Conductive connecting member and manufacturing method of same

Patent metadata

Field	Value
Publication number	US-10177079-B2
Application number	US-201113634079-A
Country	US
Kind code	B2
Filing date	Mar 18, 2011
Priority date	Mar 19, 2010
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

First claim

What is claimed is:

1. A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, said conductive connecting member comprising:
a porous body formed of a conductive paste, said conductive paste containing metal fine particles (P) having a mean primary particle diameter of 10 to 500 nm and an organic solvent (S), or the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R),
wherein said metal fine particles (P) are formed of copper,
said organic solvent (S) contains at least one of an alcohol and a polyalcohol having a boiling point of at least 100 degrees C. at a normal pressure and one or more than two hydroxyl groups within a molecule,
said conductive paste is heated so that the metal fine particles (P) are bonded, and
said porous body has a porosity of 6 to 9 volume % and a mean pore diameter of 15 to 120 nm.

2. The conductive connecting member according to claim 1 , wherein said conductive connecting member is a conductive bump to connect semiconductor devices.

3. The conductive connecting member according to claim 1 , wherein said conductive connecting member is a conductive die bonding portion to connect a semiconductor device and a conductive substrate.

4. The conductive connecting member according to claim 1 , further comprising a cover layer formed of a metal material different from that of the metal fine particles (P), said cover layer being formed on the metal fine particles (P).

5. A method of manufacturing a conductive connecting member comprising:
a step of mounting a conductive paste containing metal fine particles (P) having a mean primary particle diameter of 10 to 500 nm and an organic solvent (S), or the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) on a first electrode terminal or a first conductive substrate to form a conductive connecting member precursor;
a step of placing a second electrode terminal or a second conductive substrate on the conductive connecting member precursor; and
a step of heat-treating the first electrode terminal or the first conductive substrate, and the conductive connecting member precursor at a temperature of 150 to 350 degrees C. to form the conductive connecting member comprising a porous body containing the metal fine particles,
wherein said metal fine particles (P) are formed of copper,
said porous body has a porosity of 6 to 9 volume % and a mean pore diameter of 15 to 120 nm,
said metal fine particles (P) have a mass % of 50 to 85% relative to a total mass of the conductive paste,
said organic dispersion medium (D) has a mass % of 15 to 50% relative to the total mass of the conductive paste,
said organic solvent (S) has a mass % of 80 to 100% relative to a total mass of the organic dispersion medium, and
said organic binder (R) has a mass % of 0 to 20% relative to the total mass of the organic dispersion medium.

6. The method of manufacturing the conductive connecting member according to claim 5 , wherein in the step of mounting the conductive paste, said metal fine particles (P) includes first metal fine particles (P 1 ) formed of copper, and second metal fine particles (P 2 ) formed of one or more kinds selected from magnesium, aluminum, zinc, gallium, indium, tin, antimony, lead, bismuth, titanium, manganese, and germanium
said metal fine particles (P 1 ) have a mass % of 90 to 100% relative to a total mass of the metal fine particles (P 1 ) and the metal fine particles (P 2 ), and
said metal fine particles (P 2 ) have a mass % of 0 to 10% relative to the total mass of the metal fine particles (P 1 ) and the metal fine particles (P 2 ).

7. The method of manufacturing the conductive connecting member according to claim 6 , wherein said second metal fine particles (P 2 ) mixed with the first metal fine particles (P 1 ) form an alloy, or form a cover layer of the first metal fine particles (P 1 ).

8. The method of manufacturing the conductive connecting member according to claim 5 , wherein in the step of mounting the conductive paste, said organic solvent (S) includes one of:
an organic solvent (S 1 ) formed of an alcohol and/or a polyalcohol having a boiling point of at least 100 degrees C. at a normal pressure and one or more hydroxyl groups within a molecule thereof,
a first mixture of an organic solvent (SA) having an amide group, an organic solvent (SB) having a boiling point of 20 to 100 degrees C. at a normal pressure, and an organic solvent (SC) formed of an alcohol and/or a polyalcohol having a boiling point of at least 100 degrees C. at a normal pressure and one or more hydroxyl groups within a molecule thereof, said organic solvent (SA) having a volume % of 5 to 90% relative to a total volume of the first mixture, said organic solvent (SB) having a volume % of 5 to 45% relative to the total volume of the first mixture, said organic solvent (SC) having a volume % of 5 to 90% relative to a total volume of the first mixture, and
a second mixture of the organic solvent (SA) and the organic solvent (SC), said organic solvent (SA) having a volume % of 5 to 95% relative to a total volume of the second mixture, said organic solvent (SC) having a volume % of 5 to 95% relative to a total volume of the second mixture.

9. The method of manufacturing the conductive connecting member according to claim 8 , wherein said organic solvent (S 1 ) or said organic solvent (SC) is formed of at least one selected from the group consisting of ethylene glycol, diethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butandiol, 1,3-butanediol, 1,4-butanediol, 2-butene-1, 4-diol, 2,3-butanediol, pentanediol, hexanediol, octanediol, glycerol, 1,1,1-tris hydroxymethyl ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 1,2,6-hexanetriol, 1,2,3-hexanetriol, 1,2,4-butanetriol, 1,2,6-hexanetriol, 1,2,3-hexanetriol, 1,2,4-butanetriol, threitol, erythritol, pentaerythritol, pentitol, and hexitol.

10. The method of manufacturing the conductive connecting member according to claim 8 , wherein said organic solvent (SA) is formed of at least one selected from the group consisting of N-methylacetamide, N-methylformamide, N-methylpropaneamide, formamide, N,N-dimethylacetamide, 1,3-dimethyl-2-imidazolidinone, N,N-dimethylformamide, 1-methyl-2-pyrolidone, hexamethylphosphoric triamide, 2-pyrrolidinone, ε-caprolactam, and acetamide.

11. The method of manufacturing the conductive connecting member according to claim 8 , wherein said organic solvent (SB) is formed of at least one selected from the group consisting of an ether compound expressed by a general form R 1 —O—R 2 in which R 1 and R 2 are alkyl groups having carbon atoms from 1 to 4, an alcohol expressed by a general form R 3 —OH in which R 3 is an alkyl group having carbon atoms from 1 to 4, a ketone compound expressed by a general form R 4 —C(═O)—R 5 in which R 4 and R 5 are alkyl groups having carbon atoms from 1 to 2, and an amine compound expressed by a general form R 6 —(N—R 7 )—R 8 in which R 6 , R 7 and R 8 are hydrogen atoms or alkyl groups having carbon atoms from 0 to 2.

12. The method of manufacturing the conductive connecting member according to claim 8 , wherein said organic solvent (SB) is formed of one of:
an ether compound formed of at least one selected from the group consisting of diethyl ether, methyl propyl ether, dipropyl ether, diisopropyl ether, methyl-t-butyl ether, t-amyl methyl ether, divinyl ether, ethyl vinyl ether, and allyl ether;
an alcohol formed of at least one selected from the group consisting of methanol, ethanol,

Assignees

• Nishikubo Hideo
• Masumori Shunji
• Harada Takuya
• Ishii Tomohiro
• Fujiwara Hidemichi
• Furukawa Electric Co Ltd

Inventors

• Nishikubo Hideo
• Masumori Shunji
• Harada Takuya
• Ishii Tomohiro
• Fujiwara Hidemichi

Classifications

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/07331

  Connecting techniques · CPC title