Optical module

US10185103B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10185103-B2
Application numberUS-201615289333-A
CountryUS
Kind codeB2
Filing dateOct 10, 2016
Priority dateMar 4, 2016
Publication dateJan 22, 2019
Grant dateJan 22, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

First claim

Opening claim text (preview).

The invention claimed is: 1. An optical module, comprising a circuit board; a first chip; a second chip; and a lens assembly, wherein: the first chip and the second chip are arranged directly on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip in a chip on board package where the first chip and the second chip are positioned between the lens assembly and the surface of the circuit board; the lens assembly comprises a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port; and an optical axis of each of the first and second optical fiber insertion ports is parallel to the surface of the circuit board. 2. The optical module according to claim 1 , wherein: the first chip is a light transmitting chip, the first reflecting surface is configured to reflect light rays exiting the light transmitting chip to the second reflecting surface, and the second reflecting surface is configured to reflect the light rays reflected by the first reflecting surface to the first optic fiber insertion port. 3. The optical module according to claim 1 , wherein: the first chip is a light probing chip, the second reflecting surface is configured to reflect light rays incident on the first optic fiber insertion port to the first reflecting surface, and the first reflecting surface is configured to reflect the light rays reflected by the second reflecting surface to the light probing chip. 4. The optical module according to claim 1 , wherein: a distance between an axis of the first optic fiber insertion port and an axis of the second optic fiber insertion port is less than a distance between the first chip and the second chip. 5. The optical module according to claim 1 , wherein: the lens assembly further comprises a first lens and a second lens; the first lens is arranged between the first chip and the first reflecting surface; and the second lens is arranged at the first optic fiber insertion port. 6. The optical module according to claim 1 , wherein a light propagation path between the first chip and the first reflecting surface is parallel or perpendicular to an axis of the first optic fiber insertion port. 7. The optical module according to claim 6 , wherein a concave groove is located on an upper surface of the lens assembly, a bump is located in the concave groove, and the first reflecting surface and the second reflecting surface are located on a surface of the bump. 8. The optical module according to claim 4 , further comprising a first driving chip configured to drive the first chip, wherein a straight line defined between a pin of the first chip and a pin of the first driving chip is perpendicular to a side of the first driving chip. 9. An optical module, comprising: a circuit board; a first chip; a second chip; a first lens assembly, and a second lens assembly, wherein: the first chip is arranged on the surface of the circuit board, and the first lens assembly is arranged above the first chip in a chip on board package where the first chip is positioned between the first lens assembly and the surface of the circuit board; the second chip is arranged directly on the surface of the circuit board, and the second lens assembly is arranged above the second chip in a chip on board package where the second chip is positioned between the second lens assembly and the surface of the circuit board; the first lens assembly comprises a first optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the second lens assembly comprises a second optic fiber insertion port; the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port; and an optical axis of each of the first and second optical fiber insertion ports is parallel to the surface of the circuit board. 10. The optical module according to claim 9 , wherein: a distance between an axis of the first optic fiber insertion port and an axis of the second optic fiber insertion port is less than a distance between the first chip and the second chip. 11. The optical module according to claim 9 , wherein: the first lens assembly further comprises a first lens and a second lens; the first lens is arranged between the first chip and the first reflecting surface; and the second lens is arranged at the first optic fiber insertion port. 12. The optical module according to claim 9 , wherein a light propagation path between the first chip and the first reflecting surface is parallel or perpendicular to an axis of the first optic fiber insertion port. 13. The optical module according to claim 9 , wherein a concave groove is located on an upper surface of the first lens assembly, a bump is located in the concave groove, and the first reflecting surface and the second reflecting surface are located on a surface of the bump. 14. The optical module according to claim 10 , further comprising a first driving chip driving the first chip, and a second driving chip driving the second chip; wherein a straight line defined between a pin of the first chip and a pin of the first driving chip is perpendicular to a side of the first driving chip, and a straight line defined between a pin of the second chip and a pin of the second driving chip is perpendicular to a side of the second driving chip. 15. The optical module according to claim 9 , wherein: the second lens assembly further comprises a third reflecting surface and a fourth reflecting surface; and the third reflecting surface faces the second chip, the third reflecting surface faces the fourth reflecting surface, and the fourth reflecting surface faces the second optic fiber insertion port. 16. The optical module according to claim 15 , wherein: the first chip is a light transmitting chip, the first reflecting surface is configured to reflect light rays exiting the light transmitting chip to the second reflecting surface, and the second reflecting surface is configured to reflect the light rays reflected by the first reflecting surface to the first optic fiber insertion port; and the second chip is a light probing chip, the fourth reflecting surface is configured to reflect light rays incident on the second optic fiber insertion port to the third reflecting surface, and the third reflecting surface is configured to reflect the light rays reflected by the fourth reflecting surface to the light probing chip. 17. The optical module according to claim 15 , wherein: the second lens assembly further comprises a third lens and a fourth lens; the third lens is arranged between the second chip and the third reflecting surface; and the fourth lens is arranged at the second optic fiber insertion port. 18. The optical module according to claim 9 , wherein the second lens assembly further comprises a fifth reflecting surface facing the second chip and the second optic fiber insertion port. 19. The optical module according to claim 18 , wherein: the first chip is a light transmitting chip, the first reflecting surface is configured to reflect light rays exiting the light transmitting chip to the second reflecting surface, and the second reflecting surface i

Assignees

Inventors

Classifications

  • having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} · CPC title

  • containing printed circuit boards [PCB] · CPC title

  • the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

  • mounting, engaging or coupling of the package to a board, a frame or a panel · CPC title

  • G02B6/4214Primary

    the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10185103B2 cover?
The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertio…
Who is the assignee on this patent?
Hisense Broadband Multimedia Technology Co Ltd, Hisense Usa Corp, Hisense Int Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02B6/4214. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).