High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
US-2024110085-A1 · Apr 4, 2024 · US
US10196479B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10196479-B2 |
| Application number | US-201815990058-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 25, 2018 |
| Priority date | Dec 2, 2014 |
| Publication date | Feb 5, 2019 |
| Grant date | Feb 5, 2019 |
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A method for producing a modified form of an aromatic amine compound represented by the following structure I: where A is an amine group —NHR, R is independently selected from hydrogen, linear and branched alkyl groups having 1 to 6 carbon atoms, preferably A is NH 2 ; X is a halogen selected from Cl, Br, F, I, and At, or hydrogen (H). The method includes heating the aromatic amine compound, in its initial crystalline form, to a temperature above its melting point in order to obtain a molten material, then cooling the molten material to a temperature below the melting point of the crystalline compound so as to produce an amorphous, glassy form of the aromatic amine compound. The modified aromatic amine compound is suitable as a curing agent in resin compositions that are used for fabricating fiber-reinforced composites.
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What is claimed is: 1. A curable epoxy-based composition comprising: (a) an epoxy component, which includes at least one polyepoxide; and (b) an aromatic amine compound in an amorphous, glassy form, represented by the following structure: 2. The curable epoxy-based composition of claim 1 , wherein the composition has a viscosity of less than 5 Poise at a temperature in the range of about 80° C. to about 130° C. 3. The curable epoxy-based composition of claim 1 , wherein the aromatic amine compound in an amorphous, glassy form is prepared by heating the aromatic amine compound, in its initial crystalline form, to a temperature of 1° C. to 50° C. above its melting point, as determined by Differential Scanning calorimetry (DSC), in order to obtain a molten material, then cooling the molten material to a temperature of 30° C. or lower. 4. A curable epoxy-based composition comprising: (a) an epoxy component, which includes at least one polyepoxide; and (b) a modified aromatic amine compound in amorphous, glassy form, wherein the modified aromatic amine compound is 9,9-Bis(4-amino-3-chlorophenyl) fluorene represented by the following structure: and the modified aromatic amine is the only amine compound in amorphous, glassy form. 5. The curable epoxy-based composition of claim 4 , wherein the composition has a viscosity of less than 5 Poise at a temperature in the range of about 80° C. to about 130° C. 6. The curable epoxy-based composition of claim 4 , wherein the modified aromatic amine compound is prepared by heating the aromatic amine compound, in its initial crystalline form, to a temperature of 1° C. to 50° C. above its melting point, as determined by Differential Scanning calorimetry (DSC), in order to obtain a molten material, then cooling the molten material to a temperature of 30° C. or lower.
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title
aromatic · CPC title
Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title
with at least two amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton · CPC title
with aromatically bound amino groups · CPC title
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