Open earphone
US-2024422466-A1 · Dec 19, 2024 · US
US10178467B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10178467-B2 |
| Application number | US-201515540194-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 9, 2015 |
| Priority date | Feb 3, 2015 |
| Publication date | Jan 8, 2019 |
| Grant date | Jan 8, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A speaker module relates to the technical field of electroacoustic products, and comprises a lower module casing, an upper module casing and a steel sheet which are successively combined together. A speaker monomer is contained in a space enclosed by the lower module casing, the upper module casing and the steel sheet. The speaker monomer, the upper module casing and the steel sheet together enclose a front sound cavity of the module. The front sound cavity is in communication with a sound outlet hole of the module, and the sound outlet hole is located on a side part of the speaker monomer. A sheet is adhered inside the steel sheet, the thickness of the sheet being about 0.1 mm˜0.2 mm and the material of the sheet being a soundproof material.
Opening claim text (preview).
The invention claimed is: 1. A speaker module comprising: a module lower housing; a module upper housing; and a steel sheet, wherein: the module lower housing, the module upper housing, and the steel sheet are jointed together in sequence; a single speaker piece is accommodated in a space enclosed by the module lower housing, the module upper housing and the steel sheet; the single speaker piece, the module upper housing and the steel sheet together enclose a front acoustic cavity of the module; the front acoustic cavity is in communication with a sound aperture of the module; the sound aperture is positioned in a lateral portion of the single speaker piece; and a thin sheet made of a sound insulation material and being 0.1 mm to 0.2 mm thick is adhered to the inner side of the steel sheet. 2. The speaker module according to claim 1 , wherein: a recess portion that extends towards an inner cavity of the module and is 0.1 mm to 0.2 mm deep is provided at a position, corresponding to the single speaker piece, of the steel sheet, and the thin sheet is adhered to a position where the recess portion is located. 3. The speaker module according to claim 2 , wherein the thin sheet is positioned away from the sound aperture. 4. The speaker module according to claim 3 , wherein the thin sheet and the recess portion are each 0.15 mm thick. 5. The speaker module according to claim 1 , wherein the sound insulation material is selected from one of PET, bakelite, or Acrylic. 6. The speaker module according to claim 5 , wherein: the steel sheet is adhesively jointed with the module upper housing; a joint portion which is recessed downwards is provided at a position where the module upper housing is jointed with the steel sheet; and the steel sheet is adhered to the joint portion where an outer surface of the steel sheet is flush with an outer surface of the module upper housing or is slightly lower than the outer surface of the module upper housing. 7. The speaker module according to claim 6 , wherein: the sound aperture is provided in a lateral portion of the module upper housing; and a gap, which forms an adhesive accommodating slot, is provided between a sidewall of the joint portion, close to the sound aperture side, and a sidewall of the steel sheet. 8. The speaker module according to claim 7 , wherein: the single speaker piece comprises a single front cover piece and a single housing piece which are jointed together; a vibrating system and a magnetic circuit system are accommodated inside a space enclosed by the single front cover piece and the single housing piece; the single housing piece is of an annular structure having two open ends; and a bottom of a basin frame of the magnetic circuit system is exposed to a lower open end of the single housing piece. 9. The speaker module according to claim 8 , wherein: an outer surface of the bottom of the basin frame protrudes out of a lower end surface of the single housing piece; a mounting hole which is adaptive with the bottom of the basin frame is provided in a position, corresponding to the bottom of the basin frame, of the module lower housing; the bottom of the basin frame is positioned at the mounting hole; and the outer surface of the bottom of the basin frame is flush with the outer surface of the module lower housing. 10. The speaker module according to claim 9 , wherein: a sidewall at one side of the single housing piece is provided with two wire outgoing slots; and two wires of a voice coil of the vibrating system extend out from the two wire outgoing slots respectively and are electrically connected with the FPCB.
Details · CPC title
Magnetic circuit · CPC title
for loudspeaker transducers · CPC title
Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title
for loudspeaker transducers · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.