Cold end heat exchanging device and semiconductor refrigerator

US10197309B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10197309-B2
Application numberUS-201515536512-A
CountryUS
Kind codeB2
Filing dateSep 28, 2015
Priority dateDec 15, 2014
Publication dateFeb 5, 2019
Grant dateFeb 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cold end heat exchanging device and a semiconductor refrigerator having the cold end heat exchanging device. The cold end heat exchanging device comprises a cold end heat exchanging part and a plurality of refrigerant pipelines. The cold end heat exchanging part defines an inner cavity or a conduit for containing a gas-phase and liquid-phase co-existing refrigerant. Each refrigerant pipeline is provided with an evaporation section that is downwards bent and extends in a vertical plane and has a closed tail end, and a connection section that is upwards bent and extends from a starting end of the evaporation section and is connected to the inner cavity or the conduit. Evaporation sections of at least some refrigerant pipelines of the plurality of refrigerant pipelines are distributed in two vertical planes that are perpendicular to each other.

First claim

Opening claim text (preview).

What is claimed is: 1. A cold end heat exchanging device for a semiconductor refrigerator, comprising: a cold end heat exchanging part which defines an inner cavity or conduit for containing a refrigerant existing in both gas and liquid phases and the cold end heat exchanging part is configured to allow the refrigerant to flow therein and undergo phase-change heat exchange; and a plurality of refrigerant pipelines configured to allow the refrigerant to flow therein and undergo phase-change heat exchange, each of the refrigerant pipelines being provided with: an evaporation section which is bent to point in a first direction and extends in a vertical plane and has a closed tail end, and a connection section which is bent to point in a second direction opposite to the first direction and extends from a starting end of the evaporation section and is connected to the inner cavity or conduit; and the evaporation sections of at least some of the plurality of refrigerant pipelines being arranged in two vertical planes which are perpendicular to each other, wherein the two vertical planes include a first plane perpendicular to the rear surface of the cold end heat exchanging part, and a second plane parallel to the rear surface of the cold end heat exchanging part; wherein the evaporation sections of some of the plurality of refrigerant pipelines are arranged in a third plane parallel to the first plane; wherein the evaporation section of each of the refrigerant pipelines, of which the evaporation sections are arranged in the second plane, is located between the first plane and the third plane; wherein the evaporation section of each of the refrigerant pipelines comprises: a plurality of straight pipe segments disposed in the vertical direction at intervals, each of the straight pipe segments being arranged obliquely at an angle of 10° to 70° with respect to the horizontal plane; and bent segments, each connecting two adjacent straight pipe segments, wherein the bent segments are arc-shaped sections. 2. The cold end heat exchanging device according to claim 1 , characterized in that the cold end heat exchanging part has a rectangular cuboid shape with the areas of a front surface and a rear surface opposite each other being larger than the areas of other surfaces, and the rear surface of the cold end heat exchanging part serves as a heat exchange surface which is thermally connected to a cold source. 3. The cold end heat exchanging device according to claim 1 , characterized in that the evaporation section of each of the refrigerant pipelines, of which the evaporation sections are arranged in the first plane, and the evaporation section of each of the refrigerant pipelines, of which the evaporation sections are arranged in the third plane, are both located on one side of the second plane. 4. The cold end heat exchanging device according to claim 3 , characterized in that the number of refrigerant pipelines, of which the evaporation sections are arranged in the second plane, is two, and the refrigerant pipelines are symmetrically arranged with respect to a vertical geometrical symmetry plane. 5. The cold end heat exchanging device according to claim 4 , characterized in that the number of refrigerant pipelines, of which the evaporation sections are arranged in the first plane, and the number of refrigerant pipelines, of which the evaporation sections are arranged in the third plane, are both one, and the refrigerant pipelines are symmetrically arranged with respect to the vertical geometrical symmetry plane. 