Implantable medical devices and related connector enclosure assemblies utilizing conductors electrically coupled to feedthrough pins

US10195448B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10195448-B2
Application numberUS-201715437429-A
CountryUS
Kind codeB2
Filing dateFeb 20, 2017
Priority dateJan 26, 2011
Publication dateFeb 5, 2019
Grant dateFeb 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: providing a connector enclosure including a base plate having an aperture and an integral ground pin, the connector enclosure housing at least one electrical connector; providing a can coupled to the base plate, the can housing electrical circuitry; coupling a filter capacitor to the base plate, the filter capacitor having an aperture and having capacitor forming plates including a ground plate, the ground plate being electrically coupled to the ground pin of the base plate; providing a feedthrough pin electrically coupled to the electrical connector within the connector enclosure, the feedthrough pin extending through the aperture in the base plate; electrically coupling the feedthrough pin to a filter capacitor other than the ground plate; electrically coupling a first end of a first conductor to the feedthrough pin and the filter capacitor other than the ground plate; electrically coupling a second end of the first conductor that extends into the can to the electrical circuitry; electrically coupling a first end of a ground conductor to the integral ground pin; and electrically coupling a second end of the ground conductor that extends into the can to the electrical circuitry. 2. The method of claim 1 , wherein a bonding material forms an electrically conductive bond among the first end of the ground conductor, the ground plate, and the integral ground pin. 3. The method of claim 2 , wherein the bonding material is solder. 4. The method of claim 1 , further comprising coupling a support body to the base plate, such that the ground conductor passes through the support body. 5. The method of claim 4 , wherein the support body includes posts and the base plate includes cavities and wherein the posts are contained within the cavities. 6. The method of claim 1 , wherein the second end of the ground conductor is directly bonded to a circuit board within the can that contains the electrical circuitry. 7. The method of claim 1 , wherein the filter capacitor has an asymmetric shape and wherein the base plate includes a recess that defines an asymmetric shape that matches the asymmetric shape of the filter capacitor. 8. The method of claim 1 , wherein a ground aperture within the filter capacitor has a keyhole shape and wherein the integral ground pin and the ground conductor pass into the ground aperture within the filter capacitor. 9. A method, comprising: providing a connector enclosure including a base plate having an aperture and a ground pin, the connector enclosure housing at least one electrical connector; coupling a can to the base plate, the can housing electrical circuitry; coupling a filter capacitor to the base plate, the filter capacitor having a ground aperture and having capacitor forming plates including a ground plate, the ground plate extending to the ground aperture; electrically coupling a feedthrough pin to the electrical connector within the connector enclosure, the feedthrough pin extending through the aperture in the base plate; electrically coupling the feedthrough pin to a capacitor plate other than the ground plate; electrically coupling a first end of a first conductor to the feedthrough pin and the filter capacitor other than the ground plate; electrically coupling a second end of the feedthrough pin that extends into the can to the electrical circuitry; electrically coupling a first end of a ground conductor to the ground pin and the ground plate; and electrically coupling a second end extending into the can and electrically coupled to the electrical circuitry, wherein an electrically conductive bonding material is present within the ground aperture of the filter capacitor and to create an electrically conductive bond among the ground conductor, the ground pin, and the ground plate. 10. The method of claim 9 , wherein the ground pin is integral to the base plate. 11. The method of claim 9 , further comprising coupling a support body to the base plate such that the ground conductor passes through the support body. 12. The method of claim 11 , wherein the support body includes posts and the base plate includes cavities and wherein the posts are contained within the cavities. 13. The method of claim 11 , wherein the bonding material is solder. 14. The method of claim 11 , wherein the second end of the ground conductor is directly bonded to a circuit board within the can that contains the electrically circuitry. 15. The method of claim 11 , wherein the filter capacitor has an asymmetric shape and wherein the base plate includes a recess that defines an asymmetric shape that matches the asymmetric shape of the filter capacitor. 16. The method of claim 11 , wherein the ground aperture within the filter capacitor has a keyhole shape and wherein the ground pin and the ground conductor pass into the ground aperture within the filter capacitor. 17. A method, comprising: providing a connector enclosure including a base plate having an aperture, the connector enclosure housing at least one electrical connector; providing a ground pin coupled to the base plate; coupling a can to the base plate, the can housing electrical circuitry; coupling a filter capacitor to the base plate, the filter capacitor having a ground aperture and having capacitor forming plates including a ground plate, the ground plate extending to the ground aperture; electrically coupling a feedthrough pin to the electrical connector within the connector enclosure, the feedthrough pin extending through the aperture in the base plate; electrically coupling the feedthrough pin to a capacitor plate other than the ground plate; electrically coupling a first end of a first conductor to the feedthrough pin and the filter capacitor other than the ground plate; electrically coupling a second end of the feedthrough pin that extends into the can to the electrical circuitry; electrically coupling a first end of a ground conductor to the ground pin and the ground plate; and electrically coupling a second end extending into the can and electrically coupled to the electrical circuitry, wherein an electrically conductive bonding material is present within the ground aperture of the filter capacitor and to create an electrically conductive bond among the ground conductor, the ground pin, and the ground plate. 18. An implantable medical device, comprising: a connector enclosure including a base plate having an aperture, the connector enclosure housing at least one electrical connector; a ground pin coupled to the base plate; a can coupled to the base plate, the can housing electrical circuitry; a filter capacitor coupled to the base plate, the filter capacitor having a ground aperture and having capacitor forming plates including a ground plate, the ground plate extending to the ground aperture; a feedthrough pin electrically coupled to the electrical connector within the connector enclosure, the feedthrough pin extending through the aperture in the base plate, the feedthrough pin being electrically coupled to a capacitor plate other than the ground plate, a first conductor having a first end electrically coupled to the feedthrough pin and the filter capacitor other than the ground plate and having a second end that extends into the can and that is electrically coupled to the electrical circuitry; a ground conductor having a first end that is electrically coupled to the ground pin and the ground plate and having a second end that extends into the can and is electrically coupled to the electrical circuitry; and

Assignees

Inventors

Classifications

  • A61N1/3754Primary

    Feedthroughs · CPC title

  • Contacts spaced along longitudinal axis of engagement · CPC title

  • Four or more poles · CPC title

  • Constructional arrangements, e.g. casings · CPC title

  • by assembling plural parts · CPC title

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Frequently asked questions

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What does patent US10195448B2 cover?
Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during man…
Who is the assignee on this patent?
Medtronic Inc
What technology area does this patent fall under?
Primary CPC classification A61N1/3754. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Feb 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).