Method for transferring an adhesive layer of thermoplastic polymer(s) from a first substrate to a second substrate
US-2024093063-A1 · Mar 21, 2024 · US
US10174223B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10174223-B2 |
| Application number | US-201414556090-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 28, 2014 |
| Priority date | Nov 30, 2013 |
| Publication date | Jan 8, 2019 |
| Grant date | Jan 8, 2019 |
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In some variations, the invention provides a curable adhesive formulation comprising a curable liquid precursor capable of frontal polymerization, wherein the liquid precursor comprises a monomer and a polymerization catalyst, and frontal-polymerization-triggering susceptors in contact with, or contained within, the liquid precursor. The susceptors may include conducting and/or magnetic solid particles capable of induction heating in the presence of a remotely applied electromagnetic field. Other variations provide a polymer-curing system comprising a curable liquid precursor, frontal-polymerization-triggering susceptors, and an apparatus configured to remotely produce an alternating electromagnetic field in line-of-sight with the susceptors (but not necessarily in line-of-sight with the liquid precursor), thereby generating induction heating to initiate the frontal polymerization. The susceptors may be about 0.1 wt % to about 50 wt % of the curable formulation. Other variations provide a method of curing an adhesive joint through an opaque barrier.
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What is claimed is: 1. A curable formulation comprising: (a) a curable liquid precursor capable of frontal polymerization, wherein said liquid precursor comprises a monomer and a polymerization catalyst; and (b) a frontal-polymerization-triggering single conducting and/or magnetic susceptor layer that is in contact with and on top of said liquid precursor, wherein said susceptor layer is capable of heating in the presence of a remotely applied electromagnetic field. 2. The curable formulation of claim 1 , wherein said formulation further comprises multiple susceptors dispersed within said liquid precursor. 3. The curable formulation of claim 2 , wherein said suceptors are present at a concentration from about 0.1 wt % to about 50 wt % in said curable formation. 4. The curable formulation of claim 3 , wherein said susceptors are present at a concentration from about 5 wt % to about 25 wt % in said curable formulation. 5. The curable formulation of claim 2 , wherein said multiple susceptors contain a material selected from the group consisting of iron, nickel, zinc, chromium, oxides or alloys containing iron, oxides or alloys containing nickel, oxides or alloys containing zinc, oxides or alloys containing chromium, carbon, and combinations thereof. 6. The curable formulation of claim 1 , wherein said liquid precursor further comprises an accelerator. 7. The curable formulation of claim 6 , wherein said accelerator is a polyol. 8. The curable formulation of claim 1 , wherein said monomer is an epoxy resin. 9. The curable formulation of claim 1 , wherein said polymerization catalyst is a latent catalyst comprising a tertiary amine. 10. The curable formulation of claim 1 , wherein said polymerization catalyst is a latent catalyst comprising a boron trifluoride-amine complex. 11. The curable formulation of claim 1 , wherein said formulation is an adhesive formulation. 12. A polymer-curing system comprising: (a) a curable liquid precursor capable of frontal polymerization, wherein said liquid precursor comprises a monomer and a polymerization catalyst; and (b) a frontal-polymerization-triggering single conducting and/or magnetic susceptor layer that is in contact with and on top of said liquid precursor, wherein said susceptor layer is capable of heating in the presence of an electromagnetic field; and (c) an apparatus configured to remotely impose an alternating electromagnetic field on said susceptor layer, thereby generating said heating to initiate said frontal polymerization. 13. The system of claim 12 , wherein said system further comprises multiple susceptors dispersed within said liquid precursor. 14. The system of claim 13 , wherein said susceptors are present at a concentration from about 0.1 wt % to about 5 wt % in said liquid precursor. 15. The system of claim 13 , wherein said multiple susceptors contain a material selected from the group consisting of iron, nickel, zinc, chromium, oxides or alloys containing iron, oxides or alloys containing nickel, oxides or alloys containing zinc, oxides or alloys containing chromium, carbon, and combinations thereof. 16. The system of claim 12 , wherein said alternating electromagnetic field is not in line-of-sight with at least a portion of said curable liquid precursor. 17. The system of claim 16 , wherein said alternating electromagnetic field is not in line-of-sight with any of said curable liquid precursor. 18. The system of claim 12 , wherein said liquid precursor further comprises an accelerator. 19. The system of claim 18 , wherein said accelerator is a polyol. 20. The system of claim 12 , wherein said monomer is an epoxy resin. 21. The system of claim 12 , wherein said polymerization catalyst is a latent catalyst comprising a tertiary amine. 22. The system of claim 12 , wherein said polymerization catalyst is a latent catalyst comprising a boron trifluoride-amine complex.
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title
involving heating of the applied adhesive · CPC title
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