Methods for manufacturing three-dimensional devices and devices created thereby

US10189184B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10189184-B2
Application numberUS-50433009-A
CountryUS
Kind codeB2
Filing dateJul 16, 2009
Priority dateJun 5, 2001
Publication dateJan 29, 2019
Grant dateJan 29, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated.

First claim

Opening claim text (preview).

What is claimed is: 1. An assembly comprising: a metallic foil stack lamination mold; and a cast component that fills a cavity of said metallic foil stack lamination mold; wherein: said cast component comprises a plurality of component surfaces; said cavity defines a single demolding opening for said metallic foil stack lamination mold; said demolding opening defines a demolding direction in which said cast component is removable via said demolding opening from said cavity of said metallic foil stack lamination mold with damage to neither said cast component nor said metallic foil stack lamination mold; said cavity defines a first cavity cross-sectional area that extends solely within a first cavity plane that is oriented perpendicularly to said demolding direction; said cavity defines a second cavity cross-sectional area that extends solely within a second cavity plane that is oriented perpendicularly to said demolding direction; said first cavity cross-sectional area is smaller than said second cavity cross-sectional area; and said first cavity plane is closer to said demolding opening than said second cavity plane; and an electrically conductive feature extending through and/or across a portion of said cast component. 2. The assembly of claim 1 , further comprising: a microelectronic component integrated with said electrically conductive feature. 3. The assembly of claim 1 , further comprising: a microelectronic component electrically coupled to said electrically conductive feature. 4. The assembly of claim 1 , further comprising: an integrated circuit electrically coupled to said electrically conductive feature. 5. The assembly of claim 1 , further comprising: a detector electrically coupled to said electrically conductive feature. 6. The assembly of claim 1 , further comprising: a microwell electrically coupled to said electrically conductive feature. 7. The assembly of claim 1 , wherein: said electrically conductive feature comprises at least one electrically conductive layer. 8. The assembly of claim 1 , wherein: said electrically conductive feature comprises at least one electrically conductive coating. 9. The assembly of claim 1 , wherein: said electrically conductive feature comprises at least one electrically conductive plating. 10. The assembly of claim 1 , wherein: said electrically conductive feature comprises at least one electrically conductive path. 11. The assembly of claim 1 , wherein: said cast component comprises an integrated circuit. 12. The assembly of claim 1 , wherein: said cast component comprises a detector. 13. The assembly of claim 1 , wherein: said cast component comprises a plurality of microwells. 14. The assembly of claim 1 , wherein: at least one component surface from said plurality of component surfaces is non-planar. 15. The assembly of claim 1 , wherein: at least one component surface from said plurality of component surfaces is anisotropic. 16. The assembly of claim 1 , wherein: at least one component surface from said plurality of component surfaces is isotropic. 17. The assembly of claim 1 , wherein: at least one component surface from said plurality of component surfaces has a predetermined surface finish. 18. The assembly of claim 1 , wherein: said cast component comprises silica, silicon carbide, alumina, and/or zirconium oxide. 19. The assembly of claim 1 , wherein: said cast component is formed from an elastomeric material. 20. The assembly of claim 1 , wherein: said cast component is formed from an elastomeric material that is sufficiently flexible to allow, without damage to said cast component and without damage to the metallic foil stack lamination parent mold, said cast component to be demolded from the metallic foil stack lamination parent mold. 21. The assembly of claim 1 , wherein: said cast component is formed from an elastomeric material that is sufficiently flexible to allow, without damage to said cast component and without damage to the metallic foil stack lamination parent mold, said cast component to be pulled from the metallic foil stack lamination parent mold in the demolding direction until said cast component is free from the metallic foil stack lamination parent mold. 22. The assembly of claim 1 , wherein: the cast component comprises, with respect to the demolding direction, a distal first portion, the distal first portion defined by a first cross sectional dimension that corresponds to a cross section taken perpendicular to the demolding direction; the cast component comprises, with respect to the demolding direction, a proximal second portion, the proximal second portion defined by a second cross sectional dimension that corresponds to a cross section taken perpendicular to the demolding direction; and said first cross sectional dimension smaller than said second cross sectional dimension. 23. The assembly of claim 1 , wherein: said cast component comprises a casting material. 24. An assembly comprising: a metallic foil stack lamination mold; and a cast component that fills a cavity of said metallic foil stack lamination mold, said cast component comprising a plurality of component surfaces; wherein: said cast component comprises silicon carbide; said cavity defines a single demolding opening for said metallic foil stack lamination mold; said demolding opening defines a demolding direction in which said cast component is removable via said demolding opening from said cavity of said metallic foil stack lamination mold with damage to neither said cast component nor said metallic foil stack lamination mold; said cavity defines a first cavity cross-sectional area that extends solely within a first cavity plane that is oriented perpendicularly to said demolding direction; said cavity defines a second cavity cross-sectional area that extends solely within a second cavity plane that is oriented perpendicularly to said demolding direction; said first cavity cross-sectional area is smaller than said second cavity cross-sectional area; and said first cavity plane is closer to said demolding opening than said second cavity plane. 25. The assembly of claim 24 , further comprising: at least one channel defined by said cast component. 26. The assembly of claim 24 , further comprising: a plurality of channels extending within said cast component. 27. The assembly of claim 24 , further comprising: an interconnected plurality of channels extending within said cast component. 28. The assembly of claim 24 , further comprising: a plurality of protrusions defined by said cast component. 29. The assembly of claim 24 , further comprising: a sub-cavity defined by said cast component. 30. The assembly of claim 24 , further comprising: an additional cast component attached to said cast component. 31. The assembly of claim 24 , wherein: at least one component surface from said plurality of component surfaces is non-planar. 32. The assembly of claim 24 , wherein: at least one component surface from said plurality of component surfaces is anisotropic. 33. The assembly of claim 24 , wherein: at least one component surface from said plurality of component surfaces is isotropic.

Assignees

Inventors

Classifications

  • for detecting non x-ray radiation, e.g. gamma radiation (A61B6/037 takes precedence) · CPC title

  • Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372) · CPC title

  • Multi-face stack moulds · CPC title

  • Details of radiation-measuring instruments · CPC title

  • for the production of embossing, cutting or similar devices; for the production of casting means · CPC title

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What does patent US10189184B2 cover?
In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabr…
Who is the assignee on this patent?
Appleby Michael P, Fraser Iain, Atkinson James E, and 1 more
What technology area does this patent fall under?
Primary CPC classification B23P15/246. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 29 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).