Low-cost nano-heat pipe

US10175005B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10175005-B2
Application numberUS-201514673584-A
CountryUS
Kind codeB2
Filing dateMar 30, 2015
Priority dateMar 30, 2015
Publication dateJan 8, 2019
Grant dateJan 8, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat pipe device, comprising: a body section having a set of body section surfaces, the set of body section surfaces including a top surface, a bottom surface, and a set of body section side surfaces, the body section including a cavity extending from the top surface toward the bottom surface, the cavity including a bottom surface and a set of cavity side surfaces, the cavity being covered by a lid attaching to the top surface of the body section, an opening extending through a portion of the body section, the opening having a first end provided in the bottom surface and a second end provided in a side surface of the body section, the opening having a bend between the first and second ends, such that the portion of the body section surrounds the opening, the cavity being hermetically sealable by the lid, the body section, and a cover that covers the opening into the body section, the bottom surface of the cavity including a set of corrugations. 2. The heat pipe device of claim 1 , the lid being configured to attach to a heat generating module, the heat generating module being affixed to the lid. 3. The heat pipe device of claim 1 , the cavity being configured to receive a working fluid that fills the cavity to a level approximately even with a top surface of the set of corrugations. 4. The heat pipe device of claim 3 , where the cavity includes a working fluid in a liquid state and the working fluid in a gaseous state. 5. The heat pipe device of claim 1 , where the set of corrugations are stamped or etched into the bottom surface of the cavity. 6. The heat pipe device of claim 1 , where the set of corrugations are attached to the bottom surface of the cavity. 7. The heat pipe device of claim 1 , where the cavity is stamped into the body section. 8. The heat pipe device of claim 1 , where the cavity is etched into the body section. 9. A heat pipe, comprising: a body section, the body section being at least partially covered by a lid that is less than approximately 35 square millimeters in size, the lid covering a cavity in the body section, the cavity having a corrugated region extending along a portion of a bottom surface of the body section, the bottom surface of the body section having an opening extending through a portion of the body section from a first end in the bottom surface to a second end in a side surface of the body section, the opening including a bend between the first and second ends, such that the portion of the body section surrounds the opening, the corrugated region having multiple corrugations, each corrugation, of the multiple corrugations, being less than approximately 0.75 millimeters in height and being separated from one or more other corrugations, of the multiple corrugations, by less than approximately 0.1 millimeters. 10. The heat pipe of claim 9 , wherein the opening facilitating evacuation of air from the cavity and injection of a working fluid into the cavity, the opening being hermetically sealable. 11. The heat pipe of claim 9 , where a particular separation between a first corrugation, of the multiple corrugations, and a second corrugation, of the multiple corrugations, is selected based on a capillary movement of a working fluid injected into the cavity. 12. The heat pipe of claim 9 , where the body section is a three-dimensionally printed body section; and where the corrugated bottom surface is a three-dimensionally printed corrugated bottom surface. 13. The heat pipe of claim 9 , where the body section is further comprised of multiple body sections, the multiple body sections being separately fabricated, the multiple body sections being attached together.

Assignees

Inventors

Classifications

  • for cooling by change of state · CPC title

  • Assembling together parts thereof · CPC title

  • heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

  • Heat pipes · CPC title

  • Means for filling or sealing heat pipes · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10175005B2 cover?
A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may…
Who is the assignee on this patent?
Infinera Corp
What technology area does this patent fall under?
Primary CPC classification F28D15/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jan 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).