6. The cold end heat exchanging device according to claim 5 , characterized in that the evaporation section of each of the refrigerant pipelines, of which the evaporation sections are arranged in the second plane, has a projected length on a horizontal plane that is smaller than ½ of the width of a rear wall of a liner of the semiconductor refrigerator and greater than ¼ of the width of the rear wall of the liner; the evaporation section of each of the refrigerant pipelines, of which the evaporation sections are arranged in the first plane, and the evaporation section of each of the refrigerant pipelines, of which the evaporation sections are arranged in the third plane, both have a projected length on a horizontal plane that is smaller than the width of a side wall of the liner of the semiconductor refrigerator and greater than ½ of the width of the side wall of the liner. 7. The cold end heat exchanging device according to claim 1 , further comprises: a plurality of retention steel wires disposed in the vertical direction; and a pipe wall at an outer vertex of each of the bent segments on the same side of each of the refrigerant pipelines is welded to one of the retention steel wires. 8. A semiconductor refrigerator, comprising: a liner having a storage compartment defined therein; a semiconductor cooler disposed behind the liner; and a cold end heat exchanging device comprising: a cold end heat exchanging part which defines an inner cavity or conduit for containing a refrigerant existing in both gas and liquid phases and the cold end heat exchanging part is configured to allow the refrigerant to flow therein and undergo phase-change heat exchange; and a plurality of refrigerant pipelines configured to allow the refrigerant to flow therein and undergo phase-change heat exchange, each of the refrigerant pipelines being provided with: an evaporation section which is downwardly bent and extends in a vertical plane and has a closed tail end, and a connection section which is upwardly bent and extends from a starting end of the evaporation section and is connected to the inner cavity or conduit; and the evaporation sections of at least some of the plurality of refrigerant pipelines being arranged in two vertical planes which are perpendicular to each other, wherein the two vertical planes include a first plane perpendicular to the rear surface of the cold end heat exchanging part, and a second plane parallel to the rear surface of the cold end heat exchanging part; wherein the evaporation sections of some of the plurality of refrigerant pipelines are arranged in a third plane parallel to the first plane; wherein the evaporation section of each of the refrigerant pipelines, of which the evaporation sections are arranged in the second plane, is located between the first plane and the third plane; wherein the evaporation section of each of the refrigerant pipelines comprises: a plurality of straight pipe segments disposed in the vertical direction at intervals, each of the straight pipe segments being arranged obliquely at an angle of 10° to 70° with respect to the horizontal plane; and bent segments, each connecting two adjacent straight pipe segments, wherein the bent segments are arc-shaped sections; wherein the cold end heat exchanging device is mounted such that the rear surface of the cold end heat exchanging part thereof is thermally connected to a cold end of the semiconductor cooler, and the evaporation section of each of the refrigerant pipelines is abutted against an outer surface of the inner for transferring the cold from the cold end to the storage compartment.

Assignees

Inventors

Classifications

  • Devices using a combination of a cooling mode associated with refrigerating machinery with a cooling mode not associated with refrigerating machinery · CPC title

  • F25D19/00Primary

    Arrangement or mounting of refrigeration units with respect to devices {or objects to be refrigerated, e.g. infrared detectors} · CPC title

  • by liquids or two-phase fluids · CPC title

  • F25B21/02Primary

    using Peltier effect; using Nernst-Ettinghausen effect · CPC title

  • for circulating liquids, e.g. brine · CPC title

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What does patent US10197309B2 cover?
A cold end heat exchanging device and a semiconductor refrigerator having the cold end heat exchanging device. The cold end heat exchanging device comprises a cold end heat exchanging part and a plurality of refrigerant pipelines. The cold end heat exchanging part defines an inner cavity or a conduit for containing a gas-phase and liquid-phase co-existing refrigerant. Each refrigerant pipeline …
Who is the assignee on this patent?
Qingdao Haier Joint Stock Co Ltd, Qingdao Haier Joint Stock Co Ltd
What technology area does this patent fall under?
Primary CPC classification F25D19/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).