Light emitting device with buffer pads

Patent metadata

Field	Value
Publication number	US-10170455-B2
Application number	US-201715658422-A
Country	US
Kind code	B2
Filing date	Jul 25, 2017
Priority date	Sep 4, 2015
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A light emitting device includes a carrier, a plurality of light emitting diode chips and a plurality of buffer pads. Each light emitting diode chip includes a first type semiconductor layer, an active layer, a second type semiconductor layer, a via hole and a plurality of bonding pads. The via hole sequentially penetrates through the first type semiconductor layer, the active layer and a portion of the second type semiconductor layer. The first type semiconductor layer, the active layer, the second type semiconductor layer and the via hole define a epitaxial structure. The buffer pads are disposed between the carrier and the second type semiconductor layer, wherein the buffer pads is with Young's modulus of 2˜10 GPa, the second bonding pad is disposed within the via hole to contact the second type semiconductor layer, and the epitaxial structure is electrically bonded to the receiving substrate through the bonding pads.

First claim

What is claimed is:

1. A light emitting device, comprising:
a carrier;
a plurality of light emitting diode chips, disposed on the carrier, wherein each light emitting diode chip comprises:
a first type semiconductor layer;
an active layer, disposed on the first type semiconductor layer;
a second type semiconductor layer, disposed on the active layer;
a via hole, sequentially penetrating through the first type semiconductor layer, the active layer and a portion of the second type semiconductor layer, wherein the first type semiconductor layer, the active layer, the second type semiconductor layer and the via hole define an epitaxial structure; and
a plurality of bonding pads, disposed between the epitaxial structure and a receiving substrate and comprising a first bonding pad electrically connected to the first type semiconductor layer and a second bonding pad electrically connected to the second type semiconductor layer; and

a plurality of buffer pads, located on the carrier and disposed between the carrier and the second type semiconductor layers of the epitaxial structures, wherein the buffer pads are with Young's modulus of 2˜10 GPa, the second bonding pad is disposed within the via hole to contact the second type semiconductor layer, and the epitaxial structures are electrically bonded to the receiving substrate through the bonding pads,
wherein an area of an orthogonal projection of each of the buffer pads on the carrier is 0.6 times to 1.2 times of an area of an orthogonal projection of the epitaxial structure on the carrier.

2. The light emitting device as claimed in claim 1 , wherein a material of the buffer pads is organic with Young's modulus of 2.9˜3.6 GPa.

3. The light emitting device as claimed in claim 2 , wherein the material of the buffer pads is organic with break elongation 5˜ 10 % and residual stress 30˜40 MPa.

4. The light emitting device as claimed in claim 1 , wherein the receiving substrate comprises a plurality of circuit electrodes, and the bonding pads are electrically connected to the circuit electrodes.

5. The light emitting device as claimed in claim 1 , wherein each light emitting diode chip further comprises:
an insulating layer, disposed on the first type semiconductor layer and a sidewall of the via hole, wherein the insulating layer forms a contact opening to expose the first type semiconductor layer and forms another opening in the via hole to expose the second type semiconductor layer, and the first bonding pad is disposed in the contact opening, the second bonding pad is disposed in another opening, and a portion of the insulating layer is located between a side wall of the via hole and the second bonding pad.

6. The light emitting device as claimed in claim 1 , wherein the receiving substrate comprises a plurality of sub-pixels, each of the epitaxial structures corresponds to one of the sub-pixels.

7. The light emitting device as claimed in claim 1 , wherein the receiving substrate comprises a plurality of light-obstructed structures, and the light-obstructed structures and the light emitting diode chips are arranged alternately.

8. The light emitting device as claimed in claim 7 , wherein a height of each light-obstructed structure is higher than a position of the active layer of the adjacent epitaxial structure.

9. The light emitting device as claimed in claim 1 , wherein the thickness of the second type semiconductor layer is 3 times to 15 times of a thickness of the active layer, and the thickness of the second type semiconductor layer is 10 times to 20 times of the thickness of the first type semiconductor layer.

10. The light emitting device as claimed in claim 1 , wherein in a vertical direction with respect to the carrier, each of the buffer pads and the epitaxial structure are conformal patterns.

11. The light emitting device as claimed in claim 1 , wherein the receiving substrate comprises a thin film transistor substrate, a complementary metal oxide semiconductor substrate, a printed circuit board substrate or a flexible substrate.

12. The light emitting device as claimed in claim 1 , wherein an orthogonal projection area of the first bonding pad on the receiving substrate is the same as an orthogonal projection area of the second bonding pad on the receiving substrate.

13. The light emitting device as claimed in claim 1 , wherein an orthogonal projection area of the first bonding pad on the receiving substrate is different from an orthogonal projection area of the second bonding pad on the receiving substrate.

Assignees

• Playnitride Inc

Inventors

• Lin Tzu-Yang
• Lai Yu-Hung
• Lo Yu-Yun

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07204

  using temporary auxiliary members, e.g. sacrificial coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title