Amorphous metal alloy electrodes in non-volatile device applications

Patent metadata

Field	Value
Publication number	US-10177310-B2
Application number	US-201415324691-A
Country	US
Kind code	B2
Filing date	Jul 30, 2014
Priority date	Jul 30, 2014
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A non-volatile memory device includes two electrodes and an active region disposed between and in electrical contact with the electrodes. The active region contains a switching material capable of carrying a species of dopants and transporting the dopants under an electrical field. The electrode is an amorphous conductive material comprising 5 to 90 at % of a first metal, 5 to 90 at % of a second metal, and 5 to 90 at % of a metalloid, wherein the metalloid is any of carbon, silicon, and boron. The metalloid, the first metal, and the second metal account for at least 70 at % of the amorphous conductive material.

First claim

What is claimed is:

1. A non-volatile memory device including:
two or three electrodes; and
an active region disposed between and in electrical contact with the electrodes, the active region comprising a primary active region and a dopant source region, the primary active region containing a switching material capable of carrying a species of dopants and transporting the dopants under an electrical field,
wherein at least one the electrodes comprises an amorphous metal alloy comprising
5 to 90 at % of a first metal, wherein the first metal is selected from the group consisting of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum,
5 to 90 at % of a second metal, wherein the second metal is selected from the group consisting of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum, wherein the second metal is different than the first metal; and
5 to 90 at % of a metalloid, wherein the metalloid is selected from the group consisting of carbon, silicon, and boron,

wherein the metalloid, the first metal, and the second metal account for at least 70 at % of the amorphous metal alloy.

2. The memory device of claim 1 , wherein the non-volatile memory device is a memristor.

3. The memory device of claim 1 , wherein each of the electrodes comprises the amorphous metal alloy.

4. The memory device of claim 1 , wherein the amorphous metal alloy further comprises from 5 to 85 at % of a third metal, wherein the third metal is selected from the group consisting of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum, and wherein the third metal is different than the first metal and the second metal.

5. The memory device of claim 1 , wherein the amorphous metal alloy further comprises from 0.1 to 15 at % of a dopant, the dopant being selected from the group consisting of nitrogen, oxygen, and mixtures thereof.

6. The memory device of claim 1 , wherein the amorphous metal alloy has a surface RMS roughness of less than 1 nm.

7. The memory device of claim 1 , wherein the amorphous metal alloy has a thermal stability of at least 400° C. and has an oxidation temperature of at least 700° C.

8. The memory device of claim 1 , wherein the amorphous metal alloy has an atomic dispersity of at least 12% between at least two of the metalloid, the first metal, and the second metal relative to one another.

9. The memory device of claim 1 , further comprising a selector disposed between at least one of the electrodes and the active region.

10. A nanoscale crossbar array comprising:
a first group of conductive nanowires running in a first direction;
a second group of conductive nanowires running in a second direction and intersecting the first group of conductive nanowires; and
a plurality of switching devices formed at intersections of the first and second groups of conductive nanowires, each switching device having a first electrode formed by a first nanowire of the first group and a second electrode formed by a second nanowire of the second group, and an active region disposed at the intersection between the first and second nanowires and comprising a primary active region and a dopant source region, the primary active region containing a switching material capable of carrying a species of dopants and transporting the dopants under an electrical field,
wherein the first electrode or the second electrode comprises an amorphous conductive material having a composition given by:
5 to 90 at % of a first metal, wherein the first metal is selected from the group consisting of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum,
5 to 90 at % of a second metal, wherein the second metal is selected from the group consisting of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum, wherein the second metal is different than the first metal, and
5 to 90 at % of a metalloid, wherein the metalloid is selected from the group consisting of carbon, silicon, and boron, and

wherein the metalloid, the first metal, and the second metal account for at least 70 at % of the amorphous conductive material.

11. The nanoscale crossbar array of claim 10 , wherein each switching device includes a selector.

12. The nanoscale crossbar array of claim 10 , wherein the switching devices are memristors.

13. The nanoscale crossbar array of claim 10 , wherein the amorphous conductive material has a surface RMS roughness of less than 1 nm.

14. The nanoscale crossbar array of claim 10 , wherein the amorphous conductive material has a thermal stability of at least 400° C. and has an oxidation temperature of at least 700° C.

15. The nanoscale crossbar array of claim 10 , wherein the amorphous conductive material has an atomic dispersity of at least 12% between the metalloid, the first metal, and the second metal relative to one another.

16. A method of manufacturing a non-volatile memory device with two or three electrodes and an active region disposed between and in electrical contact with the electrodes, the active region containing a primary active region and a dopant source region, the primary active region containing a switching material capable of carrying a species of dopants and transporting the dopants under an electrical field, wherein the method comprises:
forming at least one of the electrodes from an amorphous conductive material having a composition given by:
5 to 90 at % of a first metal, wherein the first metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum;
5 to 90 at % of a second metal, wherein the second metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, and wherein the second metal is different than the first metal; and
5 to 90 at % of a metalloid, wherein the metalloid is carbon, silicon, or boron;

wherein the metalloid, the first metal, and the second metal account for at least 70 at % of the amorphous conductive material.

17. The method of claim 16 , wherein the forming the at least one of the electrodes includes:
mixing the metalloid, the first metal, and the second metal to form a blend, and
sputtering the blend to form the amorphous conductive material.

18. The method of claim 17 , wherein the sputtering is performed in the presence of a dopant selected from the group consisting of nitrogen, oxygen, and mixtures thereof,
wherein the amorphous conductive material comprises from 0.1 to 15 at % of the dopant.

19. The method of claim 16 , wherein the amorphous conductive material further comprises from 5 to 85 at % of a third metal,
wherein the third metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, and
wherein the third metal is different than the first metal and the second metal.

20. The method of claim 16 , wherein the at least one of the electrodes has a surface RMS roughness of less than 1 nm, a thermal stability of at least 400° C., an oxidatio

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Gibson Gary
• Abbott Jr James Elmer
• Li Zhiyong

Classifications

• H01L27/2427

  Electricity · mapped topic

• H01L45/1206

  Electricity · mapped topic

• H01L45/085

  Electricity · mapped topic

• C22C27/04

  Alloys based on tungsten or molybdenum · CPC title

• H01L45/143

  Electricity · mapped topic