Power tube connection structure of power amplifier and power amplifier

Patent metadata

Field	Value
Publication number	US-10165687-B2
Application number	US-201715676352-A
Country	US
Kind code	B2
Filing date	Aug 14, 2017
Priority date	Feb 15, 2015
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A power tube connection structure includes a substrate, a printed circuit board, and a power tube, where a through groove allowing the power tube to pass through is cut into the printed circuit board, a mounting groove is cut into the upper surface of the substrate at a location corresponding to the through groove, one end of the power tube extends through the through groove, and is welded onto a bottom face of the mounting groove, the end of the power tube that extends into the mounting groove abuts onto a side wall of the mounting groove close to an output end of the power amplifier, and a solder flux escape channel is made into the side wall of the mounting groove close to the output end of the power amplifier.

First claim

What is claimed is:

1. A power tube connection structure of a power amplifier, comprising:
a substrate;
a printed circuit board covering an upper surface of the substrate; and
a power tube;
wherein the printed circuit board comprises a through groove configured to allow the power tube to pass through;
wherein the substrate comprises a mounting groove cut into the upper surface of the substrate at a location that corresponds to the through groove;
wherein one end of the power tube extends through the through groove, is welded to a bottom face of the mounting groove, and abuts a side wall of the mounting groove;
wherein the mounting groove comprises a solder flux escape channel disposed in the side wall of the mounting groove;
wherein the solder flux escape channel comprises a first opening disposed in the side wall of the mounting groove;
wherein there is a gap between an inner wall of the through groove in the printed circuit board and an outer wall of the power tube;
wherein the first opening is a semi-circular opening perpendicular to the bottom face of the mounting groove.

2. The power tube connection structure according to claim 1 , wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

3. The power tube connection structure according to claim 1 , wherein the printed circuit board comprises a second opening at a location that corresponds to the first opening.

4. The power tube connection structure according to claim 3 , wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

5. The power tube connection structure according to claim 1 , wherein the side wall of the mounting groove comprises a side push hole perpendicular to the bottom face of the mounting groove.

6. The power tube connection structure according to claim 1 , further comprising: multiple protruding supports disposed in one plane on the bottom face of the mounting groove, wherein a height difference between the protruding supports and the bottom face of the mounting groove is in the range of 0.1-0.2 mm.

7. The power tube connection structure according to claim 6 , wherein the multiple protruding supports comprise four protruding supports, wherein two protruding supports of the four protruding supports are disposed at a location corresponding to an output end of the power amplifier, and the other two protruding supports of the four protruding supports are disposed at a location corresponding to an input end of the power amplifier.

8. A power amplifier, comprising a power tube connection structure, the power tube connection structure comprising:
a substrate;
a printed circuit board covering an upper surface of the substrate; and
a power tube;
wherein the printed circuit board comprises a through groove configured to allow the power tube to pass through;
wherein the substrate comprises a mounting groove cut into the upper surface of the substrate at a location that corresponds to the through groove;
wherein one end of the power tube extends through the through groove, is welded to a bottom face of the mounting groove, and abuts a side wall of the mounting groove;
wherein the mounting groove comprises a solder flux escape channel disposed in the side wall of the mounting groove;
wherein the solder flux escape channel comprises a first opening disposed in the side wall of the mounting groove;
wherein there is a gap between an inner wall of the through groove in the printed circuit board and an outer wall of the power tube;
wherein the first opening is a semi-circular opening perpendicular to the bottom face of the mounting groove.

9. The power amplifier according to claim 8 , wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

10. The power amplifier according to claim 8 ,
wherein the printed circuit board comprises a second opening at a location that corresponds to the first opening.

11. The power amplifier according to claim 10 , wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

12. The power amplifier according to claim 8 , wherein the side wall of the mounting groove comprises a side push hole perpendicular to the bottom face of the mounting groove.

13. The power amplifier according to claim 8 , wherein the power tube connection structure further comprises: multiple protruding supports disposed in one plane on the bottom face of the mounting groove, wherein a height difference between the protruding supports and the bottom face of the mounting groove is in the range of 0.1-0.2 mm.

14. The power amplifier according to claim 13 , wherein the multiple protruding supports comprise four protruding supports, wherein two protruding supports of the four protruding supports are disposed at a location corresponding to an output end of the power amplifier, and the other two protruding supports of the four protruding supports are disposed at a location corresponding to an input end of the power amplifier.

Assignees

• Huawei Tech Co Ltd

Inventors

• Li Songlin
• Tian Pengbo
• Wang Qingyun
• Xu Liang

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• H05K1/183 Primary

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K2203/1178

  Means for venting or for letting gases escape · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title