Oxidied and coated articles and methods of making same

Patent metadata

Field	Value
Publication number	US-10165699-B2
Application number	US-201515518522-A
Country	US
Kind code	B2
Filing date	Jan 28, 2015
Priority date	Jan 28, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

One example provides a method of manufacturing. The method comprises oxidizing, using plasma, a first surface of a substrate comprising a metal-material. The method further comprises cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface. The method further comprises disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.

First claim

What is claimed:

1. A method of manufacturing, comprising:
oxidizing, using plasma, a first surface of a substrate comprising a metal-material;
cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface;
disposing a functional coating or a powder coating layer over the oxidized first surface; and
disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.

2. The method of claim 1 , wherein the method comprises at least one of the following:
the oxidizing involving micro-arc oxidation; and
the cutting involving diamond cutting.

3. The method of claim 1 , before the oxidizing, further comprising forming the substrate by at least one of computer numerical control machining and forging.

4. The method of claim 1 , before the oxidizing, further comprising pre-treating the first surface using at least one of degreasing and surface activation.

5. The method of claim 1 , after the cutting, further comprising disposing, using electrostatic spray deposition, the powder coating layer over the oxidized first surface.

6. The method of claim 1 , further comprising disposing the functional coating over the oxidized first surface, the functional coating comprising at least one polymer selected from the group consisting of polystyrene, polyimide, polyarelene ether, polyurethane, methylsilsesquioxane, polyethylene, polystyrene silicone, butyl rubber, polyamide, polycarbonate, styrene-butadiene rubber, polyacrylate, epoxy, and fluoropolymer.

7. The method of claim 1 , before the disposing, further comprising:
de-greasing at least the second surface of the substrate;
rinsing at least the de-greased second surface;
chemically polishing at least the rinsed second surface;
rinsing at least the chemically polished second surface;
de-smutting at least the rinsed second surface; and
ultrasonically cleaning at least the de-smutted second surface.

8. The method of claim 1 , further comprising:
rinsing at least the coated second surface of the substrate; and
dehydrating at least the rinsed coated second surface.

9. The method of claim 1 , wherein the coating layer comprises at least one of polyacrylic, epoxy, and nanoparticles.

10. The method of claim 1 , wherein the metal material comprises at least one of aluminium, magnesium, lithium, zinc, titanium, niobium, iron, copper, an alloy of any of the foregoing, and a combination of any of the foregoing.

11. A method of manufacturing, comprising:
making a portion of a housing of an electronic device having an electrical circuit, wherein the making comprises:
oxidizing, using micro-arc oxidation, a first surface of a substrate comprising a metal-material;
cutting, using diamond cutting, into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface; and
disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form the portion having the oxidized first surface and the coated second surface;
disposing a functional coating or a powder coating layer over the oxidized first surface; and

assembling the electrical circuit with the housing, the housing external to the electrical circuit.

12. The method of claim 11 , wherein the functional coating comprises polyurethane.

13. The method of claim 11 , wherein the powder coating layer includes a powder comprising at least one of epoxy, poly(vinyl chloride), polyamide, polyester, polyurethane, and polyacrylic.

14. An electronic device, comprising:
an electrical circuit; and
a housing external to the electrical circuit, a portion of the housing comprising a substrate having:
a core layer comprising a metal material;
an oxide layer disposed over a first surface of the core layer, the oxide is a micro-arc oxide of the metal material; and
a functional coating disposed over the oxide layer, the functional coating comprising a polymer;
an edge of the substrate having a non-oxidized second surface not parallel to the first surface, the second surface cut by diamond cutting and having thereon an electrophoretically deposited coating layer comprising at least one of polyacrylic, epoxy, and nanoparticles.

15. The electronic device of claim 14 , wherein the substrate has a pencil hardness of between about 6 H and about 9 H.

Assignees

• Hewlett Packard Development Co

Inventors

• Kashyap Chalam
• Wu Kuan-Ting

Classifications

• C25D11/26

  of refractory metals or alloys based thereon · CPC title

• H05K5/04 Primary

  Metal casings · CPC title

• C23C28/00 Primary

  Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D · CPC title

• C25D11/04

  of aluminium or alloys based thereon · CPC title

• C25D11/34

  of metals or alloys not provided for in groups C25D11/04 - C25D11/32 · CPC title