Methods and apparatus for reducing RF crossover coupling

Patent metadata

Field	Value
Publication number	US-10172231-B2
Application number	US-201615176940-A
Country	US
Kind code	B2
Filing date	Jun 8, 2016
Priority date	Jun 8, 2016
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

Systems, methods, and apparatus for reducing crossover coupling of two or more RF signals are described. In one case, a crossover structure is described where RF signals are routed through coplanar waveguides having a specific characteristic impedance and crossing at a central point of the crossover structure by way of a bridge. A ground shield having a geometry adapted to reduce the crossover coupling while minimally affecting capacitive coupling between the RF signals and the ground shield is introduced in-between a region comprising the central point. Further described is a multi-port rotary RF switch fitted with the crossover structure which allows substantially balanced electrical performance across all the operational states of the rotary RF switch at RF signal frequencies up to 40 GHz and beyond.

First claim

The invention claimed is:

1. An integrated circuit comprising:
a first non-conductive layer;
a first metal layer overlying the first non-conductive layer, the first metal layer comprising:
i) a ground return region of a substantially symmetrical shape with respect to a centerline of the ground return region, isolated from a remaining portion of the first metal layer;
ii) a first transmission line of a substantially symmetrical shape with respect to the centerline, formed within the ground return region, separated from the ground return region by a first transmission line fixed distance gap region along an entire length of the first transmission line; and
iii) a second transmission line of a substantially symmetrical shape with respect to the centerline, the second transmission line comprising a first segment and a last segment collinear with the first segment, the first segment and the last segment formed within the ground return region and separated from the ground return region respectively by a first segment fixed distance gap region and a last segment fixed distance gap region along entire lengths of the first and last segments, the first segment and the last segment separated from one another at a middle region of the second transmission line;

a second non-conductive layer overlying the first metal layer; and
a second metal layer comprising a middle segment of the second transmission line collinear with the first and last segments and electrically connected to the first and last segments through vias formed in the second non-conductive layer,
wherein:
the first transmission line and the second transmission line cross at the middle region of the second transmission line to form a symmetrical crossing pattern with respect to the centerline.

2. The integrated circuit according to claim 1 , further comprising:
a third non-conductive layer overlying the first metal layer and separating the first metal layer and the second non-conductive layer; and
a third metal layer overlying the third non-conductive layer and separating the third non-conductive layer and the second non-conductive layer, the third metal layer comprising a ground shield region isolated from a remaining portion of the third metal layer, the ground shield region having a symmetrical geometry with respect to the centerline of the ground return region, the ground shield region comprising:
a) a center region comprising two crossing lines crossing at the centerline of the ground return region, the crossing lines defining a symmetrical crossing pattern of the center region comprising four extremes away from the centerline; and
b) four regions of a substantially same geometry each connected to one of the four extremes of the symmetrical crossing pattern of the center region,

wherein:
the four regions are electrically connected to the ground return region through vias formed in the third non-conductive layer, and
projection of each of the four regions onto the ground return region clears regions of the first and the second transmission lines and respective fixed distance gap regions.

3. The integrated circuit according to claim 1 or claim 2 , wherein the first transmission line and the second transmission line are oriented at 90 degrees with respect to one another.

4. The integrated circuit according to claim 2 , wherein the substantially same geometry of the four regions of the ground shield region is a square region.

5. The integrated circuit according to claim 1 , wherein a width of the first transmission line and a width of the second transmission line is substantially a same width.

6. The integrated circuit according to claim 2 , wherein a width of the first transmission line and a width of the second transmission line is substantially a same width W T .

7. The integrated circuit according to claim 6 , wherein widths of the two crossing lines is substantially a same width W C .

8. The integrated circuit according to claim 7 , wherein the width W T is substantially equal to the width W C .

9. The integrated circuit according to claim 7 , wherein the width W T is substantially equal to two times the width W C .

10. The integrated circuit according to claim 7 , wherein the width W T is substantially equal to half the width W C .

11. The integrated circuit according to claim 1 , wherein the first transmission line and the first transmission line fixed distance gap region form a first coplanar waveguide, and the second transmission line, the first segment fixed distance gap region, and the last segment fixed distance gap region form a second coplanar waveguide.

12. The integrated circuit according to claim 2 , wherein the first transmission line and the first transmission line fixed distance gap region form a first coplanar waveguide, and the second transmission line, the first segment fixed distance gap region, and the last segment fixed distance gap region form a second coplanar waveguide.

13. The integrated circuit according to claim 12 , wherein the symmetrical geometry of the ground shield region is configured to control a signal coupling between the first and the second coplanar waveguides.

14. The integrated circuit according to claim 12 , wherein widths of the two crossing lines of the center region of the ground shield region are configured to control a signal coupling between the first and the second coplanar waveguides.

15. An integrated circuit comprising:
a first non-conductive layer;
a first metal layer overlying the first non-conductive layer, the first metal layer comprising:
i) a ground return region of a substantially symmetrical shape with respect to a centerline of the ground return region, isolated from a remaining portion of the first metal layer;
ii) a first transmission line of a substantially symmetrical shape with respect to the centerline, formed within the ground return region, separated from the ground return region by a fixed distance gap along a length of the first transmission line; and
iii) a second transmission line of a substantially symmetrical shape with respect to the centerline, formed within the ground return region, the second transmission line comprising a first segment and a last segment collinear with the first segment, the first segment and the last segment separated from the ground return region by the fixed distance gap along the length of the first and last segments, the first segment and the last segment separated from one another at a middle region of the second transmission line;

a second non-conductive layer overlying the first metal layer; and
a second metal layer comprising a middle segment of the second transmission linecollinear with the first and last segments and electrically connected to the first and last segments through vias formed in the second non-conductive layer,
wherein:
the first transmission line and the second transmission line cross at the middle region of the second transmission line to form a symmetrical crossing pattern with respect to the centerline, and
the integrated circuit further comprises:
a third non-conductive layer overlying the first metal layer and separating the first metal layer and the second non-conductive layer; and
a third metal layer overlying the third non-conductive layer and separating the third non-conductive layer and the second non-conductive layer, the third metal layer comprising a ground shield region isolated from a remaining portion of the third metal layer, the ground shield region having a symmetrical geometry with respect to the centerline of the ground return region, the ground shield region comprising:
a) a center regi

Assignees

• Psemi Corp

Inventors

• Horvath Gregory Louis
• Bacon Peter

Classifications

• H05K1/0228 Primary

  Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245) · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H01P1/127 Primary

  Strip line switches · CPC title

• H04B1/48

  in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter {(H04B1/46 takes precedence)} · CPC title

• H01P3/003

  Coplanar lines · CPC title