Headphone

Patent metadata

Field	Value
Publication number	US-10165351-B2
Application number	US-201615292796-A
Country	US
Kind code	B2
Filing date	Oct 13, 2016
Priority date	Jan 27, 2016
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A headphone is provided. The headphone includes a housing, a first speaker and a second speaker. The housing includes a sound output side, a first layer structure, a first output path, a first trench, a first recess, and a second recess. The first speaker is disposed in the first recess, wherein the first speaker includes a first speaker orientation, and the first speaker orientation corresponds to the first output path. The second speaker is disposed in the second recess. The first output path includes the first trench, which is located at the first layer structure, that extends around the first speaker, and is connected to the sound output side.

First claim

What is claimed is:

1. A headphone, comprising:
a housing, comprising a sound output side, a first layer structure, a first output path, a first trench, a first recess and a second recess;
a first speaker, disposed in the first recess, wherein the first speaker comprises a first speaker orientation, a first inclined surface, and the first speaker orientation corresponds to the first output path; and
a second speaker, disposed in the second recess,
wherein the first output path comprises the first trench,
wherein the first trench is located at the first layer structure, that extends around the first speaker, and is connected to the sound output side;
wherein the housing further comprises a second output path, the first speaker comprises a second speaker orientation, and the second speaker orientation corresponds to the second output path, and
wherein the housing further comprises a second layer structure and a cover structure and the first recess and the second recess are disposed in the second layer structure, wherein the first speaker is disposed in the first recess and is in contact with the first inclined surface and the first speaker orientation corresponds to the first output path, wherein the first speaker orientation corresponds to the first output path.

2. The headphone as claimed in claim 1 , further comprising a crossfeed speaker, wherein the crossfeed speaker comprises a crossfeed speaker surface, the crossfeed speaker surface corresponds to a crossfeed output path, and the first speaker, the second speaker and the crossfeed speaker are disposed between the first and second layer structures.

3. The headphone as claimed in claim 2 , wherein the housing further comprises a third output path and a fourth output path, the second speaker comprises a third speaker surface and a fourth speaker orientation, the first speaker and the second speaker are arranged at a tilt, the third and fourth speaker orientation respectively correspond to the third and fourth output path, and the lengths of the first and the third output paths are respectively longer than the lengths of the second and the fourth output paths.

4. The headphone as claimed in claim 3 , wherein the second layer structure comprises a third recess, the first recess comprises the first inclined surface, the second recess comprises a second inclined surface, the first speaker in the first recess is in contact with the first inclined surface, the second speaker in the second recess is in contact with the second inclined surface, and the crossfeed speaker is disposed in the third recess.

5. The headphone as claimed in claim 4 , wherein the first speaker, the second speaker and the crossfeed speaker are respectively attached in the first recess, the second recess and the third recess by magnetic force.

6. The headphone as claimed in claim 4 , wherein the crossfeed output path extends between the second layer structure and the cover structure, and passes the second layer structure and the first layer structure to the sound output side, and the second layer structure comprises an opening portion, a second trench and a first through hole, the opening portion corresponds to the crossfeed speaker, the second trench communicates with the opening portion and the first through hole, and the crossfeed output path extends along the opening portion, the second trench and the first through hole, and leaves the second layer structure.

7. The headphone as claimed in claim 6 , wherein the first layer structure comprises a second through hole, the second through hole corresponds to the first through hole, and the crossfeed output path travels from the second layer structure, passing the first layer structure to the sound output side along the first through hole and the second through hole.

8. The headphone as claimed in claim 6 , wherein the first layer structure comprises a third through hole, the third through hole is connected to the first trench, and the first output path travels along the first trench and the third through hole to leave the first layer structure.

9. The headphone as claimed in claim 8 , wherein the first layer structure further comprises a third trench and a fourth through hole, the third trench extends around the second speaker and is connected to the fourth through hole, and the third output path travels along the third trench and the fourth through hole to leave the first layer structure.

10. The headphone as claimed in claim 9 , wherein at least a portion of the third trench extends around the first speaker.

11. The headphone as claimed in claim 10 , wherein the third through hole is adjacent to the fourth through hole.

12. The headphone as claimed in claim 11 , wherein the second through hole is located between the first speaker and the second speaker.

13. The headphone as claimed in claim 12 , wherein the first speaker is located between the second through hole and the third through hole.

14. The headphone as claimed in claim 13 , wherein the first trench comprises a comb-shaped portion, the comb-shaped portion, the second through hole, the third through hole and the fourth through hole are arranged around the first speaker.

15. The headphone as claimed in claim 6 , wherein the second output path extends in the first layer structure and passes through the first layer structure to the sound output side.

16. The headphone as claimed in claim 6 , wherein the cover structure comprises a sound chamber, the sound chamber communicates with the opening portion and the second trench, the crossfeed output path extends along the opening portion, the sound chamber, the second trench and the first through hole, and leaves the second layer structure.

17. The headphone as claimed in claim 2 , wherein the first speaker provides a low pitch sound, the second speaker provides a high pitch sound, the crossfeed speaker provides a crossfeed sound, and the crossfeed sound is synthesized by the low pitch sound and the high pitch sound.

18. The headphone as claimed in claim 2 , wherein the sound output side has a sound field center, and the sound field center is located in front of an ear canal.

19. The headphone as claimed in claim 17 , wherein the crossfeed sound is combined by the high pitch sound and the low pitch sound by an electronic sound filter.

Assignees

• Sintai Optical Shenzhen Co Ltd
• Asia Optical Int Ltd

Inventors

• Imai Naofumi
• Karasawa Takayuki
• Takahashi Tomoya

Classifications

• H04R5/033

  Headphones for stereophonic communication {(details thereof, e.g. relating to batteries, cables or control elements H04R1/10)} · CPC title

• H04R2205/022

  Plurality of transducers corresponding to a plurality of sound channels in each earpiece of headphones or in a single enclosure · CPC title

• H04R1/323

  for loudspeakers (H04R1/34 and H04R1/40 take precedence) · CPC title

• H04R1/26

  Spatial arrangements of separate transducers responsive to two or more frequency ranges · CPC title

• H04R1/2857

  for loudspeaker transducers · CPC title