Surface treatment of metal substrates

US10196744B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10196744-B2
Application numberUS-201515514809-A
CountryUS
Kind codeB2
Filing dateSep 25, 2015
Priority dateSep 26, 2014
Publication dateFeb 5, 2019
Grant dateFeb 5, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A process for surface treatment of metal substrates, including the steps of: providing a metal substrate including hydroxyl groups at its surface; bringing the metal substrate into contact with a solution of at least one organophosphorus compound to enable the reaction of the hydroxyl groups at the surface of the metal substrate with the organophosphorus compound to form a monomolecular layer over the surface and a second layer of physisorbed organophosphorus molecules at least preponderantly crystallized, the obtained treated substrate being coated with the organophosphorus compound in the form of a first monomolecular layer coating at least 15% of the surface of the substrate and in the form of a physisorbed second layer at least preponderantly crystallized. A treated metal substrate which may be obtained by the process thereof, corresponding solution and its use for treating metallic substrates to improve their tribological properties during their shaping, in particular their stamping.

First claim

Opening claim text (preview).

The invention claimed is: 1. A metal substrate, the surface of which being coated with (i) at least an organophosphorus compound in the form of a first monomolecular layer coating at least 15% of the surface of the substrate and (ii) a second layer in the form of a physisorbed second layer of organophosphorus molecules at least preponderantly crystallized, said second layer being physisorbed on said first monomolecular layer. 2. Metal substrate according to claim 1 , wherein the at least one organophosphorus compound is of formula (I) below wherein A represents a hydrocarbon chain, saturated or unsaturated, straight or branched, comprising 4 to 28 atoms of carbon, the chain may be substituted with one or several group(s) selected from the group consisting of hydroxy, amino, cyano, halogen, sulfonic acid, and organophosphonic acid and/or interrupted by one or several atom(s) or group(s) selected from the group consisting of O, HN, and SH; Z represents one or several terminal functional group(s) selected from the group consisting of alcohol, aldehyde, carboxylic acid, organophosphonic acid, thiol, amine, halogen, cyano, and silane, or is absent; and R 1 and R 2 are, independently of each other, a hydrogen or a saturated alkyl, straight or branched, comprising 1 to 18 atoms of carbon. 3. Metal substrate according to claim 2 in which A represents a saturated alkyl group and/or a straight alkyl group. 4. Metal substrate according to claims 1 , wherein the substrate is made of aluminum, copper, chromium, titanium, zinc, gold, silver, ruthenium, rhodium, or any of their alloys. 5. Metal substrate according to claim 1 , wherein it consists of a flat product. 6. Process for the preparation of a metal substrate according to claim 1 , comprising the following steps: (i) providing a metal substrate including hydroxyl groups at its surface; (ii) bringing the metal substrate into contact with a solution of at least one organophosphorus compound; said substrate being not rinsed after treatment according to step (ii). 7. The process according to claim 6 , wherein a solvent used for preparing the solution of organophosphorus compound comprises an alcohol, and/or water. 8. The process according to claim 7 , wherein the alcohol is an alcohol selected from the group consisting of methanol, ethanol, propanol, isopropanol, and butanol. 9. The process according to claim 6 , wherein the solution has a concentration in organophosphorus compound of more than 1 mM/l. 10. The process according to claim 9 , wherein the solution of the organophosphorus compound is supersaturated. 11. Metal substrate according to claim 2 in which A represents a hydrocarbon chain, saturated or unsaturated, straight or branched, comprising 16 carbon atoms, the chain may be substituted with one or several group(s) selected from the group consisting of hydroxy, amino, cyano, halogen, sulfonic acid, and organophosphonic acid and/or interrupted by one or several atom(s) or group(s) selected from the group consisting of O, HN, and SH.

Assignees

Inventors

Classifications

  • without essential removal of material {, e.g. forming, gorging, drawing, pressing, stamping, rolling or extruding}; Punching metal · CPC title

  • Multi-layer lubricant coatings · CPC title

  • Iron or steel · CPC title

  • Stainless steel · CPC title

  • of specific metals · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10196744B2 cover?
A process for surface treatment of metal substrates, including the steps of: providing a metal substrate including hydroxyl groups at its surface; bringing the metal substrate into contact with a solution of at least one organophosphorus compound to enable the reaction of the hydroxyl groups at the surface of the metal substrate with the organophosphorus compound to form a monomolecular layer o…
Who is the assignee on this patent?
Aperam, Univ Franche Comte
What technology area does this patent fall under?
Primary CPC classification C23C22/07. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).