O-ring internal seal for pressure sensor

US10197465B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10197465-B2
Application numberUS-201715404799-A
CountryUS
Kind codeB2
Filing dateJan 12, 2017
Priority dateJan 12, 2017
Publication dateFeb 5, 2019
Grant dateFeb 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems and methods for sensing pressure, and protecting a sensor within a sensor assembly. A sensor assembly may comprise a sensor having at least one pressure input port; a first housing configured to encapsulate the sensor; a second housing configured to attach to the first housing to encapsulate the sensor; a first O-ring located between the first housing and the sensor; a second O-ring located between the second housing and the sensor; and a printed circuit board configured to receive detected pressure information from the sensor.

First claim

Opening claim text (preview).

What is claimed is: 1. A sensor assembly comprising: a sensor having a sensor housing with at least one pressure input port; a first housing; a second housing configured to attach to the first housing, wherein the first housing and the second housing are configured to house the sensor; a first O-ring located between the first housing and a first side of the sensor housing; a second O-ring located between the second housing and a second opposing side of the sensor housing; wherein the first O-ring and the second O-ring are configured to provide a cushion in a first direction between the first and second housings and the sensor housing to reduce stress applied by the first and/or second housings to the sensor housing; and a printed circuit board configured to receive detected pressure information from the sensor. 2. The sensor assembly of claim 1 , wherein the second housing comprises one or more snaps configured to mate with one or more ridges on the first housing. 3. The sensor assembly of claim 2 , wherein at least one snap is located in the same plane as the sensor. 4. The sensor assembly of claim 1 , wherein the first O-ring is compressed between the first housing and the first side of the sensor housing, and wherein second O-ring is compressed between the second housing and the second opposing side of the sensor housing. 5. The sensor assembly of claim 4 , wherein the compression is applied by an attachment between the first housing and the second housing. 6. The sensor assembly of claim 1 , wherein the sensor housing is configured to float between the first and second O-rings without contacting the first or second housing in the first direction. 7. The sensor assembly of claim 1 , wherein the first housing comprises walls configured to constrain the sensor housing from movement in a second direction perpendicular to the first direction. 8. The sensor assembly of claim 1 , wherein the second housing comprises walls configured to constrain the sensor housing from movement in a second direction perpendicular to the first direction. 9. The sensor assembly of claim 1 , further comprising at least one fluid channel in fluid communication with the at least one pressure input port. 10. The sensor assembly of claim 1 , wherein the sensor housing comprising two input ports, wherein the first O-ring surrounds a first input port, and wherein the second O-ring surrounds a second input port. 11. The sensor assembly of claim 10 , further comprising a first input incorporated into the first housing, wherein the first input is in fluid communication with the first input port of the sensor housing. 12. The sensor assembly of claim 10 , further comprising a second input incorporated into the second housing, wherein the second input is in fluid communication with the second input port of the sensor housing. 13. A method for assembling a pressure sensor, the method comprising: providing a sensor comprising a sensor housing with at least one input port for detecting pressure; placing the sensor within a first housing, wherein the first housing comprises a first O-ring, and wherein the sensor housing contacts the first O-ring; attaching a second housing to the first housing, thereby encapsulating the sensor housing, wherein the second housing comprises a second O-ring, and wherein the sensor housing contacts the second O-ring; wherein the first O-ring and the second O-ring provide a cushion and help isolate the sensor housing in at least one direction from stress exerted by one or both of the first housing and the second housing; and directing a pressure to be detected toward the at least one input port of the sensor housing via a fluid channel, wherein the fluid channel passes through at least one of the first O-ring and the second O-ring. 14. The method of claim 13 , wherein attaching the second housing to the first housing comprises attaching one or more snaps of the second housing to one or more ridges of the first housing. 15. The method of claim 13 , further comprising compressing the first O-ring and the second O-ring via the attachment between the first housing and the second housing. 16. The method of claim 13 , wherein the sensor housing comprises a first input port and a second input port, wherein the first O-ring surrounds the first input port, and wherein the second O-ring surrounds the second input port. 17. The method of claim 13 , further comprising attaching one or more leads to the sensor; and attaching the one or more leads to a printed circuit board assembly. 18. A sensor assembly comprising: a sensor having a sensor housing with at least one pressure input port; at least one housing configured to house the sensor housing; a first O-ring configured to be compressed between the housing and the sensor housing; a second O-ring configured to be compressed between the housing and the sensor housing, wherein the sensor housing floats between the first O-ring and the second O-ring and is cushioned from stress exerted by the housing in at least one direction; and at least one fluid channel passing through the housing to the at least one pressure input port of the sensor housing, wherein the at least one fluid channel passes through at least one of the first O-ring and the second O-ring. 19. The sensor assembly of claim 18 , further comprising: a first fluid channel passing through the housing to a first pressure input port of the sensor housing, wherein the first fluid channel passes through the first O-ring; and a second fluid channel passing through the housing to a second pressure input port of the sensor housing, wherein the second fluid channel passes through the second O-ring. 20. The sensor assembly of claim 18 , wherein the at least one housing comprises walls configured to constrain the sensor housing within the housing in at least one direction.

Assignees

Inventors

Classifications

  • with dismountable parts, e.g. for maintenance purposes or for ensuring sterile conditions (for detachable interface or adapter between the process medium and the pressure gauge G01L19/003) · CPC title

  • Two part housings · CPC title

  • G01L13/025Primary

    using diaphragms · CPC title

  • G01L19/147Primary

    Details about the mounting of the sensor to support or covering means · CPC title

  • characterised by structure or material · CPC title

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What does patent US10197465B2 cover?
Systems and methods for sensing pressure, and protecting a sensor within a sensor assembly. A sensor assembly may comprise a sensor having at least one pressure input port; a first housing configured to encapsulate the sensor; a second housing configured to attach to the first housing to encapsulate the sensor; a first O-ring located between the first housing and the sensor; a second O-ring loc…
Who is the assignee on this patent?
Honeywell Int Inc
What technology area does this patent fall under?
Primary CPC classification G01L13/025. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).