Grinding machine

Patent metadata

Field	Value
Publication number	US-10173296-B2
Application number	US-201615751421-A
Country	US
Kind code	B2
Filing date	Sep 29, 2016
Priority date	Sep 30, 2015
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A grinding machine includes a rotatable spindle having a lower end to which a grindstone for grinding a wafer is attached; linear guides supporting the spindle slidably to a column; a spindle feeding mechanism feeding the spindle in a vertical direction; and constant-pressure feeding mechanism interposed between the spindle feeding mechanism and the column and suspending the spindle feeding mechanism. The constant-pressure feeding mechanism raises the spindle feeding mechanism in the vertical direction when a friction force acting on the grindstone is higher than a predetermined value.

First claim

What is claimed is:

1. A grinding machine comprising: a rotatable spindle having a lower end to which a grindstone for grinding a wafer is attached; at least two linear guides extending in a vertical direction for slidably supporting the spindle to a column, the linear guides being arranged around an outer periphery of the spindle such that a processing point at which the grindstone grinds the wafer is included therebetween; and a spindle feeding mechanism feeding the spindle downward in the vertical direction, the grinding machine processing the wafer with the grindstone while feeding the spindle in the vertical direction, wherein constant-pressure cylinders are provided, the constant-pressure cylinders being interposed between the spindle feeding mechanism and the column for suspending the spindle and the spindle feeding mechanism, wherein during grinding a driving pressure of the cylinders is set to be equal to or less than a predetermined value corresponding to a friction force acting on the grindstone when the spindle feeding mechanism causes the grindstone to cut into the wafer so that the grindstone cuts in by a critical cutting-in depth of the wafer, and raising the spindle and the spindle feeding mechanism during grinding when the driving pressure exceeds the predetermined value of the friction force.

2. The grinding machine according to claim 1 , wherein the constant-pressure cylinders are provided so as to interpose the spindle feeding mechanism at both sides of the spindle feeding mechanism in a horizontal direction perpendicular to the vertical direction, respectively.

3. The grinding machine according to claim 1 , wherein a feeding direction in which the spindle feeding mechanism feeds the spindle is arranged on a straight line passing along the vertical direction through the processing point at which the grindstone grinds the wafer.

4. The grinding machine according to claim 1 , wherein as the at least two linear guides, at least three linear guides are provided, and
a gravity of the spindle is arranged within a polygon formed by the linear guides in a plan view.

Assignees

• Tokyo Seimitsu Co Ltd
• Tokyo Seimitsu Co Ltd

Inventors

• Kanazawa Masaki
• Igarashi Kenji

Classifications

• B24B47/14

  by liquid or gas pressure (B24B47/16 takes precedence) · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B41/047

  Grinding heads for working on plane surfaces · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B49/08

  involving liquid or pneumatic means · CPC title