Method for creating separation start portion for layered bodies, device for creating separation start portion, and electronic device manufacturing method

Patent metadata

Field	Value
Publication number	US-10173408-B2
Application number	US-201715616251-A
Country	US
Kind code	B2
Filing date	Jun 7, 2017
Priority date	Dec 26, 2014
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

In a peeling starting portion preparing method of a laminate, for the laminate including a first substrate and a second substrate peelably attached via an adsorption layer, a knife is inserted with a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer so as to prepare the peeling starting portion at the interface. The knife includes a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, and at least a part of the adsorption layer is scraped off by a ridge line portion including the ridge line.

First claim

The invention claimed is:

1. A method for preparing a peeling starting portion of a laminate, comprising:
inserting a knife into a laminate comprising a first substrate and a second substrate peelably attached via an adsorption layer such that the knife is inserted a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer and a peeling starting portion is prepared at the interface,
wherein the knife comprises a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, at least a part of the adsorption layer is scraped off by a ridge line portion comprising the ridge line, and the ridge line portion has one of a shape having a plurality of through holes at positions crossing the ridge line and a shape having a corrugated ridge line having crest portions and valley portions alternately formed when viewed from the cutting edge of the knife.

2. The method according to claim 1 , wherein the ridge line portion has the shape having the plurality of through holes.

3. The method according to claim 2 , wherein at least one of the through holes is a through hole having a burr.

4. The method according to claim 2 , wherein at least two of the through holes are through holes each having a burr, and two of the burrs have projecting directions opposite to each other.

5. The according to claim 1 , wherein the ridge line portion has the shape having the corrugated ridge line.

6. The method according to claim 1 , wherein the ridge line portion has particles.

7. A device for preparing a peeling starting portion, comprising:
a knife;
a laminate holding device that holds a laminate comprising a first substrate and a second substrate peelably attached via an adsorption layer;
a knife holding device that holds the knife; and
a moving device that relatively moves the laminate holding device and the knife holding device and inserts the knife into the laminate a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer,
wherein the knife comprises a main body portion, a tapered cutting edge portion continuous with the main body portion and a ridge line which is a boundary between the main body portion and the cutting edge portion, a ridge line portion comprising the ridge line has one of a shape having a plurality of through holes at positions crossing the ridge line and a shape having a corrugated ridge line having crest portions and valley portions alternately formed when viewed from the cutting edge of the knife such that each of the shapes is configured to scrape off at least a part of the adsorption layer.

8. The device according to claim 7 , wherein the ridge line portion has the shape having the plurality of through holes.

9. The device according to claim 8 , wherein at least one of the through holes is a through hole having a burr.

10. The device according to claim 8 , wherein at least two of the through holes are through holes each having a burr, and two of the burrs have projecting directions opposite to each other.

11. The device according to claim 7 , wherein the ridge line portion has the shape having the corrugated ridge line.

12. The device according to claim 7 , wherein the ridge line portion particles.

13. A method for manufacturing an electronic device, comprising:
forming a function layer on a laminate comprising a first substrate and a second substrate peelably attached via an adsorption layer such that the functional layer is formed on a surface of the first substrate; and
peeling the first substrate, on which the functional layer is formed, from the second substrate,
wherein the peeling comprises inserting a knife a predetermined amount from an end surface of the laminate at an interface between the first substrate and the adsorption layer such that a peeling starting portion is prepared at the interface, and peeling the interface from the peeling starting portion as a starting point, the knife comprises a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, at least a part of the adsorption layer is scraped off by a ridge line portion comprising the ridge line, and the ridge line portion has one of a shape having a plurality of through holes at positions crossing the ridge line and a shape having a corrugated ridge line having crest portions and valley portions alternately formed when viewed from the cutting edge of the knife.

14. The method according to claim 13 , wherein the ridge line portion has the shape having the plurality of through holes.

15. The method according to claim 14 , wherein at least one of the through holes is a through hole having a burr.

16. The method according to claim 14 , wherein at least two of the through holes are through holes each having a burr, and two of the burrs have projecting directions opposite to each other.

17. The method according to claim 13 , wherein the ridge line portion has the shape having the corrugated ridge line.

18. The method according to claim 13 , wherein the ridge line portion has particles.

Assignees

• Asahi Glass Co Ltd
• Agc Inc

Inventors

• Tateyama Yuki
• Ito Yasunori
• Utsugi Hiroshi

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B32B2307/714

  Inert, i.e. inert to chemical degradation, corrosion · CPC title

• B32B43/006 Primary

  Delaminating · CPC title

• B32B7/06

  permitting easy separation · CPC title

• B32B2307/7246

  Water vapor barrier · CPC title