Laminted glass assembly
US-2015343744-A1 · Dec 3, 2015 · US
US10194490B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10194490-B2 |
| Application number | US-201515510568-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2015 |
| Priority date | Sep 12, 2014 |
| Publication date | Jan 29, 2019 |
| Grant date | Jan 29, 2019 |
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A wired glazing is disclosed comprising a ply of interlayer material, having a first busbar and an auxiliary busbar and heating wires between them. An adhesive layer is arranged between the first busbar and the ply of interlayer material. An auxiliary adhesive layer is arranged where an edge of the auxiliary busbar extends beyond an edge of the first busbar. The auxiliary adhesive layer bonds the auxiliary busbar to the ply of interlayer material. A corresponding process for manufacturing a wired glazing is disclosed.
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The invention claimed is: 1. A glazing, comprising: a ply of interlayer material; a first busbar laid over the ply of interlayer material; an adhesive layer between the first busbar and the ply of interlayer material, the adhesive layer bonding together the first busbar and the ply of interlayer material; at least one heating wire laid over the first busbar; an auxiliary busbar at least partly laid over the heating wire and at least partly laid over the first busbar; and an auxiliary adhesive layer arranged where an edge of the auxiliary busbar extends beyond an edge of the first busbar; wherein a solder layer suitable for melting in an autoclave covers at least part of a surface of the first busbar or the auxiliary busbar and is arranged to contact the heating wire; wherein the auxiliary adhesive layer bonds the auxiliary busbar to the ply of interlayer material; and wherein the solder layer covers both a surface of the first busbar in contact with the heating wire and an opposite surface of the first busbar, or wherein the solder layer covers both a surface of the auxiliary busbar in contact with the heating wire and anopposite surface of the auxiliary busbar. 2. The glazing according to claim 1 , wherein a distance between the edge of the auxiliary busbar and the edge of the first busbar is in a range 2 mm to 5 mm. 3. The glazing according to claim 1 , wherein the first busbar has a width in a range 2 mm to 8 mm. 4. The glazing according to claim 1 , wherein the auxiliary busbar has a width in a range 4 mm to 12 mm. 5. The glazing according to claim 1 , wherein the first busbar is of metal of thickness in a range 50 um to 200 um. 6. The glazing according to claim 1 , wherein the solder layer covers substantially all of a surface of the first busbar in contact with the heating wire or wherein the solder layer covers substantially all of a surface of the auxiliary busbar in contact with the heating wire. 7. The glazing according to claim 1 , wherein the solder layer has thickness in a range 1 um to 50 um. 8. The glazing according to claim 1 , wherein the solder layer melting point is in a range 120 degrees C. to 150 degrees C. 9. The glazing according to claim 1 , wherein the adhesive layer has thickness in a range 10 um to 100 um. 10. The glazing according to claim 1 , wherein an array of heating wires extends between, and is in electrical contact with, first and second busbars for supplying electrical power to the array of heating wires. 11. The glazing according to claim 1 , wherein the ply of interlayer material is arranged between first and second plies of glazing material. 12. The glazing according to claim 1 , wherein the first busbar has a width in a range 4 mm to 5 mm. 13. The glazing according to claim 1 , wherein the auxiliary busbar has a width in a range 8 mm to 9 mm. 14. The glazing according to claim 1 , wherein the first busbar is made of copper with a thickness in a range 90 um to 100 um. 15. The glazing according to claim 1 , wherein the solder layer has thickness in a range 5 um to 20 um. 16. The glazing according to claim 1 , wherein the solder layer melting point is in a range 125 degrees C. to 135 degrees C. 17. The glazing according to claim 1 , wherein the adhesive layer has thickness in a range 20 um to 50 um. 18. A process for manufacture of a glazing, comprising: providing a ply of interlayer material; laying a first busbar over the a ply of interlayer material; arranging an adhesive layer between the first busbar and the ply of interlayer material to bond together the first busbar and the ply of interlayer material; laying at least one heating wire over the first busbar; laying an auxiliary busbar at least partly over the heating wire and at least partly over the first busbar; arranging an auxiliary adhesive layer where an edge of the auxiliary busbar extends beyond an edge of the first busbar; laying a solder layer on at least part of a surface of the first busbar or the auxiliary busbar and arranging the solder layer to contact the heating wire; arranging an adhesive layer between the first busbar and the ply of interlayer material for bonding them together; arranging an auxiliary adhesive layer where an edge of the auxiliary busbar extends beyond an edge of the first busbar for bonding the auxiliary busbar to the ply of interlayer material by the auxiliary adhesive layer; and wherein the solder layer covers both a surface of the first busbar in contact with the heating wire and an opposite surface of the first busbar or wherein the solder layer covers both a surface of the auxiliary busbar in contact with the heating wire and an opposite surface of the auxiliary busbar. 19. The process for manufacture of a glazing according to claim 18 , comprising positioning the edge of the auxiliary busbar and the edge of the first busbar such that the distance between them is in a range 2 mm to 5 mm.
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