Lightweight wall repair compounds

US10167381B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10167381-B2
Application numberUS-201715625382-A
CountryUS
Kind codeB2
Filing dateJun 16, 2017
Priority dateJun 13, 2008
Publication dateJan 1, 2019
Grant dateJan 1, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.

First claim

Opening claim text (preview).

What is claimed is: 1. A wall repair compound, comprising, from about 20 percent to about 80 percent by weight aqueous latex binder emulsion that comprises an acrylic binder with a glass transition temperature from about 15° C. to about 35° C.; from about 20 percent to about 70 percent by weight of an inorganic filler system that comprises substantially spherical synthetic particles that are glass bubbles; and, reinforcing fibers. 2. The compound of claim 1 wherein the inorganic filler system is a synthetic inorganic filler system that comprises substantially spherical synthetic particles and wherein the particles comprise a set of relatively large diameter glass bubbles and a set of relatively small ceramic microspheres, and wherein the median particle size of the glass bubbles is in the range of from about 30 microns to about 65 microns and the median particle size of the ceramic microspheres is in the range of from about 2 microns to about 10 microns. 3. The compound of claim 2 wherein the weight ratio of the glass bubbles to the ceramic microspheres is from about 1:1 to about 3:1. 4. The compound of claim 1 wherein the synthetic inorganic filler comprises less than about 0.5 percent by weight crystalline material. 5. The compound of claim 1 wherein the inorganic filler system comprises from about 30 percent to about 60 percent by weight of the compound. 6. The compound of claim 1 wherein the inorganic filler system comprises from about 40 percent to about 50 percent by weight of the compound. 7. The compound of claim 1 wherein the compound comprises one or more glycol ether smoothing agents in an amount of at most about 2.5 percent by weight. 8. The compound of claim 1 wherein the aqueous latex binder emulsion comprises an acrylic binder with a glass transition temperature of between 20° C. and 30° C. 9. The compound of claim 1 wherein the compound comprises less than about 0.10 percent by weight of organic polymeric thickener. 10. The compound of claim 1 wherein the compound comprises less than about 0.05 percent by weight of organic polymeric thickener. 11. The compound of claim 1 wherein the compound comprises less than about 0.1 percent by weight of inorganic thickening filler clay. 12. The compound of claim 1 wherein the compound comprises less than about 0.1 percent by weight of low molecular weight polyhydroxy additive. 13. The compound of claim 1 wherein the aqueous latex binder emulsion comprises from about 30 percent by weight to about 70 percent by weight of the compound. 14. The compound of claim 1 wherein the aqueous latex binder emulsion comprises from about 40 percent by weight to about 60 percent by weight of the compound. 15. The compound of claim 1 further comprising from about 0.1 percent to about 0.8 percent by weight of preservative. 16. The compound of claim 1 further comprising one or more dust reducing additives chosen from the group consisting of oils, waxes and mixtures thereof. 17. The compound of claim 1 with the proviso that the compound does not include any dust reducing additives chosen from the group consisting of oils, waxes and mixtures thereof.

Assignees

Inventors

Classifications

  • as filling material for cavities or the like · CPC title

  • Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59 · CPC title

  • characterized by their specific function · CPC title

  • Grouts, e.g. injection mixtures for cables for prestressed concrete · CPC title

  • C08K7/28Primary

    Glass · CPC title

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What does patent US10167381B2 cover?
Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such …
Who is the assignee on this patent?
3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification C08K7/28. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).