Electronic component and manufacturing method for same

Patent metadata

Field	Value
Publication number	US-10176918-B2
Application number	US-201615371657-A
Country	US
Kind code	B2
Filing date	Dec 7, 2016
Priority date	Dec 14, 2015
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

An electronic component includes a first ceramic substrate having a first principal surface on the upper side and a second principal surface on the lower side, a multilayer body constituted by a plurality of insulator layers each made of a material containing resin and laminated on the first principal surface, a first coil disposed in and/or on the multilayer body, a first relay conductor connected to the first coil, and a first outer electrode disposed on the first ceramic substrate and electrically connected to the first relay conductor. The plurality of insulator layers include one or more first insulator layers in each of which a first corner has a shape cut away as a first cut-away portion, the first relay conductor is disposed in the first cut-away portion, and the plurality of insulator layers include a second insulator layer that is contacted with the first relay conductor from below.

First claim

What is claimed is:

1. An electronic component comprising:
a first ceramic substrate having a substantially rectangular first principal surface that is positioned on one side in a laminating direction, and a substantially rectangular second principal surface that is positioned on the other side in the laminating direction;
a multilayer body constituted by a plurality of substantially rectangular parallelepiped insulator layers each made of a material containing resin or glass, the plurality of insulator layers being laminated on the first principal surface in the laminating direction;
a first coil disposed in and/or on the multilayer body;
a first relay conductor disposed in and/or on the multilayer body and electrically connected to the first coil; and
a first outer electrode disposed on one surface of the first ceramic substrate and electrically connected to the first relay conductor,
wherein the plurality of insulator layers include one or more first insulator layers in each of which a first corner has a shape cut away as a first cut-away portion,
the first relay conductor is disposed in the first cut-away portion, and
the plurality of insulator layers include a second insulator layer positioned along the laminating direction between the first ceramic substrate and the first relay conductor, the second insulator layer being in contact with the first relay conductor from a side of the first relay conductor facing the first principal surface of the first ceramic substrate in the laminating direction.

2. The electronic component according to claim 1 , wherein the plurality of insulator layers further include a third insulator layer that is contacted with the first relay conductor from the one side in the laminating direction.

3. The electronic component according to claim 1 , wherein the first ceramic substrate has a shape that a ridge overlapping the first relay conductor when viewed in the laminating direction is cut away as a second cut-away portion,
the second cut-away portion reaches the multilayer body such that the first relay conductor partly constitutes a peripheral surface of the second cut-away portion, and
the first outer electrode is disposed on the peripheral surface of the second cut-away portion such that the first outer electrode is electrically connected to the first relay conductor.

4. The electronic component according to claim 1 , further comprising:
a second relay conductor disposed in and/or on the multilayer body and electrically connected to the first coil; and
a second outer electrode disposed on one surface of the first ceramic substrate and electrically connected to the second relay conductor,
wherein the plurality of insulator layers include one or more fourth insulator layers in each of which a second corner has a shape cut away as a third cut-away portion,
the second relay conductor is disposed in the third cut-away portion, and
the second insulator layer is contacted with the second relay conductor from the other side in the laminating direction.

5. The electronic component according to claim 1 , further comprising:
a second ceramic substrate that sandwiches the multilayer body between the second ceramic substrate and the first ceramic substrate in the laminating direction,
wherein the first ceramic substrate and the second ceramic substrate are each made of a magnetic material.

6. The electronic component according to claim 1 , wherein, when viewed in the laminating direction, a value of a ratio of an area of a region where the first relay conductor and the second insulator layer contact each other to an area of the first relay conductor is not less than about 0.42 and not more than about 0.82.

7. The electronic component according to claim 1 , wherein the first relay conductor is not contacted with the first principal surface of the first ceramic substrate.

8. The electronic component according to claim 1 , further comprising:
a second coil disposed in and/or on the multilayer body and constituting a common-mode choke coil in combination with the first coil.

9. The electronic component according to claim 8 , further comprising:
a third relay conductor disposed in and/or on the multilayer body and electrically connected to the second coil; and
a third outer electrode disposed on one surface of the first ceramic substrate and electrically connected to the third relay conductor,
wherein the plurality of insulator layers include one or more fifth insulator layers in each of which a third corner has a shape cut away as a fourth cut-away portion,
the third relay conductor is disposed in the fourth cut-away portion, and
the second insulator layer is contacted with the third relay conductor from the other side in the laminating direction.

10. A method for manufacturing an electronic component comprising:
a first step of forming a mother multilayer body; and
a second step of firing the mother multilayer body, to manufacture the electronic component comprising:
a first ceramic substrate having a substantially rectangular first principal surface that is positioned on one side in a laminating direction, and a substantially rectangular second principal surface that is positioned on the other side in the laminating direction;
a multilayer body constituted by a plurality of substantially rectangular parallelepiped insulator layers each made of a material containing resin or glass, the plurality of insulator layers being laminated on the first principal surface in the laminating direction;
a first coil disposed in and/or on the multilayer body;
a first relay conductor disposed in and/or on the multilayer body and electrically connected to the first coil; and
a first outer electrode disposed on one surface of the first ceramic substrate and electrically connected to the first relay conductor,

the plurality of insulator layers include one or more first insulator layers in each of which a first corner has a shape cut away as a first cut-away portion,
the first relay conductor is disposed in the first cut-away portion,
the plurality of insulator layers include a second insulator layer positioned along the laminating direction between the first ceramic substrate and the first relay conductor, the second insulator layer being in contact with the first relay conductor from a side of the first relay conductor facing the first principal surface of the first ceramic substrate in the laminating direction, and
wherein
the first step includes, on each of the first principal surfaces of the plurality of first ceramic substrates arrayed in a first mother substrate, forming a plurality of paste layers, which are to become the plurality of insulator layers, with use of a material containing glass, and forming a coil conductor layer that is to become the first coil and a relay conductor layer that is to become the first relay conductor, thus forming the mother multilayer body in which the plurality of green multilayer bodies in a state not yet fired are arrayed.

11. The manufacturing method according to claim 10 ,
wherein, in the first step, after forming a first paste layer, which is to become the second insulator layer, on the first principal surface, a first relay conductor layer that is to become a part of the first relay conductor is formed on the first paste layer,
the manufacturing method for the electronic component further comprises:
a third step of forming a through-hole penetrating respective regions of the first mother substrate and the second insulator layer, the respective regions overlapping the first relay conductor when viewed in the laminating direction;
a fourth step of forming a part of the outer electrode by forming a conduct

Assignees

• Murata Manufacturing Co

Inventors

• Ishida Kosuke
• Katsuta Mizuho
• Karino Jun
• Nakatsuji Yoichi

Classifications

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F41/0233

  Manufacturing of magnetic circuits made from sheets (magnetic cores made from sheets H01F27/245; soft magnetic alloys in the form of sheets H01F1/16) · CPC title

• H01F27/245

  made from sheets, e.g. grain-oriented (H01F27/26 takes precedence) · CPC title

• H01F2027/2809

  on stacked layers · CPC title