Silica-based polishing particle and abrasive

Patent metadata

Field	Value
Publication number	US-10190023-B2
Application number	US-201715804251-A
Country	US
Kind code	B2
Filing date	Nov 6, 2017
Priority date	Nov 7, 2016
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

Provided is a silica-based polishing particle which can polish and flatten the surface of a substrate at a sufficient polishing rate with generation of scratches prevented, and successfully prevents generation of particle residues on a substrate after polishing. A silica-based polishing particle with a three-dimensional polycondensation structure containing an alkoxy group, wherein the particle has an average particle diameter (d) of 5 to 300 nm, an aspect ratio of 1.00 or more and 1.20 or less, and a carbon content of 0.005% by mass or more and less than 0.50% by mass.

First claim

What is claimed is:

1. A silica-based polishing particle having a three-dimensional polycondensation structure, wherein
the particle contains an alkoxy group therein, the particle having an average particle diameter (d) of 5 to 300 nm, an aspect ratio of 1.00 or more and 1.20 or less, and a carbon content of 0.005% by mass or more and less than 0.50% by mass.

2. The silica-based polishing particle according to claim 1 , wherein a content of each of alkali metals, alkali earth metals, Fe, Ti, Zn, Pd, Ag, Mn, Co, Mo, Sn, Al, and Zr is less than 0.1 ppm, a content of each of Cu, Ni, and Cr is less than 1 ppb, and a content of each of U and Th is less than 0.3 ppb.

3. The silica-based polishing particle according to claim 1 , wherein a ratio (γ/d) of a dynamic light scattering particle diameter (γ) to an average particle diameter (d) is 1.00 or more and 1.50 or less.

4. The silica-based polishing particle according to claim 1 , wherein a ratio (γ 1 /d) of an equivalent spherical particle diameter (γ 1 ) calculated from a specific surface area (SA) in accordance with a BET method to the average particle diameter (d) is 0.80 or more and less than 1.00.

5. The silica-based polishing particle according to claim 2 , wherein a ratio (γ/d) of a dynamic light scattering particle diameter (γ) to an average particle diameter (d) is 1.00 or more and 1.50 or less.

6. The silica-based polishing particle according to claim 2 , wherein a ratio (γ 1 /d) of an equivalent spherical particle diameter (γ 1 ) calculated from a specific surface area (SA) in accordance with a BET method to the average particle diameter (d) is 0.80 or more and less than 1.00.

7. The silica-based polishing particle according to claim 3 , wherein a ratio (γ 1 /d) of an equivalent spherical particle diameter (γ 1 ) calculated from a specific surface area (SA) in accordance with a BET method to the average particle diameter (d) is 0.80 or more and less than 1.00.

8. An abrasive comprising the silica-based polishing particle according to claim 1 .

9. An abrasive comprising the silica-based polishing particle according to claim 2 .

10. An abrasive comprising the silica-based polishing particle according to claim 3 .

11. An abrasive comprising the silica-based polishing particle according to claim 4 .

Assignees

• Jgc Catalysts & Chemicals Ltd

Inventors

• Kumazawa Mitsuaki
• Egami Miki
• Arakane Hirotada
• Muraguchi Ryo
• Hirai Toshiharu

Classifications

• C09K3/1454

  Abrasive powders, suspensions and pastes for polishing · CPC title

• C01B33/18

  Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof (preparation of aerogels by dehydrating gels C01B33/158; treatment to enhance the pigmenting or filling properties C09C) · CPC title

• C01B33/124 Primary

  Preparation of adsorbing porous silica not in gel form and not finely divided, i.e. silicon skeletons, by acidic treatment of siliceous materials · CPC title

• C01P2004/64

  Nanometer sized, i.e. from 1-100 nanometer · CPC title

• C01P2006/12

  Surface area · CPC title