Curable resin composition, resin mold for imprinting, method for photo imprinting, method for manufacturing semiconductor integrated circuit, and method for manufacturing fine optical element

Patent metadata

Field	Value
Publication number	US-10189983-B2
Application number	US-201314655047-A
Country	US
Kind code	B2
Filing date	Dec 25, 2013
Priority date	Dec 28, 2012
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

A curable resin composition comprising: a fluorinated urethane(meth)acrylate represented by formula (1),

wherein, R 1 , R 2 , R 3 and R 4 each independently represents a hydrogen atom or a methyl group, x and y each independently represents 1 or 2, and n represents an integer within the range of 1 to 10; R 3 and R 4 each independently represents the hydrogen atom when x and y are both 1; R 3 represents the hydrogen atom and R 4 represents the methyl group when x is 1 and y is 2; R 3 represents the methyl group and R 4 represents the hydrogen atom when x is 2 and y is 1; and R 3 and R 4 each independently represents the methyl group when x and y are both 2.

First claim

The invention claimed is:

1. A curable resin composition comprising:
a fluorinated urethane(meth)acrylate represented by formula (1),

wherein:
each of R 1 , R 2 , R 3 and R 4 independently represents a hydrogen atom or a methyl group, x and y each independently represents 1 or 2, and n represents an integer within the range of 1 to 10;
each of R 3 and R 4 independently represents the hydrogen atom when x and y are both 1;
R 3 represents the hydrogen atom and R 4 represents the methyl group when x is 1 and y is 2;
R 3 represents the methyl group and R 4 represents the hydrogen atom when x is 2 and y is 1; and
each of R 3 and R 4 independently represents the methyl group when x and y are both 2.

2. The curable resin composition according to claim 1 , having photocurability.

3. The curable resin composition according to claim 2 , comprising a photopolymerization initiator.

4. A resin mold for imprinting, produced by curing the curable resin composition according to claim 1 .

5. A method for manufacturing a semiconductor integrated circuit, the method comprising:
utilizing the resin mold of claim 4 to manufacture the semiconductor integrated circuit.

6. A method for manufacturing a fine optical element, the method comprising:
utilizing the resin mold of claim 4 to manufacture the fine optical element.

7. A resin for imprinting, produced by a process comprising curing the curable resin composition according to claim 1 .

8. A fluorinated urethane(meth)acrylate compound represented by formula (1),

wherein:
each of R 1 , R 2 , R 3 and R 4 independently represents a hydrogen atom or a methyl group;
each of x and y independently represents 1 or 2, and n represents an integer within the range of 1 to 10;
each of R 3 and R 4 independently represents the hydrogen atom when x and y are both 1;
R 3 represents the hydrogen atom and R 4 represents the methyl group when x is 1 and y is 2;
R 3 represents the methyl group and R 4 represents the hydrogen atom when x is 2 and y is 1; and
each of R 3 and R 4 independently represents the methyl group when x and y are both 2.

9. A photocurable resin composition comprising:
a photopolymerization initiator, and
a fluorinated urethane(meth)acrylate represented by formula (1):

wherein:
each of R 1 , R 2 , R 3 and R 4 independently represents a hydrogen atom or a methyl group, x and y each independently represents 1 or 2, and n represents an integer of from 1 to 10;
each of R 3 and R 4 independently represents a hydrogen atom when x and y are both 1;
R 3 represents a hydrogen atom and R 4 represents a methyl group when x is 1 and y is 2;
R 3 represents a methyl group and R 4 represents a hydrogen atom when x is 2 and y is 1; and
each of R 3 and R 4 independently represents a methyl group when x and y are both 2.

Assignees

• Toyo Gosei Co Ltd

Inventors

• Wada Risa
• Osaki Takeshi

Classifications

• B82Y10/00

  Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• G03F7/0046

  with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title