Polymer films

US10173469B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10173469-B2
Application numberUS-201414894386-A
CountryUS
Kind codeB2
Filing dateMay 27, 2014
Priority dateMay 27, 2013
Publication dateJan 8, 2019
Grant dateJan 8, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a polymer film which includes: a base film layer including a polyamide-based resin having a particular relative viscosity and a copolymer including a polyamide-based segment and a polyether-based segment having a specific content; and an adhesive layer formed on at least one side of the base film layer, wherein a ratio of the melt viscosity of the copolymer to the melt viscosity of the polyamide resin is 0.65 to 1.2 at a shear rate of 1000 s−1 and a temperature of 260° C.

First claim

Opening claim text (preview).

What is claimed is: 1. A polymer film which comprises: a base film layer comprising a polyamide-based resin having a relative viscosity (96% sulfuric acid solution) of 3.0 to 3.5, an olefinic polymer compound, and a copolymer comprising a polyamide-based segment and a polyether-based segment; and an adhesive layer formed on at least one side of the base film layer and containing resorcinol-formalin-latex (RFL)-based adhesive, wherein a content of the polyether-based segment of the copolymer is more than 2% by weight and less than 15% by weight with respect to the total weight of the base film layer, and wherein a ratio of a melt viscosity of the copolymer to a melt viscosity of the polyamide resin is 0.60 to 1.2 at a shear rate of 1000 s−1 and a temperature of 260° C., and the olefinic polymer compound includes a dicarboxylic acid or its acid anhydride-grafted olefinic polymer or copolymer, wherein the polyamide-based resin, the copolymer, and the olefinic polymer compound, respectively are included in a weight ratio of 2:2:1 to 3.5:6.5:2 in the base film layer. 2. The polymer film of claim 1 , wherein the polymer film is used for a tire inner liner. 3. The polymer film of claim 1 , wherein the ratio of the melt viscosity of the copolymer to the melt viscosity of the polyamide resin is 1.0 to 2.0 at a shear rate of 100 s− 1 and a temperature of 260° C. 4. The polymer film of claim 1 , wherein the ratio of the melt viscosity of the copolymer to the melt viscosity of the polyamide resin is 0.60 to 1.1 at a shear rate of 2000 s− 1 and a temperature of 260° C. 5. The polymer film of claim 1 , wherein the ratio of the melt viscosity of the copolymer to the melt viscosity of the polyamide resin is 0.7 to 1.5 at a shear rate of 500 s− 1 and a temperature of 260° C. 6. The polymer film of claim 1 , wherein the grafted dicarboxylic acid or its acid anhydride is contained in an amount of 0.1% to 10% by weight. 7. The polymer film of claim 1 , wherein the base film layer includes 0.1% by weight to 40% by weight of the olefinic polymer compound. 8. The polymer film of claim 1 , wherein the relative viscosity (96% sulfuric acid solution) of the polyamide-based resin is 3.2 to 3.4. 9. The polymer film of claim 1 , wherein the absolute weight average molecular weight of the copolymer containing polyamide-based segments and polyether-based segments is 50,000 to 300,000. 10. The polymer film of claim 1 , wherein the polyamide-based segment includes a repeating unit of the following Chemical Formula 1 or Chemical Formula 2: wherein, in Chemical Formula 1, R 1 is a linear or branched alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, or a linear or branched arylalkylene group having 7 to 20 carbon atoms; and wherein, in Chemical Formula 2, R 2 is a linear or branched alkylene group having 1 to 20 carbon atoms, and R 3 is a linear or branched alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, or a linear or branched arylalkylene group having 7 to 20 carbon atoms. 11. The polymer film of claim 1 , wherein the polyether-based segment of the copolymer includes a repeating unit of the following Chemical Formula 3: —R 6 R 5 —O n R 7 —  [Chemical Formula 3] wherein, in Chemical Formula 3, R 5 is a linear or branched alkylene group having 1 to 10 carbon atoms, n is an integer of 1 to 100, and R 6 and R 7 may be identical or different, and are independently a direct bond, —O—, —NH—, —COO—, or —CONH—. 12. The polymer film of claim 1 , wherein the copolymer includes the polyamide-based segment and the polyether-based segment in a weight ratio of 1:9 to 9:1. 13. The polymer film of claim 1 , wherein the base film layer has a thickness of 30 μm to 300 μm, and the adhesive layer has a thickness of 0.1 μm to 20 μm. 14. The polymer film of claim 1 , wherein the base film layer is an undrawn film. 15. The polymer film of claim 1 , wherein the resorcinol-formalin-latex (RFL)-based adhesive includes 2% to 30% by weight of a condensate of resorcinol and formaldehyde and 68% to 98% by weight of a latex.

Assignees

Inventors

Classifications

  • with polyhydric phenols · CPC title

  • B60C1/0008Primary

    Compositions of the inner liner · CPC title

  • based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds · CPC title

  • in the substrate · CPC title

  • Manufacture of films or sheets · CPC title

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What does patent US10173469B2 cover?
There is provided a polymer film which includes: a base film layer including a polyamide-based resin having a particular relative viscosity and a copolymer including a polyamide-based segment and a polyether-based segment having a specific content; and an adhesive layer formed on at least one side of the base film layer, wherein a ratio of the melt viscosity of the copolymer to the melt viscosi…
Who is the assignee on this patent?
Kolon Inc
What technology area does this patent fall under?
Primary CPC classification B60C1/0008. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).