Bonding objects together
US-2016341234-A1 · Nov 24, 2016 · US
US10189075B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10189075-B2 |
| Application number | US-201715413524-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 24, 2017 |
| Priority date | Jan 24, 2017 |
| Publication date | Jan 29, 2019 |
| Grant date | Jan 29, 2019 |
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A method of riveting a first substrate and a second substrate with a rivet includes delivering a first ultrasonic pulse to a respective exterior surface of the first substrate at a predefined target area, via an ultrasonic device. The first ultrasonic pulse is configured to soften the first substrate at a first softening temperature. The method includes attaching a crust layer on a rivet head of the rivet. A second ultrasonic pulse is delivered to the predefined target area to soften the crust layer at a second softening temperature, via the ultrasonic device. A surface profile of the crust layer is fashioned via compression of a horn inner cavity of the ultrasonic device over the crust layer. The crust layer is cooled to harden into a seal configured to prevent entry of moisture between the rivet and the respective exterior surface of the first substrate, thereby reducing galvanic corrosion.
Opening claim text (preview).
What is claimed is: 1. A method of riveting a first substrate and a second substrate with a rivet having a rivet head and a rivet body, the first and second substrates having respective exterior surfaces and respective interior surfaces, the method comprising: placing the respective interior surfaces of the first and second substrates adjacent to one another at a predefined target area; delivering a first ultrasonic pulse to the respective exterior surface of the first substrate at the predefined target area via an ultrasonic device, the first ultrasonic pulse being configured to soften the first substrate at a first softening temperature; attaching a crust layer on the rivet head, the crust layer and the rivet head being composed of dissimilar materials; forming a joint by inserting the rivet into the first and second substrates at the predefined target area; applying a second ultrasonic pulse to the predefined target area such that sufficient heat is generated to soften the crust layer at a second softening temperature, via the ultrasonic device, the second ultrasonic pulse having a relatively higher energy than the first ultrasonic pulse; and cooling the crust layer to harden into a seal configured to prevent entry of moisture between the rivet and the respective exterior surface of the first substrate. 2. The method of claim 1 , wherein the ultrasonic device includes a horn having a horn inner cavity, the method further comprising: fashioning a surface profile of the crust layer via compression of the horn inner cavity over the crust layer, the surface profile of the crust layer being configured to inversely correspond to a shape of the horn inner cavity. 3. The method of claim 1 , wherein: the rivet is composed of a metal; and the crust layer is composed of a thermoplastic composite. 4. The method of claim 1 , wherein the first substrate and the second substrate are each composed of carbon fiber nylon composite. 5. The method of claim 1 , wherein said attaching the crust layer on the rivet head includes: dipping the rivet head into a molten solution; and solidifying the molten solution to form the crust layer. 6. The method of claim 1 , wherein said attaching the crust layer on the rivet head includes: applying an adhesive layer between the crust layer and the rivet head; and curing the adhesive sufficiently that a melting point of the adhesive layer is higher than a melting point of the crust layer. 7. The method of claim 1 , wherein the second softening temperature is higher than the first softening temperature. 8. The method of claim 1 , wherein the ultrasonic device includes an anvil having an anvil inner cavity, and further comprising: melting a portion of the respective exterior surface of the second substrate at the predefined target area, via the second ultrasonic pulse, to create a button layer at least partially around the rivet body; and fashioning a surface profile of the button layer via compression of the anvil inner cavity over the button layer, the surface profile of the button layer being configured to inversely correspond to a shape of the anvil inner cavity. 9. The method of claim 1 , wherein said forming the joint includes: positioning the rivet at the predefined target area and applying a compressive force, via the horn of the ultrasonic device, to push the rivet body into the first and second substrates at the predefined target area. 10. The method of claim 1 , wherein the rivet includes mandrel positioned in a hollow center, the mandrel having a mandrel head and a mandrel stem, wherein said forming the joint includes: axially loading the mandrel head with a sufficient pull force into the hollow center such that the rivet body expands against the first and second substrates, the mandrel being configured to break at a notch at a predetermined resisting force; and ejecting the mandrel stem such that the mandrel head is encapsulated at a blind side of the predefined target area. 11. A method of riveting a first substrate and a second substrate with a rivet having a rivet head, a rivet body and a mandrel positioned in a hollow center, the first and second substrates having respective exterior surfaces and respective interior surfaces, the method comprising: placing the respective interior surfaces of the first and second substrates adjacent to one another at a predefined target area; delivering a first ultrasonic pulse to the respective exterior surface of the first substrate at the predefined target area via an ultrasonic device, the first ultrasonic pulse being configured to soften the first substrate at a first softening temperature; attaching a crust layer on the rivet head, the crust layer and the rivet head being composed of dissimilar materials; wherein the mandrel includes a mandrel head and a mandrel stem; axially loading the mandrel head with a sufficient pull force into the hollow center such that the rivet body expands against the first and second substrates, the mandrel being configured to break at a notch at a predetermined resisting force; forming a joint with the rivet body such that the mandrel head is encapsulated at a blind side of the predefined target area and the mandrel stem is ejected; applying a second ultrasonic pulse to the predefined target area, via the ultrasonic device, such that sufficient heat is generated to soften the crust layer at a second softening temperature, the second ultrasonic pulse having a relatively higher energy than the first ultrasonic pulse; wherein the ultrasonic device includes a horn having a horn inner cavity; fashioning a surface profile of the crust layer via compression of the horn inner cavity over the crust layer, the surface profile of the crust layer inversely corresponding to a shape of the horn inner cavity; and cooling the crust layer to harden into a seal configured to prevent entry of moisture between the rivet head and the respective exterior surface of the first substrate. 12. The method of claim 11 , wherein the crust layer is composed of a thermoplastic composite. 13. The method of claim 11 , wherein the rivet is composed of a metal. 14. The method of claim 11 , wherein the first substrate and the second substrate are each composed of carbon fiber nylon 6 composite. 15. The method of claim 11 , wherein said attaching the crust layer on the rivet head includes: dipping the rivet head into a molten solution; and solidifying the molten solution to form the crust layer.
Rivet sets, i.e. tools for forming heads; Mandrels for expanding parts of hollow rivets · CPC title
by pulling a mandrel · CPC title
Self-piercing rivets · CPC title
with tools or tool parts having a movement additional to the feed movement, e.g. spin {(B21J15/027 takes precedence)} · CPC title
Riveting by applying heat {, e.g.} to the end parts of the rivets to enable heads to be formed {(B21J15/027 takes precedence)} · CPC title
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