Resin sealing apparatus and resin sealing method

Patent metadata

Field	Value
Publication number	US-10170346-B2
Application number	US-201615078926-A
Country	US
Kind code	B2
Filing date	Mar 23, 2016
Priority date	Mar 23, 2015
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A lower mold has a bottom surface member and a side surface member. An upper end surface of the bottom surface member forms an inner bottom surface of a cavity and has a planar shape corresponding to an unusual planar shape of a sealing resin. A substrate is disposed on a mold surface of an upper mold such that a component to be sealed attached to the substrate faces downward, and the cavity is filled with a fluid resin. The upper mold and the lower mold are clamped, and the component is immersed in the fluid resin. The bottom surface member is raised, and the fluid resin is pressed at a prescribed resin pressure and cured to form the sealing resin. The bottom surface member and the side surface member are moved relatively, and thereby, a molded product is released from a mold surface of the lower mold.

First claim

The invention claimed is:

1. A resin sealing apparatus for providing resin sealing for a component to be sealed by a sealing resin which is cured in a cavity, comprising:
an upper mold on which a substrate is disposed, a component to be sealed being attached to the substrate;
a lower mold provided to face the upper mold;
a cavity provided at least in the lower mold;
a bottom surface member forming an inner bottom surface of the cavity;
a side surface member forming a side surface of the cavity;
an opening provided in the side surface member and corresponding to an outer circumference of the bottom surface member;
an opening circumferential edge portion provided in the side surface member and having an inner edge shape formed to correspond to an outer edge of an end surface planar shape, an end surface of the sealing resin having the end surface planar shape;
an inclined surface portion provided in the side surface member and inclined to expand upwardly from the opening circumferential edge portion,
a frame-like member provided to surround a mold having at least the upper mold and the lower mold;
a space surrounded by the frame-like member and including the cavity;
a seal member for shutting off the space from ambient air; and
a pressure reducing mechanism for reducing pressure of the space with the space being shut off from the ambient air, wherein
the side surface member is fitted to the outer circumference of the bottom surface member so as to be slidable on the outer circumference, and
during a period from when the space is shut off from the ambient air to when a step of clamping the upper mold and the lower mold is completed, the pressure of the space shut off from the ambient air is reduced by the pressure reducing mechanism.

2. The resin sealing apparatus according to claim 1 , further comprising:
a first vertical drive mechanism for moving up and down the side surface member; and
a second vertical drive mechanism for moving up and down the bottom surface member, wherein
in a process of opening the upper mold and the lower mold, the first vertical drive mechanism and the second vertical drive mechanism independently drive the side surface member and the bottom surface member, respectively, and thereby, the side surface member and the bottom surface member move relatively, and
the side surface member and the bottom surface member move relatively, and thereby, the sealing resin is released from a mold surface forming the cavity.

3. The resin sealing apparatus according to claim 2 , wherein
after a sealed substrate formed by resin sealing of the component to be sealed by the sealing resin is taken out, the first vertical drive mechanism and the second vertical drive mechanism independently drive the side surface member and the bottom surface member, respectively, and thereby, the side surface member and the bottom surface member move relatively, and
the side surface member and the bottom surface member move relatively, and thereby, a resin burr formed between the side surface member and the bottom surface member is discharged.

4. The resin sealing apparatus according to claim 1 , further comprising:
a communicating path provided in the lower mold and allowing a mold surface forming the cavity to communicate with an external space external to the lower mold; and
an opening formed, by the communicating path, in the mold surface forming the cavity.

5. The resin sealing apparatus according to claim 1 , further comprising
a cavity extension provided at a position and forming the end surface planar shape, the position being continuous to the inclined surface portion of the side surface member, and at the position, the side surface member and the bottom surface member are fitted to each other.

6. The resin sealing apparatus according to claim 1 , further comprising
a seal member provided in a circumferential surface of the outer circumference of the bottom surface member fitted to the side surface member, and having a closed shape when viewed in a plan view.

7. The resin sealing apparatus according to claim 1 , further comprising
a molding module having at least the upper mold and the lower mold, wherein
the molding module can be attached to and detached from another molding module.

8. A resin sealing apparatus for providing resin sealing for a component to be sealed by a sealing resin which is cured in a cavity, comprising:
an upper mold on which a substrate is disposed, a component to be sealed being attached to the substrate;
a lower mold provided to face the upper mold;
a cavity provided at least in the lower mold;
a bottom surface member forming an inner bottom surface of the cavity;
a side surface member forming a side surface of the cavity;
an opening provided in the side surface member and corresponding to an outer circumference of the bottom surface member;
an opening circumferential edge portion provided in the side surface member and having an inner edge shape formed to correspond to an outer edge of an end surface planar shape, an end surface of the sealing resin having the end surface planar shape;
an inclined surface portion provided in the side surface member and inclined to expand upwardly from the opening circumferential edge portion,
a frame-like member provided to surround a mold having at least the upper mold and the lower mold;
a space surrounded by the frame-like member and including the cavity;
a seal member for shutting off the space from ambient air; and
a pressure reducing mechanism for reducing pressure of the space with the space being shut off from the ambient air, wherein
the side surface member being fitted to the outer circumference of the bottom surface member so as to be slidable on the outer circumference, and
during a period from when the space is shut off from the ambient air to when a step of clamping the upper mold and the lower mold is completed, the pressure of the space shut off from the ambient air is reduced by the pressure reducing mechanism.

9. The resin sealing apparatus according to claim 8 , further comprising:
a first vertical drive mechanism for moving up and down the side surface member; and
a second vertical drive mechanism for moving up and down the bottom surface member, wherein
in a process of opening the upper mold and the lower mold, the first vertical drive mechanism and the second vertical drive mechanism independently drive the side surface member and the bottom surface member, respectively, and thereby, the side surface member and the bottom surface member move relatively, and
the side surface member and the bottom surface member move relatively, and thereby, the sealing resin is released from a mold surface forming the cavity.

10. The resin sealing apparatus according to claim 9 , wherein
after a sealed substrate formed by resin sealing of the component to be sealed by the sealing resin is taken out, the first vertical drive mechanism and the second vertical drive mechanism independently drive the side surface member and the bottom surface member, respectively, and thereby, the side surface member and the bottom surface member move relatively, and
the side surface member and the bottom surface member move relatively, and thereby, a resin burr formed between the side surface member and the bottom surface member is discharged.

11. The resin sealing apparatus according to claim 8 , further comprising:
a communicating path provided in the lower mold and allowing a mold surface forming the cavity to communicate with an external space external to the lower mold; and
an opening formed, by the communicating path, in the mold surface forming the cavity.

12

Assignees

• Towa Corp

Inventors

• Onishi Yohei
• Taka Takeaki

Classifications

• H10W74/016

  using moulds · CPC title

• H10P72/0441 Primary

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• B29C43/36

  Moulds for making articles of definite length, i.e. discrete articles · CPC title

• B29C2043/181

  encapsulated · CPC title

• H01L21/67126 Primary

  Electricity · mapped topic