Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
US10170400B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10170400-B2 |
| Application number | US-201515526578-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2015 |
| Priority date | Dec 16, 2014 |
| Publication date | Jan 1, 2019 |
| Grant date | Jan 1, 2019 |
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Official abstract text for this publication.
A multi-finger transistor includes a circuit suppressing a variation in voltage current distribution. The circuit connects gate fingers ( 21 ) to each other, or source fingers ( 31 ) to each other in a region which is located outside an active region ( 11 ) and on a side where a drain pad ( 42 ) is disposed. The multi-finger transistor is configured to be linearly symmetric with respect to a direction of propagation of a signal from a gate pad ( 22 ) at the position of the gate pad ( 22 ).
Opening claim text (preview).
The invention claimed is: 1. A multi-finger transistor comprising: a plurality of gate fingers arranged in an active region on a semiconductor substrate; a plurality of source fingers and a plurality of drain fingers which are alternately arranged in said active region in such a way as to sandwich said gate fingers therebetween, respectively; a gate pad disposed outside said active region, said gate fingers being connected to said gate pad via a gate bus; a source pad disposed in a region which is located outside said active region and on a side where said gate pad is disposed with respect to said active region, said source fingers being connected to said source pad; a drain pad disposed in a region which is located outside said active region and which is located at an opposite side of said gate pad across said active region, said drain fingers being connected to said drain pad; and a source via grounding said source pad, wherein said multi-finger transistor further comprises a circuit suppressing a variation in voltage current distribution, said circuit connecting said gate fingers to each other, or connecting said source fingers to each other with a resistive member having a resistance higher than said source fingers, in a region which is located outside said active region and on a side where said drain pad is disposed, and said multi-finger transistor is configured so as to be linearly symmetric with respect to a direction of propagation of a signal from said gate pad at a position of said gate pad. 2. A semiconductor device using the multi-finger transistor according to claim 1 .
Interconnections over air gaps, e.g. air bridges · CPC title
Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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