Method and device for electroplating in cylindrical geometry

US10167565B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10167565-B2
Application numberUS-201414783553-A
CountryUS
Kind codeB2
Filing dateMar 25, 2014
Priority dateApr 10, 2013
Publication dateJan 1, 2019
Grant dateJan 1, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method and device for electrodeposition in cylindrical geometry. A method for electrochemically depositing a thin layer on a flexible substrate, comprising: providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second, the flexible substrate forming a first electrode, providing, in the electrolysis bath, a second electrode, and applying a potential difference between the first electrode and the second electrode in order to electrodeposit the thin layer on the flexible substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for plating a thin layer on a flexible substrate, by electrochemistry, comprising: providing, in an electrolytic bath, a first closed cylinder inside a second hollow cylinder, the electrolytic bath being filled with an electrolytic solution, the electrolytic solution being comprised in a volume delimited between the first cylinder and the second cylinder, applying the flexible substrate on one surface among an outer surface of the first cylinder and an inner surface of the second cylinder, said flexible substrate forming a first electrode, providing, in said electrolytic bath, at least one second electrode, and applying a potential difference between the first electrode and the second electrode to electroplate the thin layer on the flexible substrate. 2. The method of claim 1 , further comprising: rotating the first cylinder around an axis thereof during electroplating. 3. The method of claim 1 , further comprising: rotating the second electrode. 4. The method of claim 1 , further comprising: providing said first, closed cylinder coaxial, being with said second, hollow cylinder. 5. The method of claim 1 , wherein another surface among the outer surface of the first cylinder and the inner surface of the second cylinder is the second electrode. 6. The method of claim 1 , further comprising: providing a second soluble electrode. 7. The method of claim 1 , further comprising: applying the flexible substrate on the outer surface of the first cylinder, and providing a mobile carrier arm connected to the first cylinder. 8. The method of claim 7 , further comprising: displacing the first cylinder from the electrolytic bath in the second cylinder to at least one tank in a third cylinder. 9. The method of claim 7 , further comprising: moving the first cylinder towards an annealing enclosure.

Assignees

Inventors

Classifications

  • Agitating of electrolytes; Moving of racks · CPC title

  • Electrodes {, e.g. composition, counter electrode} · CPC title

  • Suspending or supporting devices for articles to be coated · CPC title

  • Contacting devices · CPC title

  • by heat-treatment · CPC title

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What does patent US10167565B2 cover?
A method and device for electrodeposition in cylindrical geometry. A method for electrochemically depositing a thin layer on a flexible substrate, comprising: providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second, the f…
Who is the assignee on this patent?
Electricite De France, Centre Nat Rech Scient
What technology area does this patent fall under?
Primary CPC classification C25D5/10. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).