Glass powder blend, glass powder paste and photoelectric package

Patent metadata

Field	Value
Publication number	US-10177338-B2
Application number	US-201414761866-A
Country	US
Kind code	B2
Filing date	Oct 30, 2014
Priority date	Mar 31, 2014
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.

First claim

The invention claimed is:

1. A glass powder blend consisting of glass powder and additives, wherein the additives are composed of copper powder, TeO 2 powder, and ceramic powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass % and the copper powder has an average particle diameter between 1.0 μm and 2.5 μm.

2. The glass powder blend according to claim 1 , wherein the TeO2 powder accounts for 3-6 mass % based on the total amount of the glass powder blend in 100 mass %.

3. The glass powder blend according to claim 1 , wherein the glass powder comprises V2O5 powder and P2O5 powder, wherein, based on the total amount of the glass powder blend in 100 mass %, the V2O5 powder accounts for 40-60 mass %, and the P2O5 powder accounts for 18-36 mass %.

4. The glass powder blend according to claim 1 , wherein the glass powder comprises PbO powder, B2O3 powder and ZnO powder, wherein, based on the total amount of the glass powder blend in 100 mass %, the PbO powder accounts for 45-60 mass %, the B2O3 powder accounts for 20-40 mass %, and the ZnO powder accounts for 10-15 mass %.

5. The glass powder blend according to claim 1 , wherein each of the components in the glass powder blend has an average particle diameter between 0.3 μm and 4 μm.

6. A glass powder paste characterized by comprising the glass powder blend according to claim 1 and a solvent for glass powder,
wherein the glass powder blend accounts for 25-75 mass % of the glass powder paste, with balance of the solvent for glass powder.

7. The glass powder paste according to claim 6 , wherein the solvent for glass powder comprises: based on the total amount of the solvent for glass powder in 100 mass %,
40-53 mass % of ethyl cellulose;
19-26 mass % of isopropanol;
12-15 mass % of resin;
5-10 mass % of terebinthina; and
4-10 mass % of ethanol.

8. The glass powder paste according to claim 7 , wherein the resin is epoxy resin or acrylic resin.

9. The glass powder paste according to claim 7 , wherein the terebinthina includes but not limited to terpinyl formate, terpinyl acetate and α-terpinyl propionate.

10. A photoelectric package, including a first substrate, a second substrate, a photoelectric element disposed between the first substrate and the second substrate and an encapsulating material surrounding the photoelectric element, wherein the encapsulating material connects the first substrate to the second substrate fixedly, the photoelectric package is characterized in that the encapsulating material is formed by curing the glass powder paste according to claim 6 and a solvent for glass powder with a laser.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Hong Rui
• Wang Dan
• Fujino Seiji

Classifications

• C03C8/10

  containing lead · CPC title

• C09D1/00

  Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances · CPC title

• C03C8/18

  containing free metals · CPC title

• C03C3/21 Primary

  containing titanium, zirconium, vanadium, tungsten or molybdenum · CPC title

• C09D17/002

  in organic medium (C09D17/003, C09D17/004 take precedence) · CPC title