Moisture curable compositions
US-2024400829-A1 · Dec 5, 2024 · US
US10179868B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10179868-B2 |
| Application number | US-201515527943-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 2, 2015 |
| Priority date | Dec 9, 2014 |
| Publication date | Jan 15, 2019 |
| Grant date | Jan 15, 2019 |
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[Problem] To form, by using a conductive composition capable of being stably dispersed and solubilized in a solvent consisting mainly of an organic solvent, a silicone film having excellent conductivity and having few problems originating from amine compounds, such as problems wherein an addition-type silicone does not set easily. [Solution] The present invention relates to: an addition-curable antistatic organopolysiloxane composition that includes (a) a π-conjugated conductive polymer, (b) a polyanion, (c) a compound represented by chemical formula (1), and (d) an addition-curable organopolysiloxane composition; and an antistatic silicone film formed by supplying the addition-curable antistatic organopolysiloxane composition onto a substrate and curing. (R represents a functional group having an unsaturated bond).
Opening claim text (preview).
The invention claimed is: 1. An addition-curable antistatic organopolysiloxane composition, comprising: (a) a π-conjugated conductive polymer; (b) a polyanion; (c) a compound represented by the following chemical formula (1); and (d) an addition-curable organopolysiloxane composition, wherein R is a linear unsaturated hydrocarbon group having 3 to 21 carbon atoms. 2. The addition-curable antistatic organopolysiloxane composition of claim 1 , wherein (c) the compound represented by the chemical formula (1) is a compound represented by the following chemical formula (2): wherein R1 is a linear saturated hydrocarbon group having 1 to 19 carbon atoms. 3. The addition-curable antistatic organopolysiloxane composition of claim 1 , comprising a reaction product of (b) the polyanion with (c) the compound represented by the chemical formula (1). 4. The addition-curable antistatic organopolysiloxane composition of claim 1 , wherein (a) the π-conjugated conductive polymer has one or more repeating units selected from the group consisting of polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylene vinylenes, polyanilines, polyacenes, polythiophene vinylenes and copolymers of two or more thereof. 5. The addition-curable antistatic organopolysiloxane composition of claim 4 , wherein (a) the i-conjugated conductive polymer is a poly(3,4-ethylenedioxythiophene) or a polypyrrole. 6. The addition-curable antistatic organopolysiloxane composition of claim 1 , wherein (b) the polyanion comprises one or more anionic groups selected from a sulfonic acid group, a phosphoric acid group and a carboxy group. 7. The addition-curable antistatic organopolysiloxane composition of claim 1 , wherein (b) the polyanion comprises, as copolymerization constituents, a polystyrenesulfonic acid, a polyvinylsulfonic acid, a polyacrylic alkylenesulfonic acid, a poly(2-acrylamide-2-methyl-1-propanesulfonic acid), or one or more thereof. 8. The addition-curable antistatic organopolysiloxane composition of claim 1 , further comprising an organic solvent. 9. The addition-curable antistatic organopolysiloxane composition of claim 1 , wherein the compound represented by the chemical formula (1) is 1,2-epoxy-5-hexene or 1,2-epoxy-9-decene. 10. An antistatic silicone film, wherein the antistatic silicone film is formed by supplying and curing the addition-curable antistatic organopolysiloxane composition of claim 1 , on a substrate.
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