Thermal protection mechanisms for uncooled microbolometers

Patent metadata

Field	Value
Publication number	US-10175113-B2
Application number	US-201715485942-A
Country	US
Kind code	B2
Filing date	Apr 12, 2017
Priority date	Apr 12, 2017
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

Methods and apparatus for preventing solar damage, and other heat-related damage, to uncooled microbolometer pixels. In certain examples, at least some of the pixels of an uncooled microbolometer are configured with a bimetallic thermal shorting structure that protects the pixel(s) from excessive heat damage. In other examples a thermochroic membrane that becomes highly reflective at temperatures above a certain threshold is applied over the microbolometer pixels to prevent the pixels from being damaged by excessive heat.

First claim

What is claimed is:

1. An uncooled microbolometer comprising:
a base substrate;
a plurality of pixels arranged in an array on the base substrate, each pixel including a sensor layer supported above the base substrate by at least two first supports, and an infrared absorbing layer supported above and thermally isolated from the sensor layer by at least one second support; and
at least one bimetallic switch coupled to a corresponding at least one pixel of the array of pixels, the bimetallic switch including a first layer of a first material and a second layer of a second material, and being configured to thermally short the corresponding at least one pixel to the base substrate in response to a temperature of the corresponding at least one pixel reaching a predetermined threshold.

2. The uncooled microbolometer of claim 1 further comprising a ground contact disposed on the base substrate, the at least one bimetallic switch being configured to thermally short the corresponding at least one pixel to ground via the ground contact.

3. The uncooled microbolometer array of claim 2 wherein the ground contact is electrically connected to one of the at least two first supports of each pixel.

4. The uncooled microbolometer array of claim 2 , wherein a first one of the at least two first supports is connected to the ground contact, and wherein in a neutral state the at least one bimetallic switch is disposed parallel with the infrared absorbing layer of the corresponding at least one pixel, and in a shorting state the at least one bimetallic switch is deflected away from the infrared absorbing layer to contact the first one of the at least two first supports.

5. The uncooled microbolometer of claim 1 wherein in a neutral state the at least one bimetallic switch is disposed parallel with the infrared absorbing layer of the corresponding at least one pixel, and in a shorting state the at least one bimetallic switch is deflected away from the infrared absorbing layer to thermally short the corresponding at least one pixel to the base substrate.

6. The uncooled microbolometer of claim 1 wherein the at least one bimetallic switch is coupled to the infrared absorbing layer.

7. The uncooled microbolometer of claim 1 wherein the at least one bimetallic switch is coupled to the second support.

8. The uncooled microbolometer of claim 1 wherein the first material is titanium and the second material is aluminum.

9. The uncooled microbolometer of claim 1 wherein the first material is titanium and the second material is silicon nitride.

10. The uncooled microbolometer of claim 1 wherein the first material is aluminum and the second material is silicon nitride.

11. The uncooled microbolometer of claim 1 wherein the at least one bimetallic switch includes a plurality of bimetallic switches, each bimetallic switch of the plurality of bimetallic switches being coupled to a corresponding one of the plurality of pixels.

12. The uncooled microbolometer of claim 1 further comprising a cap layer disposed over the plurality of pixels and coupled to the base substrate, the cap layer configured to provide a cavity between a first surface of the base substrate and a second surface of the cap layer, the plurality of pixels being disposed within the cavity.

13. The uncooled microbolometer array of claim 12 wherein the cap layer is made of silicon nitride.

14. The uncooled microbolometer array of claim 1 further comprising:
a read-out integrated circuit formed in the base substrate and coupled to at least one of the at least two first supports of each pixel, the read-out integrated circuit being configured to receive and process signals from the plurality of pixels to provide output data for constructing an image.

Assignees

• Raytheon Co

Inventors

• Masini Paolo
• Devitt John William

Classifications

• B81B7/0019 Primary

  Protection against thermal alteration or destruction (B81B7/0083 takes precedence) · CPC title

• B81B3/0081

  Thermal properties · CPC title

• G01J5/045

  Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements (getter arrangements per se H10W76/48, H10P36/03) · CPC title

• G01J1/02

  Details · CPC title

• G01J5/20

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title