Electrode material for thermal-fuse movable electrode

Patent metadata

Field	Value
Publication number	US-10176958-B2
Application number	US-201314389911-A
Country	US
Kind code	B2
Filing date	Apr 26, 2013
Priority date	May 7, 2012
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

The present invention is an electrode material constituting a movable electrode of a thermal fuse, having a five-layer clad structure including a core material layer, an intermediate layer formed on the both sides of the core material layer, and a surface layer formed on the intermediate layer, wherein the core material layer includes Cu, the intermediate layer includes an Ag—Cu-based alloy, the surface layer includes an Ag—CuO-based oxide-dispersed strengthened alloy, and the ratio of the thickness of the intermediate layer to the thickness of the surface layer (intermediate layer/surface layer) is 0.2 or more and 1.0 or less. This electrode material can be manufactured by partially internally oxidizing a three-layer clad material in which plate materials made of an Ag—Cu-based alloy are clad-jointed to both sides of the plate material made of Cu.

First claim

The invention claimed is:

1. An electrode material constituting a movable electrode of a thermal fuse, comprising:
a five-layer clad structure comprising
a core material layer comprising Cu,
an intermediate layer comprising an Ag—Cu-based alloy formed on the both sides of the core material layer, and
a surface layer comprising an Ag—CuO-based oxide-dispersed strengthened alloy formed on each intermediate layer,
wherein the Ag—Cu-based alloy as an intermediate layer does not have a dispersion layer,
the ratio of the thickness of the intermediate layer to the thickness of the surface layer is 0.2 or more and 1.0 or less, and
the thickness of the surface layer comprising an Ag—CuO-based oxide-dispersed strengthened alloy is 15 μm or more.

2. The electrode material according to claim 1 , wherein the Ag—CuO-based oxide-dispersed strengthened alloy constituting each surface layer is obtained by internally oxidizing either an Ag—Cu alloy of 3 to 12% by mass of Cu and the balance Ag or an Ag—Cu—Ni alloy of 3 to 12% by mass of Cu, 0.03 to 0.7% by mass of Ni and the balance Ag.

3. The electrode material according to claim 2 , wherein the Ag—Cu-based alloy constituting each intermediate layer comprises either an Ag—Cu alloy of 3 to 12% by mass of Cu and the balance Ag or an Ag—Cu—Ni alloy of 3 to 12% by mass of Cu, 0.03 to 0.7% by mass of Ni and the balance Ag.

4. The electrode material according to claim 3 , wherein Cu constituting the core material layer is either an oxygen-free copper or a tough pitch copper.

5. The electrode material according to claim 4 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

6. The electrode material according to claim 3 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

7. The electrode material according to claim 2 , wherein Cu constituting the core material layer is either an oxygen-free copper or a tough pitch copper.

8. The electrode material according to claim 7 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

9. The electrode material according to claim 2 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

10. The electrode material according to claim 1 , wherein the Ag—Cu-based alloy constituting each intermediate layer comprises either an Ag—Cu alloy of 3 to 12% by mass of Cu and the balance Ag or an Ag—Cu—Ni alloy of 3 to 12% by mass of Cu, 0.03 to 0.7% by mass of Ni and the balance Ag.

11. The electrode material according to claim 10 , wherein Cu constituting the core material layer is either an oxygen-free copper or a tough pitch copper.

12. The electrode material according to claim 11 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

13. The electrode material according to claim 10 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

14. The electrode material according to claim 1 , wherein Cu constituting the core material layer is either an oxygen-free copper or a tough pitch copper.

15. The electrode material according to claim 14 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

16. The electrode material according to claim 1 , wherein the surface layer is formed by partially internally oxidizing a monolayer plate material comprising an Ag—Cu-based alloy.

17. A method for manufacturing the electrode material as defined in claim 1 comprising the steps of:
jointing an intermediate layer plate material comprising an Ag—Cu-based alloy to both sides of a core material layer comprising Cu to form a clad material; and
heat-treating the clad material to internally oxidize a part of the intermediate layer plate material comprising an Ag—Cu-based alloy to form a surface layer comprising an Ag—CuO-based oxide-dispersed strengthened alloy.

18. The method for manufacturing the electrode material according to claim 17 , wherein heat-treating the clad material is performed at a heat-treating temperature of 500 to 700° C., an oxygen partial pressure of 0.01 MPa to 0.3 MPa, and a heat-treating time of 3 to 15 hours.

19. The method of claim 17 , wherein the Ag—CuO-based oxide-dispersed strengthened alloy constituting each surface layer is obtained by internally oxidizing either an Ag—Cu alloy of 3 to 12% by mass of Cu and the balance Ag or an Ag—Cu—Ni alloy of 3 to 12% by mass of Cu, 0.03 to 0.7% by mass of Ni and the balance Ag.

20. The electrode material according to claim 17 , wherein the Ag—Cu-based alloy constituting each intermediate layer comprises either an Ag—Cu alloy of 3 to 12% by mass of Cu and the balance Ag or an Ag—Cu—Ni alloy of 3 to 12% by mass of Cu, 0.03 to 0.7% by mass of Ni and the balance Ag.

Assignees

• Tanaka Precious Metal Ind

Inventors

• Sakaguchi Osamu
• Takahashi Michiya
• Adachi Shinya

Classifications

• B32B15/018

  one layer being formed of a noble metal or a noble metal alloy · CPC title

• C22F1/14

  of noble metals or alloys based thereon · CPC title

• H01H2011/047

  on both sides of the contact body portion · CPC title

• C22C5/06 Primary

  Alloys based on silver · CPC title

• H01H85/143 Primary

  Electrical contacts; Fastening fusible members to such contacts · CPC title