Conductive substrate, conductive substrate laminate, method for producing conductive substrate, and method for producing conductive substrate laminate

Patent metadata

Field	Value
Publication number	US-10168842-B2
Application number	US-201515114591-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Jan 31, 2014
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A conductive substrate includes a transparent base material; a metal layer formed on at least one of surfaces of the transparent base material; and a blackened layer formed on the metal layer by a wet method.

First claim

The invention claimed is:

1. A conductive substrate, comprising:
a transparent base material;
an adhesion layer; wherein the adhesive layer comprises an Ni—Cu alloy and oxygen, and a first surface of the adhesion layer formed on at least one of surfaces of the transparent base material;
a metal layer; wherein a first surface of the metal layer formed on a second surface of the adhesion layer;
a blackened layer formed on a second surface of the metal layer by a wet method.

2. The conductive substrate as claimed in claim 1 , wherein the metal layer and the blackened layer have patterns formed.

3. A conductive substrate laminate, comprising:
a plurality of the conductive substrates as claimed in claim 1 that are stacked.

4. A method for producing a conductive substrate, the method comprising:
a metal layer forming process for forming a metal layer on at least one of surfaces of a transparent base material;
a blackened layer forming process for forming a blackened layer on the metal layer by a wet method; and
an adhesion layer forming process for forming an adhesion layer on at least one of the surfaces of the transparent base material, by dry plating, and formed between the transparent base material and the metal layer, wherein the adhesive layer comprises an Ni—Cu alloy and oxygen.

5. The method for producing the conductive substrate as claimed in claim 4 , the method further comprising:
a patterning process for forming patterns on the metal layer and the blackened layer.

6. A method for producing a conductive substrate laminate, the method comprising:
a stacking process for stacking a plurality of the conductive substrates that have been obtained by the method for producing the conductive substrate as claimed in claim 4 .

7. A conductive substrate laminate, comprising:
a plurality of the conductive substrates as claimed in claim 2 that are stacked.

8. A method for producing a conductive substrate laminate, the method comprising:
a stacking process for stacking a plurality of the conductive substrates that have been obtained by the method for producing the conductive substrate as claimed in claim 5 .

Assignees

• Sumitomo Metal Mining Co

Inventors

• Hata Hiroki
• Shiga Daiki
• Suda Takahiro
• Nishiyama Yoshihide

Classifications

• H01B5/14

  comprising conductive layers or films on insulating-supports · CPC title

• H01B1/02

  mainly consisting of metals or alloys · CPC title

• B32B2255/06

  on metal layer · CPC title

• C23C14/025

  Metallic sublayers · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title