Semiconductor module and method of manufacturing semiconductor module

Patent metadata

Field	Value
Publication number	US-10177084-B2
Application number	US-201515534686-A
Country	US
Kind code	B2
Filing date	Nov 6, 2015
Priority date	Dec 12, 2014
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

An object of the invention is to manufacture a semiconductor module small. A metal wire (212) connecting a control electrode (101) and a control terminal (21) rises to form a first angle (θ1) from the control electrode (101) toward a first conductive portion (202), gradually goes in substantially parallel to the first conductive portion (202) as the metal wire approaches the first conductive portion (202), and is connected to the control terminal (21) to form a second angle (θ2) smaller than the first angle (θ1).

First claim

The invention claimed is:

1. A semiconductor module, comprising:
a first substrate;
a second substrate that is disposed to face the first substrate;
a first conductive portion that is provided on a side facing the second substrate in the first substrate;
a second conductive portion that is provided on a side facing the first substrate in the second substrate;
a first terminal that is bonded to the first conductive portion, and disposed between the first substrate and the second substrate;
a second terminal that is bonded to the second conductive portion, and disposed between the first substrate and the second substrate;
a control terminal that is disposed between the first substrate and the second substrate;
a semiconductor chip that includes a first electrode and a control electrode in one surface, and a second electrode in a surface opposite to the surface;
a metal wire that is drawn in an arc to connect the control terminal and the control electrode; and
a conductor block that is disposed between the first conductive portion and the second conductive portion,
wherein the semiconductor chip is configured such that the first electrode is connected to the first conductive portion of the first substrate through the conductor block, and the second electrode is connected to the second conductive portion of the second substrate,
wherein the metal wire rises to form a first angle from the control electrode toward the first conductive portion, gradually goes in substantially parallel to the first conductive portion as the metal wire approaches the first conductive portion, and is connected to the control terminal to form a second angle smaller than the first angle,
wherein the metal wire has a length exceeding “L 1 +√{square root over ((L 2 2 +L 3 2 ))}” where, L 1 is a distance between the first substrate and the control electrode in a direction perpendicular to the first conductive portion, L 2 is a distance between the first substrate and a connection point of the metal wire in the control terminal in a direction perpendicular to the first conductive portion, and L 3 is a distance between the control electrode and the connection point in a direction in parallel to the first conductive portion, and
wherein the metal wire has a place near to the first substrate with a distance equal to or less than 100 μm.

2. The semiconductor module according to claim 1 ,
wherein the first substrate and the second substrate have the same shape and the same size.

3. The semiconductor module according to claim 1 ,
wherein an end of the first conductive portion is formed in a straight shape in a surface where the control terminal is exposed from between the first substrate and the second substrate.

4. The semiconductor module according to claim 1 ,
wherein an end of the first substrate is formed in a straight shape in a surface where the control terminal is exposed from between the first substrate and the second substrate.

5. The semiconductor module according to claim 1 ,
wherein a shape of the metal wire projected to the first substrate is curved in a place near to the first conductive portion.

6. A method of manufacturing a semiconductor module that includes
a first substrate,
a second substrate that is disposed to face the first substrate,
a first conductive portion that is provided on a side facing the second substrate in the first substrate,
a second conductive portion that is provided on a side facing the first substrate in the second substrate,
a first terminal that is bonded to the first conductive portion, and disposed between the first substrate and the second substrate,
a second terminal that is bonded to the second conductive portion, and disposed between the first substrate and the second substrate,
a control terminal that is disposed between the first substrate and the second substrate,
a semiconductor chip that includes a first electrode and a control electrode in one surface, and a second electrode in a surface opposite to the surface,
a metal wire that is drawn in an arc to connect the control terminal and the control electrode, and
a conductor block that is disposed between the first conductive portion and the second conductive portion,
the method comprising:
bonding the second electrode to the second conductive portion of the second substrate;
bonding the conductor block to the first electrode of the semiconductor chip, and connecting the metal wire such that the control electrode and a bonding place of the control terminal by the metal wire interfere in a layout place of the first substrate;
bonding the first substrate to the conductor block while pressing the metal wire by the first substrate;
moving a position of the control terminal in a direction away from the first substrate to separate the metal wire from the first substrate; and
sealing a space between the first substrate and the second substrate by a transfer mold.

Assignees

• Hitachi Ltd

Inventors

• Tsuyuno Nobutake
• Ide Eiichi

Classifications

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title