Device for cutting substrate and robot

Patent metadata

Field	Value
Publication number	US-10197461-B2
Application number	US-201514881645-A
Country	US
Kind code	B2
Filing date	Oct 13, 2015
Priority date	Oct 14, 2014
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

Provided is a cutting device that prevents a variation of shocks or impacts applied to a substrate during a cutting operation. The cutting device includes a pressing part; a cutting part disposed so as to move with respect to the pressing part so as to contact the substrate on an opposite side of the pressing part to thereby sandwich the substrate between the cutting part and the pressing part to shear the substrate; a first force generation part for generating pressing force to press the pressing part against the substrate; and a first adjustment part for adjusting the pressing force in response to the force applied from the substrate to the pressing part when the pressing part presses the substrate with the first force generation part.

First claim

The invention claimed is:

1. A cutting device for cutting a substrate, comprising:
a pedestal part;
a pressing device fixed to the pedestal part, the pressing device moveable in a first direction;
a cutting mechanism arranged adjacent to the pressing device and supported by the pedestal part via a moveable part so as to be configured to pivot around a distal end of the pressing device in a second direction opposite the first direction sandwiching a workpiece between the cutting mechanism and the pressing device;
a first force generation mechanism which generates a pressing force for pressing the pressing device against the substrate; and
a controller configured to:
1) increase the pressing force in response to the pressing force being below a first threshold when the pressing device is pressed against the substrate by the first force generation mechanism, and
2) decrease the pressing force in response to the pressing force being above a second threshold when the pressing device is pressed against the substrate by the first force generation mechanism.

2. The cutting device of claim 1 further comprising a force sensor which measures the force applied from the substrate, wherein
the first adjustment part controls the first force generation part so as to adjust the pressing force based on the force applied from the substrate measured by the force sensor.

3. The cutting device of claim 1 further comprising a displacement sensor which measures a position of the pressing part relative to the substrate, wherein
the first adjustment part controls the first force generation part so as to adjust the pressing force based on the position measured by the displacement sensor.

4. The cutting device of claim 1 , wherein the first force generation part includes an air cylinder which generates the pressing force,
the first adjustment part adjusts a pressure of an air supplied to the air cylinder.

5. The cutting device of claim 1 , wherein the first force generation part includes:
a spring which generates the pressing force; and
a moving part movable in directions toward and away from the substrate, wherein
the pressing part is connected to the moving part via the spring,

the first adjustment part adjusts a position of the moving part relative to the substrate.

6. The cutting device of claim 1 further comprising:
a second force generation mechanism which generates a driving force for shearing the substrate at the cutting mechanism,
wherein the controller adjusts the driving force.

7. The cutting device of claim 6 , wherein the second force generation part includes an air cylinder,
the second adjustment part controls a pressure of an air supplied to the air cylinder.

8. The cutting device of claim 6 , wherein the second force generation part includes a servomotor,
the second adjustment part controls a torque of the servo motor.

9. The cutting device of claim 6 , wherein the controller adjusts the driving force in response to a thickness of the substrate.

10. The cutting device of claim 1 , wherein the cutting mechanism includes a saw blade.

11. A robot comprising:
a robot arm; and
the cutting device of claim 1 , wherein
the pressing part is provided at the robot arm,
the first force generation part moves the pressing part in directions toward and away from the substrate by an operation of the robot arm.

12. A robot system comprising:
the robot of claim 11 ; and
a controller which controls the robot.

Assignees

• Fanuc Corp

Inventors

• Oda Masaru
• Ochiishi Yoshinori

Classifications

• G01L5/0076

  Force sensors associated with manufacturing machines (G01L5/0066, G01L5/0071 and B23Q17/09 take precedence; for the specific machine or operation involved see relevant class, e.g. B21 - B42) · CPC title

• B26D5/00

  Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting · CPC title

• G01L5/0038 Primary

  applying a pushing force · CPC title

• B26D1/45

  having a cutting member the movement of which is not covered by any preceding group · CPC title

• B26D5/086

  Electric, magnetic, piezoelectric, electro-magnetic means · CPC title