Electromagnetic-coupling-module-attached article

US10170934B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10170934-B2
Application numberUS-201514838417-A
CountryUS
Kind codeB2
Filing dateAug 28, 2015
Priority dateApr 26, 2006
Publication dateJan 1, 2019
Grant dateJan 1, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.

First claim

Opening claim text (preview).

What is claimed is: 1. An article comprising: a metal portion including at least one main surface; and a power supply circuit including a coil-shaped electrode; wherein the coil-shaped electrode of the power supply circuit is disposed adjacent to the at least one main surface of the metal portion such that a portion of the coil-shaped electrode overlaps the at least one main surface of the metal portion and another portion of the coil-shaped electrode does not overlap the at least one main surface of the metal portion when viewed in a direction perpendicular to the at least one main surface of the metal portion; the coil-shaped electrode is disposed on only one side of the at least one main surface of the metal portion; the coil-shaped electrode of the power supply circuit is magnetically coupled to the at least one main surface of the metal portion; and the metal portion is configured to perform at least one of transmitting a power supplied from the power supply circuit, and receiving a power and supplying the power to the power supply circuit. 2. The article according to claim 1 , wherein metal portion is a housing of a mobile device. 3. The article according to claim 1 , wherein the coil-shaped electrode is provided adjacent to an edge portion of the metal portion. 4. The article according to claim 3 , wherein a winding axis of the coil-shaped electrode is substantially perpendicular to the metal portion. 5. The article according to claim 4 , wherein the metal portion includes an opening, and the coil-shaped electrode is magnetically coupled to the opening.

Assignees

Inventors

Classifications

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • H02J50/12Primary

    of the resonant type · CPC title

  • the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object · CPC title

  • Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22) · CPC title

  • the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

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Frequently asked questions

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What does patent US10170934B2 cover?
An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via elec…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H02J50/12. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).