Systems, methods, and devices for probe assemblies for variable curvature and variable angle configurations

US10184916B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10184916-B2
Application numberUS-201614997247-A
CountryUS
Kind codeB2
Filing dateJan 15, 2016
Priority dateJan 15, 2016
Publication dateJan 22, 2019
Grant dateJan 22, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems, methods, and devices are disclosed for inspecting a manufacturing component. Devices include a centering device configured to modify a position of an ultrasonic probe assembly relative to a manufacturing component to bisect an angle associated with the manufacturing component. Devices may also include a surface sensing device configured to sense a curvature associated with the manufacturing component. Devices may further include a plurality of sensors configured to measure a first displacement value associated with the centering device and a second displacement value associated with the surface sensing device. The devices may include a control circuit configured to determine a position adjustment value based on at least one of the first displacement value and the second displacement value. The devices may also include an actuator configured to modify a position of an ultrasonic transducer based, at least in part, on the position adjustment value.

First claim

Opening claim text (preview).

What is claimed is: 1. A device comprising: a centering device configured to modify a position of an ultrasonic probe assembly relative to a manufacturing component to bisect an angle associated with the manufacturing component, the ultrasonic probe assembly comprising an ultrasonic transducer; a surface sensing device configured to sense a curvature associated with the manufacturing component; a plurality of sensors configured to measure a first displacement value associated with the centering device and a second displacement value associated with the surface sensing device; a control circuit configured to determine a position adjustment value based on of the first displacement value and the second displacement value; and an actuator configured to modify a position of the ultrasonic transducer based, at least in part, on the position adjustment value. 2. The device of claim 1 , wherein the centering device comprises a first surface following guide, a second surface following guide, and a coupling housing coupled to the first surface following guide and the second surface following guide, the coupling housing being biased by a first tension device. 3. The device of claim 2 , wherein the plurality of sensors comprises a first sensor and a second sensor. 4. The device of claim 3 , wherein the first sensor is coupled to the centering device, and wherein the second sensor is coupled to the surface sensing device. 5. The device of claim 4 , wherein the first sensor and the second sensor comprise differential variable reluctance transformers, and wherein the control circuit comprises a processor and a non-volatile memory. 6. The device of claim 1 , wherein the first displacement value and second displacement value identify a change in the angle associated with the manufacturing component or a change in a position of the ultrasonic probe assembly relative to the manufacturing component resulting from a modification of the position of the ultrasonic probe assembly. 7. The device of claim 6 , wherein the position adjustment value identifies a positional adjustment configured to modify a position of the ultrasonic transducer to offset the change. 8. The device of claim 7 , wherein the actuator is configured to modify the position of the ultrasonic transducer to offset the change. 9. The device of claim 1 , wherein the ultrasonic transducer is configured to measure one or more structural properties of the manufacturing component. 10. The device of claim 1 , wherein the surface sensing device comprises a wheel biased by a second tension device. 11. A method comprising: positioning, using a centering device, an ultrasonic probe assembly relative to a manufacturing component to bisect an angle associated with the manufacturing component the ultrasonic probe assembly comprising an ultrasonic transducer; identifying a change associated with the position of the ultrasonic probe assembly relative to the manufacturing component, the change being identified based, at least in part, on a previous position of the ultrasonic probe assembly; determining, using a control circuit, a position adjustment value based on the identified change; and modifying a position of the ultrasonic transducer based, at least in part, on the position adjustment value. 12. The method of claim 11 , wherein identifying the change comprises: identifying, using a first sensor associated with the centering device, a first displacement value. 13. The method of claim 11 , wherein identifying the change comprises: identifying, using a second sensor associated with a surface sensing device, a second displacement value. 14. The method of claim 13 , wherein the surface sensing device comprises a wheel biased by a tension device. 15. The method of claim 11 , wherein the modifying of the position of the ultrasonic transducer is based, at least in part, on the position adjustment value, and offsets the identified change. 16. A system comprising: a robotic arm; an ultrasonic probe assembly coupled to the robotic arm, the ultrasonic probe assembly comprising: a centering device configured to modify a position of the ultrasonic probe assembly relative to a manufacturing component to bisect an angle associated with the manufacturing component; a surface sensing device configured to sense a curvature associated with the manufacturing component; a plurality of sensors configured to measure a first displacement value associated with the centering device and a second displacement value associated with the surface sensing device; an ultrasonic transducer; an actuator configured to modify a position of the ultrasonic transducer; and an electronics housing comprising a control circuit configured to determine a position adjustment value based on the first displacement value and the second displacement value. 17. The system of claim 16 , wherein the centering device comprises a first surface following guide, a second surface following guide, and a coupling device coupled to the first surface following guide and the second surface following guide, the coupling device being biased by a first tension device. 18. The system of claim 16 , wherein the first displacement value and second displacement value identify a change in the angle associated with the manufacturing component or a change in a position of the ultrasonic probe assembly relative to the manufacturing component resulting from a modification of the position of the ultrasonic probe assembly. 19. The system of claim 18 , wherein the position adjustment value identifies a positional adjustment configured to modify a position of the ultrasonic transducer to offset the change. 20. The system of claim 19 , wherein the actuator is configured to modify the position of the ultrasonic transducer based, at least in part, on the position adjustment value to offset the change.

Assignees

Inventors

Classifications

  • on the surface of the material, e.g. using Lamb, Rayleigh or shear waves · CPC title

  • Directing probes, e.g. angle probes (directing arrangements G01N29/221) · CPC title

  • Composite or layered materials · CPC title

  • Various geometry objects · CPC title

  • Supports, positioning or alignment in moving situation · CPC title

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What does patent US10184916B2 cover?
Systems, methods, and devices are disclosed for inspecting a manufacturing component. Devices include a centering device configured to modify a position of an ultrasonic probe assembly relative to a manufacturing component to bisect an angle associated with the manufacturing component. Devices may also include a surface sensing device configured to sense a curvature associated with the manufact…
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification G01N29/2487. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).