Method for hot forming, in particular for press hardening

US10184158B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10184158-B2
Application numberUS-201514790337-A
CountryUS
Kind codeB2
Filing dateJul 2, 2015
Priority dateJul 8, 2014
Publication dateJan 22, 2019
Grant dateJan 22, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for hot forming, in particular for press hardening, a component is disclosed, wherein in a local region of the component a reduced martensitic hardness is produced by locally reducing a forming pressure which is exerted on a surface of the component.

First claim

Opening claim text (preview).

The invention claimed is: 1. Method for hot forming, comprising press hardening a component by: exerting a first positive forming pressure on the surface of a first portion of the component, wherein the first positive forming pressure is exerted by a portion of a hardening tool contacting the surface of the first portion of the component; and exerting a second positive forming pressure on a surface of a second portion of the component, wherein the second positive forming pressure is exerted by a portion of the hardening tool contacting the surface of the second portion of the component, wherein the first positive forming pressure is less than the second positive forming pressure and, after press hardening, the first portion of the component has a reduced martensitic hardness as compared to the second portion of the component. 2. Method according to claim 1 , wherein regulation of the first positive forming pressure is performed by an element which is spring-mounted in at least one of a lower tool and an upper tool of the hardening tool. 3. Method according to claim 2 , wherein a side of the spring-mounted element that faces the surface of the component contacts in a form-fitting manner the surface of the component, and a forming accuracy in the local region conforms to a remaining forming accuracy in further regions of the component. 4. Method according to claim 1 , wherein regulation of the first forming pressure is implemented by at least one of a gas pressure spring, a disc spring, and an elastic spring as a spring-mounted element. 5. Method according to claim 2 , wherein the spring-mounted element is mounted in at least one of a die and a mould region of at least one of the lower tool and the upper tool of the hardening tool. 6. Method according to claim 2 , wherein a hydraulic installation is embedded in at least one of the lower tool and the upper tool of the hardening tool.

Assignees

Inventors

Classifications

  • C21D1/673Primary

    for die quenching · CPC title

  • for performing particular operations · CPC title

  • C21D7/13Primary

    by hot working · CPC title

  • Treating or finishing surfaces mechanically, with or without calibrating, primarily to resist wear or impact, e.g. smoothing or roughening turbine blades or bearings (treatment covered by a single other subclass, see the relevant subclass, e.g. B24C, C21D7/00, C22F1/00); Features of such surfaces not otherwise provided for, their treatment being unspecified · CPC title

  • Heating or cooling methods or arrangements specially adapted for performing forging or pressing operations {(B21J5/063 takes precedence)} · CPC title

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What does patent US10184158B2 cover?
A method for hot forming, in particular for press hardening, a component is disclosed, wherein in a local region of the component a reduced martensitic hardness is produced by locally reducing a forming pressure which is exerted on a surface of the component.
Who is the assignee on this patent?
Thyssenkrupp Steel Europe Ag, Thyssenkrupp Ag
What technology area does this patent fall under?
Primary CPC classification C21D1/673. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).