Antenna-in-package structures with broadside and end-fire radiations

Patent metadata

Field	Value
Publication number	US-10170838-B2
Application number	US-201514796062-A
Country	US
Kind code	B2
Filing date	Jul 10, 2015
Priority date	Sep 11, 2013
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

First claim

We claim:

1. A package structure, comprising:
an antenna package comprising a stack structure, wherein the stack structure comprises a plurality of substrates and metallization layers including a first metallization layer formed on a first surface of a first substrate, and a second metallization layer formed on first surface of a second substrate, wherein the first metallization layer comprises a first planar antenna and an ungrounded planar parasitic element disposed adjacent to the first planar antenna, and wherein the second metallization layer comprises a second planar antenna;
an RFIC (radio frequency integrated circuit) chip flip-chip mounted to the second metallization layer on the first surface of the second substrate of the antenna package;
a first antenna feed line which comprises metalized via holes that are formed through the plurality of substrates from the first surface of the second substrate to the first surface of the first substrate, wherein the first planar antenna is connected to the RFIC chip by the first antenna feed line;
a second antenna feed line formed as part of the second metallization layer on the first surface of the second substrate, wherein the second antenna feed line extends along the first surface of the second substrate to connect the second planar antenna to the RFIC chip;
wherein the first planar antenna is configured to receive or transmit broadside signals and the second planar antenna is configured to receive or transmit end-fire signals; and
wherein the ungrounded planar parasitic element is configured to reduce surface waves on the surface of the first substrate.

2. The package structure of claim 1 , wherein the ungrounded planar parasitic element comprises a parasitic patch element disposed adjacent to a critical edge of the first planar antenna.

3. The package structure of claim 1 , wherein the ungrounded planar parasitic element comprises a parasitic ring element that surrounds the first planar antenna.

4. The package structure of claim 1 , further comprising a third metallization layer disposed between the first and the second metallization layers, wherein the third metallization provides a dedicated ground plane.

5. The package structure of claim 4 , wherein the third metallization layer is formed on a second surface of the second substrate opposite the second metallization layer formed on the first surface of the second substrate.

6. The package structure of claim 1 , wherein the first planar antenna comprises a first square-shaped patch antenna element, wherein the first antenna feed line comprises a single-ended feed line and a differential feed line connected to the first square-shaped patch antenna element, wherein the RFIC chip is configured to utilize the first square-shaped patch antenna element to receive or transmit signals in the broadside direction.

7. The package structure of claim 6 , wherein first planar antenna comprises a second square-shaped patch antenna element, wherein the first antenna feed line comprises a single-ended feed line and a differential feed line connected to the second square-shaped patch antenna element, wherein the RFIC chip is configured to utilize the second square-shaped patch antenna element to receive or transmit signals in the broadside direction.

8. The package structure of claim 1 , wherein the first planar antenna comprises a first rectangular-shaped patch antenna element, a second rectangular-shaped patch antenna element, a third rectangular-shaped patch antenna element, and a fourth rectangular-shaped patch antenna element;
wherein the first and second rectangular-shaped patch antenna elements are each fed by separate single-ended antenna feed line portions of the first antenna feed line, and wherein the first and second rectangular-shaped patch antenna elements are oriented orthogonal to each other to receive broadside signals in different linear-polarized directions; and
wherein the third and fourth rectangular-shaped patch antenna elements are each fed by separate differential feed line portions of the first antenna feed line, wherein the third and fourth rectangular-shaped patch antenna elements are oriented orthogonal to each other to transmit broadside signals in different linear-polarized directions.

9. The package structure of claim 1 , further comprising a third metallization layer disposed between the first and the second metallization layers, wherein the third metallization provides a dedicated power plane.

10. The package structure of claim 1 , wherein the first metallization layer comprises one or more power supply patches to distribute a DC power supply voltage to the RFIC chip.

11. A wireless communications system comprising:
an application board; and
a package structure mounted to the application board;
wherein the package structure comprises:
an antenna package comprising a stack structure, wherein the stack structure comprises a plurality of substrates and metallization layers including a first metallization layer formed on a first surface of a first substrate, and a second metallization layer formed on first surface of a second substrate, wherein the first metallization layer comprises a first planar antenna and an ungrounded planar parasitic element disposed adjacent to the first planar antenna, and wherein the second metallization layer comprises a second planar antenna;
an RFIC (radio frequency integrated circuit) chip flip-chip mounted to the second metallization layer on the first surface of the second substrate of the antenna package;
a first antenna feed line which comprises metalized via holes that are formed through the plurality of substrates from the first surface of the second substrate to the first surface of the first substrate, wherein the first planar antenna is connected to the RFIC chip by the first antenna feed line;
a second antenna feed line formed as part of the second metallization layer on the first surface of the second substrate, wherein the second antenna feed line extends along the first surface of the second substrate to connect the second planar antenna to the RFIC chip;
wherein the first planar antenna is configured to receive or transmit broadside signals and the second planar antenna is configured to receive or transmit end-fire signals;
wherein the ungrounded planar parasitic element is configured to reduce surface waves on the surface of the first substrate; and
wherein at least a portion of the first surface of the second substrate is mounted to the application board such that the second planar antenna is disposed at a distance past an edge of the application board.

12. The wireless communications system of claim 11 , wherein the ungrounded planar parasitic element comprises a parasitic ring element that surrounds the first planar antenna.

13. The wireless communications system of claim 11 , wherein the ungrounded planar parasitic element comprises a parasitic patch element disposed adjacent to a critical edge of the first planar antenna.

14. The wireless communications system of claim 11 , where the package structure further comprises a third metallization layer disposed between the first and the second metallization layers, wherein the third metallization provides a dedicated ground plane.

15. The wireless communications system of claim 14 , wherein the third metallization layer is formed on a second surface of the second substrate opposite the second metallization layer formed on the first surface of the second substrate.

16. The wireless communications system of claim 11 , wherein the package structure further comprises a third metalliz

Assignees

• IBM

Inventors

• Garcia Alberto V
• Gu Xiaoxiong
• Liu Duixian

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title