Hardmask composition, hardmask layer, and method of forming patterns
US-2024377746-A1 · Nov 14, 2024 · US
US10179833B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10179833-B2 |
| Application number | US-201615395599-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 30, 2016 |
| Priority date | May 24, 2016 |
| Publication date | Jan 15, 2019 |
| Grant date | Jan 15, 2019 |
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An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be or a combination thereof, wherein a is 0 or 1, and R 1 is independently hydrogen or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is wherein R 2 is C 5-10 alkyl group. The reactant (d) is wherein e is 0-10.
Opening claim text (preview).
What is claimed is: 1. An oligomer, which is a reaction product of a reactant (a) and a reactant (b), wherein the oligomer has a number average molecular weight from 1,000 to 10,000; the reactant (a) is a reaction product or a reactant (c) and a reactant (d), wherein the reactant (c) and reactant (d) are reacted to form reactant (a) prior to the addition of any portion of reactant (b); the reactant (b) is a compound having a structure represented by Formula (I), a compound having a structure represented by Formula (II), a compound having a structure represented by Formula (III), a compound having a structure represented by Formula (IV), or a combination thereof or the reactant (b) is wherein, a is 0 or 1, and R 1 is independently hydrogen or wherein b is 0 or an integer from 1 to 6; c is 0 or 1; d is 0 or an integer from 1 to 6, and at least one of R 1 is not hydrogen; the reactant (c) is a compound having a structure represented by Formula (V), compound having a structure represented by Formula (VI), or a combination thereof wherein R 2 is independently C 5-10 alkyl group, and the reactant (d) is a compound having a structure represented by Formula (VII) wherein e is 0 or an integer from 1 to 10. 2. The oligomer as claimed in claim 1 , wherein the weight ratio of the reactant (c) to the reactant (d) is from 1:10 to 10:1. 3. The oligomer as claimed in claim 1 , wherein the weight ratio of the reactant (c) to the reactant (d) is from 1:10 to 1:1. 4. The oligomer as claimed in claim 1 , wherein the weight ratio of the reactant (c) to the reactant (b) is from 1:1 to 20:1. 5. The oligomer as claimed in claim 1 , wherein the weight ratio of the reactant (c) to the reactant (b) is from 1:1 to 10:1. 6. The oligomer as claimed in claim 1 , wherein the reactant (b) is 7. The oligomer as claimed in claim 1 , wherein the reactant (b) is 8. The oligomer as claimed in claim 1 , wherein the reactant (b) is 9. The oligomer as claimed in claim 1 , wherein the reactant (c) is 10. The oligomer as claimed in claim 1 , wherein the reactant (d) is or a combination thereof. 11. A composition, comprising: 100 parts by weight of the oligomer as claimed in claim 1 ; and 20-110 parts by weight of crosslinking agent. 12. The composition as claimed in claim 11 , wherein the crosslinking agent is ethylene glycol dimethacrylate (EGDMA), 1,4-butanediol diacrylate, triallyl cyanurate, triallyl isocyanurate (TAIC), trimethallyl isocyanurate (TMAIC), butyl acrylate, 2-hydroxyethyl acrylate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, hydrolyzed polymaleic anhydride, 1,2,4-triallyl trimellitate, divinylbenzene, or a combination thereof. 13. The composition as claimed in claim 11 , further comprising: 1-200 parts by weight of a resin. 14. The composition as claimed in claim 13 , wherein the resin is epoxy resin, cyanate resin, phenol resin, novolac resin, polystyrene resin, styrene-butadiene copolymer resin, polyamide resin, polyimide resin, maleimide, bismaleimide, polyphenylene ether resin, or a combination thereof. 15. The composition as claimed in claim 11 , further comprising: 1-30 parts by weight of an additive. 16. The composition as claimed in claim 15 , wherein the additive is initiator, hardener, leveling agent, filler, colorant, defoamer, flame retardant, or a combination thereof. 17. A composite material, comprising: a cured product or a semi-cured product prepared by the composition as claimed in claim 11 ; and a substrate, wherein the cured product or the semi-cured product is disposed on the substrate or disposed within the substrate. 18. The composite material as claimed in claim 17 , wherein the substrate is glass fiber, or copper foil. 19. The composite material as claimed in claim 17 , wherein the composite material is copper foil substrate, or a printed circuit board.
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers (C08L45/00 takes precedence; of conjugated diene rubbers C08L9/00 - C08L21/00) · CPC title
with conjugated dienes · CPC title
statistical · CPC title
Ring opening metathesis polymerisation [ROMP] · CPC title
polydisperse · CPC title
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