim

What is claimed is:

1. A wafer-level method of fabricating a plurality of optoelectronic modules, the method comprising:
providing a substrate on which are mounted a plurality of image sensor chips;
providing a respective foundation layer of black epoxy over each respective one of the image sensor chips such that a first light sensitive region of the respective image sensor chip is located to a first side of the respective foundation layer and a second light sensitive region of the respective image sensor chip is located to a second side of the respective foundation layer;
providing an overmold of clear epoxy over the image sensor chips;
selectively removing the clear epoxy from areas directly over the foundation layers so as to form a respective first trench directly over each foundation layer; and
performing an injection process to fill the first trenches with black epoxy and simultaneously to form an outer housing of black epoxy for the modules.

2. The method of claim 1 further including dicing the substrate to form a plurality of singulated modules, each of which includes a respective image sensor chip having a bridge portion composed of the black epoxy spanning over the image sensor chip so as to separate the first and second light sensitive regions of the image sensor chip from one another.

3. The method of claim 2 further including hard baking the black epoxy after dicing the substrate to form the plurality of singulated modules.

4. The method of claim 1 including:
forming second trenches through the substrate, each of the second trenches extending partially into the black epoxy;
fixing a UV dicing tape to a side of the black epoxy opposite the substrate;
dicing through the black epoxy to form a plurality of singulated modules, wherein the dicing is performed at locations of the second trenches;
removing the UV dicing tape, and attaching the plurality of modules to a high-temperature tape; and
thermally curing the black epoxy.

5. The method of claim 1 wherein lenses composed of the clear epoxy are formed integrally with the overmold of clear epoxy, and wherein the lenses and the overmold are formed during a single injection molding process.

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Gubser Simon
• Hanselmann Sonja
• Yu Qichuan
• Calsena Cris
• Wu Guo Xiong
• Rudmann Hartmut

Classifications

• H10W90/00

  Package configurations · CPC title

• H01L27/14618 Primary

  Electricity · mapped topic

• H01L27/14634

  Electricity · mapped topic

• H01L27/14685

  Electricity · mapped topic

• H01L27/14623

  Electricity · mapped topic