Fixing structure and fixing method

Patent metadata

Field	Value
Publication number	US-10193241-B2
Application number	US-201615265898-A
Country	US
Kind code	B2
Filing date	Sep 15, 2016
Priority date	Oct 20, 2015
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

A fixing method for fixing a terminal to a conductive pattern with a brazing filler metal disposed therebetween includes: a first step of disposing the brazing filler metal on the conductive pattern; a second step of bringing the terminal into contact with the brazing filler metal; and a third step of forming a penetrating hole in the terminal by irradiating a laser beam onto the terminal. In the third step, the laser beam is irradiated onto the terminal in such a manner that the penetrating hole is filled with the brazing filler metal melted by the irradiation of the laser beam.

First claim

What is claimed is:

1. A fixing method for fixing a terminal to an object to be fixed with a solder disposed therebetween, the fixing method comprising:
a first step of disposing the solder on the object to be fixed;
a second step of bringing the terminal into contact with the solder; and
a third step of forming a penetrating hole in the terminal by irradiating a laser beam onto the terminal,
wherein in the third step, the laser beam is irradiated onto the terminal in such a manner that the solder melted by the irradiation of the laser beam passes through the penetrating hole and reaches the vicinity of an upper end of the penetrating hole, and
wherein in the third step, the laser beam is irradiated onto the terminal while the terminal is pressed against the solder by an external force or a weight of a connector including the terminal.

2. The fixing method according to claim 1 , wherein in the third step, the laser beam is irradiated onto the terminal in such a manner that the solder melted by the irradiation of the laser beam passes through the penetrating hole, flows out from the upper end of the penetrating hole, and spreads over a laser irradiation surface of the terminal.

3. The fixing method according to claim 1 , wherein the object to be fixed is a conductive pattern formed on a substrate.

4. The fixing method according to claim 3 , wherein
in the first step, the solder is disposed on the conductive pattern by carrying out a reflow process after the conductive pattern is coated with a cream solder.

5. The fixing method according to claim 1 , wherein the object to be fixed is a conductor of a wire.

6. The fixing method according to claim 5 , wherein
in the first step, the solder is disposed on the conductor by wetting the conductor with the solder.

7. The fixing method according to claim 5 , wherein in the second step, the terminal is brought into contact with the solder by mating a wire holding body with a terminal holding body, the wire holding body holding the wire, the terminal holding body holding the terminal.

8. The fixing method according to claim 5 , wherein in the second step, the terminal is brought into contact with the solder, while at least one of the conductor and the terminal is subjected to a bending deformation, by mating a wire holding body with a terminal holding body, the wire holding body holding the wire, the terminal holding body holding the terminal.

9. The fixing method according to claim 1 , wherein
the terminal is a Cu-based or Au-based metal.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Yoshida Takushi
• Akimoto Hiroshi
• Seki Yosuke

Classifications

• H01R4/024 Primary

  comprising preapplied solder · CPC title

• H05K2203/043

  Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste · CPC title

• H01R13/405

  Securing in non-demountable manner, e.g. moulding, riveting · CPC title

• H01R4/029

  Welded connections (H01R4/021 - H01R4/028 take precedence) · CPC title

• B23K1/0056

  soldering by means of beams, e.g. lasers, electron beams [EB] · CPC title