Laser cutting

US10195690B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10195690-B2
Application numberUS-201615218778-A
CountryUS
Kind codeB2
Filing dateJul 25, 2016
Priority dateSep 21, 2011
Publication dateFeb 5, 2019
Grant dateFeb 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of laser cutting, comprising: creating, via a computing device, a virtual version of a mold and a specialized part formed on the mold; defining, via a computing device, a virtual cut path at which a laser will direct energy to cut the specialized part formed on the mold; determining, via a computing device, multiple part material thickness estimates for multiple points along the virtual cut path; defining a set of adjustment instructions for adjusting at least one of the laser, at least one of a mirror or lens, and a fixture that holds the mold with the specialized part formed thereon; executing the instructions via a computing device, such that a ratio of a laser energy applied to the specialized part and a part material thickness based on the part material thickness estimates is maintained within a predetermined acceptable range at each point along an actual cut path to cut through the part while maintaining the integrity of the mold; blowing gas, via a gas dispensing nozzle, at a point at which the laser contacts the specialized part to blow debris of the specialized part from the cut path; and removing the debris via a suction tube located proximate to the point at which the laser contacts the specialized part. 2. The method of claim 1 , wherein blowing gas via the gas dispensing nozzle includes blowing chilled gas at the point at which the laser contacts the specialized part to cool the specialized part. 3. The method of claim 1 , wherein blowing gas via the gas dispensing nozzle includes blowing heated gas at the point at which the laser contacts the specialized part to heat the specialized part. 4. The method of claim 1 , wherein defining the set of adjustment instructions includes: defining a set of movement and speed adjustment instructions for moving the fixture with the part positioned on the mold; wherein the instructions adjust the speed of movement of the part relative to the laser beam based on the determined part material thickness estimates such that the ratio of the laser energy applied to the part and the part material thickness is maintained within the predetermined acceptable range. 5. The method of claim 4 , wherein defining the set of movement and speed adjustment instructions includes defining movement and speed of the fixture in five axes in relation to an orientation of the laser. 6. The method of claim 1 , wherein the mold is in the shape of a set of teeth of a jaw of a patient to be treated with the dental aligner appliance.

Assignees

Inventors

Classifications

  • A61C7/08Primary

    Mouthpiece-type retainers {or positioners, e.g. for both the lower and upper arch (arch-shaped medicament applicators for teeth or gums A61C19/063; mouthguards for protecting the teeth of sportsmen A63B71/085)} · CPC title

  • Production methods · CPC title

  • B23K26/38Primary

    by boring or cutting · CPC title

  • B23K26/083Primary

    Devices involving movement of the workpiece in at least one axial direction · CPC title

  • Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane · CPC title

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What does patent US10195690B2 cover?
Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a par…
Who is the assignee on this patent?
Align Technology Inc
What technology area does this patent fall under?
Primary CPC classification A61C7/08. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).