Silica-based polishing particle and abrasive

Patent metadata

Field	Value
Publication number	US-10184069-B2
Application number	US-201715829128-A
Country	US
Kind code	B2
Filing date	Dec 1, 2017
Priority date	Dec 2, 2016
Publication date	Jan 22, 2019
Grant date	Jan 22, 2019

Abstract

Provided is a silica-based polishing particle, particularly suitable for primary polishing, which provides a high polishing rate on the surface of a substrate and which prevents particle residues on the substrate after polishing, and an abrasive including the silica-based polishing particle. A silica-based polishing particle with a three-dimensional polycondensation structure containing an alkoxy group, wherein the particle has an average particle diameter (d) of 5 to 300 nm, an aspect ratio of more than 1.20 and 5.00 or less, and a carbon content of 0.005% by mass or more and less than 0.50% by mass.

First claim

What is claimed is:

1. A first silica-based polishing particle having a three-dimensional polycondensation structure, wherein
the particle contains an alkoxy group therein, the particle having an average particle diameter (d) of 5 to 300 nm, an aspect ratio of more than 1.20 and 5.00 or less, and a carbon content of 0.005% by mass or more and less than 0.50% by mass.

2. The first silica-based polishing particle according to claim 1 , wherein
the particle includes a content of each of alkali metals, alkali earth metals, Fe, Ti, Zn, Pd, Ag, Mn, Co, Mo, Sn, Al, and Zr of less than 0.1 ppm, a content of each of Cu, Ni, and Cr is of less than 1 ppb, and a content of each of U and Th of less than 0.3 ppb.

3. The silica-based polishing particle according to claim 1 , wherein a ratio (γ/b) of a dynamic light scattering particle diameter (γ) to an average major axis diameter (b) is 0.70 or more and 3.00 or less.

4. The first silica-based polishing particle according to claim 1 , wherein a ratio (γ 1 /d) of an equivalent spherical particle diameter (γ 1 ) calculated from a specific surface area (SA) in accordance with a BET method to the average particle diameter (d) is 0.80 or more and less than 1.00.

5. An abrasive comprising the first silica-based polishing particle according to claim 1 .

6. The abrasive according to claim 5 , wherein the abrasive is prepared by mixing a second silica-based polishing particle having a three-dimensional polycondensation structure, wherein
the second silica-based polishing particle contains an alkoxy group therein, the second silica-based polishing particle having an average particle diameter (d) of 5 to 300 nm, an aspect ratio of 1.00 or more and 1.20 or less, and a carbon content of 0.005% by mass or more and less than 0.50% by mass.

7. The abrasive according to claim 5 , wherein the abrasive is an abrasive for primary polishing.

Assignees

• Jgc Catalysts & Chemicals Ltd

Inventors

• Kumazawa Mitsuaki
• Egami Miki
• Arakane Hirotada
• Muraguchi Ryo
• Hirai Toshiharu

Classifications

• C01P2004/54

  Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension · CPC title

• C01B33/12

  Silica; Hydrates thereof, e.g. lepidoic silicic acid · CPC title

• C01P2004/64

  Nanometer sized, i.e. from 1-100 nanometer · CPC title

• C09K3/1409 Primary

  Abrasive particles per se (preparation of diamond C01B32/25) · CPC title

• C09G1/02 Primary

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title